SG11202008881QA - Consumable part monitoring in chemical mechanical polisher - Google Patents

Consumable part monitoring in chemical mechanical polisher

Info

Publication number
SG11202008881QA
SG11202008881QA SG11202008881QA SG11202008881QA SG11202008881QA SG 11202008881Q A SG11202008881Q A SG 11202008881QA SG 11202008881Q A SG11202008881Q A SG 11202008881QA SG 11202008881Q A SG11202008881Q A SG 11202008881QA SG 11202008881Q A SG11202008881Q A SG 11202008881QA
Authority
SG
Singapore
Prior art keywords
chemical mechanical
consumable part
mechanical polisher
part monitoring
monitoring
Prior art date
Application number
SG11202008881QA
Other languages
English (en)
Inventor
Thomas H Osterheld
Dominic J Benvegnu
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11202008881QA publication Critical patent/SG11202008881QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B24B49/186—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools taking regard of the wear of the dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computational Linguistics (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Software Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • General Health & Medical Sciences (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG11202008881QA 2018-03-13 2019-03-06 Consumable part monitoring in chemical mechanical polisher SG11202008881QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862642450P 2018-03-13 2018-03-13
PCT/US2019/021044 WO2019177841A1 (en) 2018-03-13 2019-03-06 Consumable part monitoring in chemical mechanical polisher

Publications (1)

Publication Number Publication Date
SG11202008881QA true SG11202008881QA (en) 2020-10-29

Family

ID=67905025

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008881QA SG11202008881QA (en) 2018-03-13 2019-03-06 Consumable part monitoring in chemical mechanical polisher

Country Status (8)

Country Link
US (2) US11571786B2 (zh)
EP (1) EP3765238A4 (zh)
JP (2) JP7356996B2 (zh)
KR (1) KR20200120960A (zh)
CN (2) CN111936267B (zh)
SG (1) SG11202008881QA (zh)
TW (1) TWI806985B (zh)
WO (1) WO2019177841A1 (zh)

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JP2020131353A (ja) * 2019-02-19 2020-08-31 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
DE112019006999T5 (de) * 2019-03-08 2021-12-09 Mitsubishi Electric Corporation Inspektionsverfahren für eine rotierende elektrische maschine, rotierende elektrische maschine, sowie inspektionssystem für eine rotierende elektrische maschine
US20220270939A1 (en) * 2021-02-25 2022-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for controlling chemical mechanical planarization
US11710228B2 (en) 2021-03-05 2023-07-25 Applied Materials, Inc. Detecting an excursion of a CMP component using time-based sequence of images and machine learning
KR20230150383A (ko) * 2021-03-05 2023-10-30 어플라이드 머티어리얼스, 인코포레이티드 리테이닝 링들을 분류하기 위한 기계 학습
US11890722B2 (en) * 2021-04-05 2024-02-06 Applied Materials, Inc. Chemical mechanical polishing slurry buildup monitoring
US11969140B2 (en) * 2021-06-22 2024-04-30 Micron Technology, Inc. Surface cleaning
CN113510620A (zh) * 2021-07-26 2021-10-19 长鑫存储技术有限公司 加液装置及研磨设备
CN113858034B (zh) * 2021-09-18 2023-06-30 长江存储科技有限责任公司 抛光装置、抛光装置的检测方法和抛光系统
WO2023239419A1 (en) * 2022-06-06 2023-12-14 Applied Materials, Inc. Acoustic monitoring of conditioner during polishing
US20240051081A1 (en) * 2022-08-15 2024-02-15 Applied Materials, Inc. Multiple disk pad conditioner

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JPH11347917A (ja) * 1998-06-09 1999-12-21 Ebara Corp ポリッシング装置
US6210255B1 (en) * 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6390908B1 (en) * 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
TW545580U (en) * 2002-06-07 2003-08-01 Nanya Technology Corp CMP device of measuring apparatus with a notched size for measuring the guide ring of wafer edge
US7008295B2 (en) 2003-02-04 2006-03-07 Applied Materials Inc. Substrate monitoring during chemical mechanical polishing
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers
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Also Published As

Publication number Publication date
US11931860B2 (en) 2024-03-19
CN111936267B (zh) 2023-07-25
US20190283209A1 (en) 2019-09-19
JP7356996B2 (ja) 2023-10-05
KR20200120960A (ko) 2020-10-22
JP2023178295A (ja) 2023-12-14
CN116872088A (zh) 2023-10-13
CN111936267A (zh) 2020-11-13
WO2019177841A1 (en) 2019-09-19
US20230249315A1 (en) 2023-08-10
US11571786B2 (en) 2023-02-07
TWI806985B (zh) 2023-07-01
TW201938321A (zh) 2019-10-01
EP3765238A4 (en) 2021-12-08
EP3765238A1 (en) 2021-01-20
JP2021517519A (ja) 2021-07-26

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