SG10202009513YA - Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate - Google Patents

Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate

Info

Publication number
SG10202009513YA
SG10202009513YA SG10202009513YA SG10202009513YA SG10202009513YA SG 10202009513Y A SG10202009513Y A SG 10202009513YA SG 10202009513Y A SG10202009513Y A SG 10202009513YA SG 10202009513Y A SG10202009513Y A SG 10202009513YA SG 10202009513Y A SG10202009513Y A SG 10202009513YA
Authority
SG
Singapore
Prior art keywords
substrate
polishing
thickness map
polishing apparatus
creating thickness
Prior art date
Application number
SG10202009513YA
Inventor
Watanabe Katsuhide
Shiokawa Yoichi
Yagi Keita
Nakamura Akira
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202009513YA publication Critical patent/SG10202009513YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
SG10202009513YA 2019-10-03 2020-09-25 Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate SG10202009513YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019182848A JP7341022B2 (en) 2019-10-03 2019-10-03 Substrate polishing equipment and film thickness map creation method

Publications (1)

Publication Number Publication Date
SG10202009513YA true SG10202009513YA (en) 2021-05-28

Family

ID=75273861

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202009513YA SG10202009513YA (en) 2019-10-03 2020-09-25 Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate

Country Status (6)

Country Link
US (1) US11833636B2 (en)
JP (1) JP7341022B2 (en)
KR (1) KR20210040267A (en)
CN (1) CN112692717A (en)
SG (1) SG10202009513YA (en)
TW (1) TW202114821A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022108789A (en) * 2021-01-14 2022-07-27 株式会社荏原製作所 Polishing device, polishing method, and method for outputting visualized information on film thickness distribution of base plate

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240552A (en) * 1991-12-11 1993-08-31 Micron Technology, Inc. Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection
US6159073A (en) 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
SG86415A1 (en) * 1999-07-09 2002-02-19 Applied Materials Inc Closed-loop control of wafer polishing in a chemical mechanical polishing system
EP1618991B1 (en) * 2000-05-19 2008-01-09 Applied Materials, Inc. Polishing pad
JP2002086351A (en) * 2000-06-30 2002-03-26 Ebara Corp Polishing device
TW541425B (en) * 2000-10-20 2003-07-11 Ebara Corp Frequency measuring device, polishing device using the same and eddy current sensor
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
JP4790475B2 (en) 2006-04-05 2011-10-12 株式会社荏原製作所 Polishing apparatus, polishing method, and substrate film thickness measurement program
TWI496661B (en) * 2010-04-28 2015-08-21 Applied Materials Inc Automatic generation of reference spectra for optical monitoring
US20130065493A1 (en) * 2011-08-09 2013-03-14 Taro Takahashi Polishing monitoring method, polishing end point detection method, and polishing apparatus
JP5705093B2 (en) * 2011-11-21 2015-04-22 株式会社荏原製作所 Polishing end point detection method and polishing apparatus
JP2013222856A (en) 2012-04-17 2013-10-28 Ebara Corp Polishing device and polishing method
US20140030956A1 (en) * 2012-07-25 2014-01-30 Jimin Zhang Control of polishing of multiple substrates on the same platen in chemical mechanical polishing
US8992286B2 (en) * 2013-02-26 2015-03-31 Applied Materials, Inc. Weighted regression of thickness maps from spectral data
JP6195754B2 (en) * 2013-07-19 2017-09-13 株式会社荏原製作所 Polishing apparatus and polishing state monitoring method
TWI635929B (en) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 Polishing apparatus and polished-state monitoring method
JP6140051B2 (en) * 2013-10-23 2017-05-31 株式会社荏原製作所 Polishing method and polishing apparatus
US9754846B2 (en) 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
US9911664B2 (en) 2014-06-23 2018-03-06 Applied Materials, Inc. Substrate features for inductive monitoring of conductive trench depth
JP6377459B2 (en) * 2014-08-29 2018-08-22 株式会社ディスコ Wafer inspection method, grinding and polishing equipment
KR101625459B1 (en) * 2015-02-27 2016-05-30 주식회사 케이씨텍 Chemical mechanical polishing apparatus and method thereof
TWI784719B (en) 2016-08-26 2022-11-21 美商應用材料股份有限公司 Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product
JP6985107B2 (en) * 2017-11-06 2021-12-22 株式会社荏原製作所 Polishing method and polishing equipment

Also Published As

Publication number Publication date
CN112692717A (en) 2021-04-23
TW202114821A (en) 2021-04-16
KR20210040267A (en) 2021-04-13
US11833636B2 (en) 2023-12-05
US20210101250A1 (en) 2021-04-08
JP2021058940A (en) 2021-04-15
JP7341022B2 (en) 2023-09-08

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