SG11202007002YA - Methods and apparatus for cleaning substrates - Google Patents

Methods and apparatus for cleaning substrates

Info

Publication number
SG11202007002YA
SG11202007002YA SG11202007002YA SG11202007002YA SG11202007002YA SG 11202007002Y A SG11202007002Y A SG 11202007002YA SG 11202007002Y A SG11202007002Y A SG 11202007002YA SG 11202007002Y A SG11202007002Y A SG 11202007002YA SG 11202007002Y A SG11202007002Y A SG 11202007002YA
Authority
SG
Singapore
Prior art keywords
methods
cleaning substrates
substrates
cleaning
Prior art date
Application number
SG11202007002YA
Inventor
Hui Wang
Xi Wang
Xiaoyan Zhang
Fufa Chen
Fuping Chen
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11202007002YA publication Critical patent/SG11202007002YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
SG11202007002YA 2018-01-23 2018-01-23 Methods and apparatus for cleaning substrates SG11202007002YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/073810 WO2019144273A1 (en) 2018-01-23 2018-01-23 Methods and apparatus for cleaning substrates

Publications (1)

Publication Number Publication Date
SG11202007002YA true SG11202007002YA (en) 2020-08-28

Family

ID=67395232

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202007002YA SG11202007002YA (en) 2018-01-23 2018-01-23 Methods and apparatus for cleaning substrates

Country Status (6)

Country Link
US (1) US20210035821A1 (en)
JP (1) JP7230037B2 (en)
KR (1) KR102548592B1 (en)
CN (1) CN111630649A (en)
SG (1) SG11202007002YA (en)
WO (1) WO2019144273A1 (en)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3690619B2 (en) * 1996-01-12 2005-08-31 忠弘 大見 Cleaning method and cleaning device
TW355815B (en) * 1996-05-28 1999-04-11 Canon Kasei Kk Cleaning methods of porous surface and semiconductor surface
JP3192610B2 (en) * 1996-05-28 2001-07-30 キヤノン株式会社 Method for cleaning porous surface, method for cleaning semiconductor surface, and method for manufacturing semiconductor substrate
JP2002009035A (en) * 2000-06-26 2002-01-11 Toshiba Corp Method and device for washing substrate
JP2002124502A (en) 2000-07-14 2002-04-26 Dainippon Screen Mfg Co Ltd Method and apparatus for substrate treatment
JP2002289565A (en) * 2001-03-26 2002-10-04 Toshiba Corp Cleaning method, method for manufacturing semiconductor device and method for manufacturing active matrix type display device
US7718009B2 (en) * 2004-08-30 2010-05-18 Applied Materials, Inc. Cleaning submicron structures on a semiconductor wafer surface
US7958899B2 (en) * 2007-08-21 2011-06-14 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning apparatus and substrate cleaning method
CN101419903B (en) * 2007-10-24 2010-06-23 联华电子股份有限公司 Method for removing granules on wafer
US8585825B2 (en) * 2008-10-30 2013-11-19 Lam Research Corporation Acoustic assisted single wafer wet clean for semiconductor wafer process
JP6063944B2 (en) 2011-09-22 2017-01-18 エーシーエム リサーチ （シャンハイ） インコーポレーテッド Flip chip assembly cleaning method and apparatus
KR101925173B1 (en) * 2012-03-23 2018-12-04 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus and heater cleaning method
KR102308587B1 (en) * 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus and substrate processing method
JP2016058665A (en) * 2014-09-12 2016-04-21 株式会社Ｓｃｒｅｅｎホールディングス Substrate cleaning method and substrate cleaning device
WO2016183707A1 (en) * 2015-05-15 2016-11-24 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers
US10910244B2 (en) * 2015-05-20 2021-02-02 Acm Research, Inc. Methods and system for cleaning semiconductor wafers
CN105376927B (en) * 2015-09-24 2018-07-17 中国航天科技集团公司第九研究院第七七一研究所 A kind of processing method of PTFE products hole wall
WO2017096553A1 (en) * 2015-12-09 2017-06-15 Acm Research (Shanghai) Inc. Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device
CN109075103B (en) * 2016-04-06 2022-06-10 盛美半导体设备(上海)股份有限公司 Method and apparatus for cleaning semiconductor substrate
CN105655241A (en) * 2016-04-07 2016-06-08 上海华力微电子有限公司 Single-wafer wet cleaning method
US10758875B2 (en) * 2016-12-30 2020-09-01 Semes Co., Ltd. Liquid supply unit, substrate treating apparatus, and method for removing bubbles

Also Published As

Publication number Publication date
JP2021517732A (en) 2021-07-26
KR102548592B1 (en) 2023-06-28
KR20200109350A (en) 2020-09-22
JP7230037B2 (en) 2023-02-28
CN111630649A (en) 2020-09-04
US20210035821A1 (en) 2021-02-04
WO2019144273A1 (en) 2019-08-01

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