SG11202004421WA - Photoresist remover compositions - Google Patents

Photoresist remover compositions

Info

Publication number
SG11202004421WA
SG11202004421WA SG11202004421WA SG11202004421WA SG11202004421WA SG 11202004421W A SG11202004421W A SG 11202004421WA SG 11202004421W A SG11202004421W A SG 11202004421WA SG 11202004421W A SG11202004421W A SG 11202004421WA SG 11202004421W A SG11202004421W A SG 11202004421WA
Authority
SG
Singapore
Prior art keywords
photoresist remover
remover compositions
compositions
photoresist
remover
Prior art date
Application number
SG11202004421WA
Other languages
English (en)
Inventor
Hengpeng Wu
Guanyang Lin
Original Assignee
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh filed Critical Merck Patent Gmbh
Publication of SG11202004421WA publication Critical patent/SG11202004421WA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/34Organic compounds containing sulfur
    • C11D3/3418Toluene -, xylene -, cumene -, benzene - or naphthalene sulfonates or sulfates
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43Solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
SG11202004421WA 2018-01-25 2019-01-23 Photoresist remover compositions SG11202004421WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862621743P 2018-01-25 2018-01-25
PCT/EP2019/051533 WO2019145311A1 (en) 2018-01-25 2019-01-23 Photoresist remover compositions

Publications (1)

Publication Number Publication Date
SG11202004421WA true SG11202004421WA (en) 2020-06-29

Family

ID=65228538

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004421WA SG11202004421WA (en) 2018-01-25 2019-01-23 Photoresist remover compositions

Country Status (8)

Country Link
US (1) US11366392B2 (zh)
EP (1) EP3743772A1 (zh)
JP (1) JP7377206B2 (zh)
KR (1) KR20200110793A (zh)
CN (1) CN111527453A (zh)
SG (1) SG11202004421WA (zh)
TW (1) TW201936575A (zh)
WO (1) WO2019145311A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202004421WA (en) 2018-01-25 2020-06-29 Merck Patent Gmbh Photoresist remover compositions
TWI748741B (zh) * 2020-11-11 2021-12-01 暉盛科技股份有限公司 電漿晶圓清潔機及使用其清潔晶圓的方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950056B2 (ja) * 1976-11-24 1984-12-06 ジェイエスアール株式会社 剥離液組成物
JPH0727222B2 (ja) * 1987-10-28 1995-03-29 日本合成ゴム株式会社 ホトレジスト用剥離液
EP1042419B2 (en) 1997-12-18 2007-08-01 Essex Specialty Products, Inc. Method to adhere urethane adhesive to a painted surface with a pre-wipe composition
DE19848548C2 (de) 1998-10-21 2001-06-13 Cognis Deutschland Gmbh Verfahren zur Aufarbeitung verunreinigter Fettalkohol-Gemische
DE19928923A1 (de) 1999-06-24 2000-12-28 Cognis Deutschland Gmbh Schaumkontrollierte feste Waschmittel
US6576394B1 (en) 2000-06-16 2003-06-10 Clariant Finance (Bvi) Limited Negative-acting chemically amplified photoresist composition
US6551973B1 (en) 2001-10-09 2003-04-22 General Chemical Corporation Stable metal-safe stripper for removing cured negative-tone novolak and acrylic photoresists and post-etch residue
US6943142B2 (en) * 2002-01-09 2005-09-13 Air Products And Chemicals, Inc. Aqueous stripping and cleaning composition
KR100843984B1 (ko) * 2002-02-22 2008-07-07 주식회사 동진쎄미켐 감광성 수지 조성물을 제거하기 위한 씬너 조성물
KR20050120914A (ko) 2004-06-21 2005-12-26 주식회사 동진쎄미켐 레지스트 제거용 조성물
JP4656308B2 (ja) * 2005-05-23 2011-03-23 日産化学工業株式会社 反射防止剤固化物の除去用洗浄液および洗浄方法
US7700533B2 (en) * 2005-06-23 2010-04-20 Air Products And Chemicals, Inc. Composition for removal of residue comprising cationic salts and methods using same
EP1946358A4 (en) * 2005-11-09 2009-03-04 Advanced Tech Materials COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS WITH LOW DIELECTRICITY CONSTANT MATERIALS
US7601482B2 (en) 2006-03-28 2009-10-13 Az Electronic Materials Usa Corp. Negative photoresist compositions
US8288330B2 (en) * 2006-05-26 2012-10-16 Air Products And Chemicals, Inc. Composition and method for photoresist removal
KR20080031565A (ko) * 2006-10-04 2008-04-10 동우 화인켐 주식회사 포토레지스트 박리용 조성물 및 이를 이용한 박리 방법
JP5657318B2 (ja) * 2010-09-27 2015-01-21 富士フイルム株式会社 半導体基板用洗浄剤、これを利用した洗浄方法及び半導体素子の製造方法
WO2014047428A1 (en) * 2012-09-21 2014-03-27 Segetis, Inc. Cleaning, surfactant, and personal care compositions
US10460954B2 (en) * 2014-06-04 2019-10-29 Entegris, Inc. Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility
KR102327568B1 (ko) * 2015-03-12 2021-11-17 리지필드 액퀴지션 낮은 pKa 구동의 폴리머 스트리핑 동안에 전하 착화 구리 보호를 촉진하는 조성물 및 방법
CN108026491B (zh) * 2015-08-03 2021-08-13 富士胶片电子材料美国有限公司 清洁组合物
CN110475845B (zh) * 2017-03-24 2022-02-25 富士胶片电子材料美国有限公司 用于移除半导体基板上的残余物的清洁组合物
SG11202004421WA (en) * 2018-01-25 2020-06-29 Merck Patent Gmbh Photoresist remover compositions
CN111512239B (zh) * 2018-01-25 2024-05-03 默克专利股份有限公司 光致抗蚀剂去除剂组合物

Also Published As

Publication number Publication date
US11366392B2 (en) 2022-06-21
CN111527453A (zh) 2020-08-11
KR20200110793A (ko) 2020-09-25
EP3743772A1 (en) 2020-12-02
JP2021511531A (ja) 2021-05-06
JP7377206B2 (ja) 2023-11-09
US20210080833A1 (en) 2021-03-18
WO2019145311A1 (en) 2019-08-01
TW201936575A (zh) 2019-09-16

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