SG11202005938SA - Surface treatment compositions and methods - Google Patents
Surface treatment compositions and methodsInfo
- Publication number
- SG11202005938SA SG11202005938SA SG11202005938SA SG11202005938SA SG11202005938SA SG 11202005938S A SG11202005938S A SG 11202005938SA SG 11202005938S A SG11202005938S A SG 11202005938SA SG 11202005938S A SG11202005938S A SG 11202005938SA SG 11202005938S A SG11202005938S A SG 11202005938SA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- surface treatment
- treatment compositions
- compositions
- treatment
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 238000004381 surface treatment Methods 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/095—Carboxylic acids containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Paints Or Removers (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862613849P | 2018-01-05 | 2018-01-05 | |
US201862649685P | 2018-03-29 | 2018-03-29 | |
PCT/US2018/066179 WO2019135901A1 (en) | 2018-01-05 | 2018-12-18 | Surface treatment compositions and methods |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202005938SA true SG11202005938SA (en) | 2020-07-29 |
Family
ID=67140524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202005938SA SG11202005938SA (en) | 2018-01-05 | 2018-12-18 | Surface treatment compositions and methods |
Country Status (9)
Country | Link |
---|---|
US (2) | US11174394B2 (en) |
EP (1) | EP3735325A4 (en) |
JP (1) | JP7384332B2 (en) |
KR (1) | KR20200100132A (en) |
CN (1) | CN111565859B (en) |
IL (1) | IL275626B1 (en) |
SG (1) | SG11202005938SA (en) |
TW (1) | TWI813614B (en) |
WO (1) | WO2019135901A1 (en) |
Families Citing this family (11)
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US10593538B2 (en) | 2017-03-24 | 2020-03-17 | Fujifilm Electronic Materials U.S.A., Inc. | Surface treatment methods and compositions therefor |
IL275626B1 (en) | 2018-01-05 | 2024-03-01 | Fujifilm Electronic Mat Usa Inc | Surface treatment compositions and methods |
CN112154190A (en) * | 2018-05-18 | 2020-12-29 | 北卡罗来纳-查佩尔山大学 | Composition, device and method for improving surface properties of a substrate |
US20200035494A1 (en) * | 2018-07-30 | 2020-01-30 | Fujifilm Electronic Materials U.S.A., Inc. | Surface Treatment Compositions and Methods |
US11500290B2 (en) * | 2018-11-13 | 2022-11-15 | International Business Machines Corporation | Adhesion promoters |
US11414631B2 (en) | 2019-05-24 | 2022-08-16 | NuGeneration Technologies, LLC | Composition comprising an oxygenated solvent and a siloxane solvent for the removal of silicone deposits |
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CN115943199A (en) * | 2020-07-09 | 2023-04-07 | 巴斯夫欧洲公司 | Compositions comprising siloxanes and alkanes for avoiding pattern collapse when processing patterned materials with line-to-line pitch dimensions of 50nm or less |
WO2023192000A1 (en) * | 2022-03-31 | 2023-10-05 | Fujifilm Electronic Materials U.S.A., Inc. | Surface treatment compositions and methods |
WO2023195654A1 (en) * | 2022-04-05 | 2023-10-12 | 솔브레인 주식회사 | Thin film modification composition, method for forming thin film by using same, and semiconductor substrate and semiconductor element manufactured therefrom |
WO2023195657A1 (en) * | 2022-04-05 | 2023-10-12 | 솔브레인 주식회사 | Thin film modification composition, method for forming thin film by using same, semiconductor substrate manufactured thereby, and semiconductor device |
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JP6703256B2 (en) * | 2016-03-15 | 2020-06-03 | セントラル硝子株式会社 | Water repellent protective film forming agent, water repellent protective film forming chemical, and wafer cleaning method |
JP6681796B2 (en) | 2016-06-21 | 2020-04-15 | 東京応化工業株式会社 | Silylating agent solution, surface treatment method, and semiconductor device manufacturing method |
US9653307B1 (en) | 2016-07-14 | 2017-05-16 | Micron Technology, Inc. | Surface modification compositions, methods of modifying silicon-based materials, and methods of forming high aspect ratio structures |
JP6310583B2 (en) | 2017-02-10 | 2018-04-11 | 株式会社Screenホールディングス | Substrate processing method and substrate processing apparatus |
US10593538B2 (en) | 2017-03-24 | 2020-03-17 | Fujifilm Electronic Materials U.S.A., Inc. | Surface treatment methods and compositions therefor |
EP3476464A1 (en) * | 2017-10-31 | 2019-05-01 | Tokyo Ohka Kogyo Co., Ltd. | Surface treatment method, surface treatment liquid, and surface-treated article |
JP6916731B2 (en) * | 2017-12-28 | 2021-08-11 | 東京応化工業株式会社 | A method for making a substrate water repellent, a surface treatment agent, and a method for suppressing the collapse of an organic pattern or an inorganic pattern when cleaning the substrate surface with a cleaning liquid. |
US10941301B2 (en) * | 2017-12-28 | 2021-03-09 | Tokyo Ohka Kogyo Co., Ltd. | Surface treatment method, surface treatment agent, and method for forming film region-selectively on substrate |
IL275626B1 (en) | 2018-01-05 | 2024-03-01 | Fujifilm Electronic Mat Usa Inc | Surface treatment compositions and methods |
-
2018
- 2018-12-18 IL IL275626A patent/IL275626B1/en unknown
- 2018-12-18 KR KR1020207020656A patent/KR20200100132A/en not_active Application Discontinuation
- 2018-12-18 US US16/223,396 patent/US11174394B2/en active Active
- 2018-12-18 EP EP18898847.1A patent/EP3735325A4/en active Pending
- 2018-12-18 SG SG11202005938SA patent/SG11202005938SA/en unknown
- 2018-12-18 JP JP2020537479A patent/JP7384332B2/en active Active
- 2018-12-18 WO PCT/US2018/066179 patent/WO2019135901A1/en unknown
- 2018-12-18 CN CN201880085313.8A patent/CN111565859B/en active Active
- 2018-12-26 TW TW107147196A patent/TWI813614B/en active
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2021
- 2021-01-07 US US17/143,229 patent/US11447642B2/en active Active
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JP7384332B2 (en) | 2023-11-21 |
US11174394B2 (en) | 2021-11-16 |
US20190211210A1 (en) | 2019-07-11 |
EP3735325A4 (en) | 2021-03-03 |
EP3735325A1 (en) | 2020-11-11 |
IL275626B1 (en) | 2024-03-01 |
TWI813614B (en) | 2023-09-01 |
CN111565859B (en) | 2022-12-30 |
TW201930328A (en) | 2019-08-01 |
JP2021509776A (en) | 2021-04-01 |
CN111565859A (en) | 2020-08-21 |
IL275626A (en) | 2020-08-31 |
KR20200100132A (en) | 2020-08-25 |
US20210122925A1 (en) | 2021-04-29 |
WO2019135901A1 (en) | 2019-07-11 |
US11447642B2 (en) | 2022-09-20 |
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