SG11202004208TA - Millimeter wave transmission line architecture - Google Patents
Millimeter wave transmission line architectureInfo
- Publication number
- SG11202004208TA SG11202004208TA SG11202004208TA SG11202004208TA SG11202004208TA SG 11202004208T A SG11202004208T A SG 11202004208TA SG 11202004208T A SG11202004208T A SG 11202004208TA SG 11202004208T A SG11202004208T A SG 11202004208TA SG 11202004208T A SG11202004208T A SG 11202004208TA
- Authority
- SG
- Singapore
- Prior art keywords
- transmission line
- millimeter wave
- wave transmission
- line architecture
- architecture
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
- H01P3/006—Conductor backed coplanar waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
- H01P3/082—Multilayer dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Waveguides (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762584260P | 2017-11-10 | 2017-11-10 | |
US201762584300P | 2017-11-10 | 2017-11-10 | |
US201762584264P | 2017-11-10 | 2017-11-10 | |
US201862636375P | 2018-02-28 | 2018-02-28 | |
US201862636364P | 2018-02-28 | 2018-02-28 | |
US201862691810P | 2018-06-29 | 2018-06-29 | |
PCT/US2018/059636 WO2019094477A1 (en) | 2017-11-10 | 2018-11-07 | Millimeter wave transmission line architecture |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202004208TA true SG11202004208TA (en) | 2020-06-29 |
Family
ID=64572496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004208TA SG11202004208TA (en) | 2017-11-10 | 2018-11-07 | Millimeter wave transmission line architecture |
Country Status (7)
Country | Link |
---|---|
US (1) | US10826147B2 (zh) |
EP (1) | EP3707774A1 (zh) |
JP (1) | JP7013579B2 (zh) |
KR (1) | KR102342520B1 (zh) |
CN (1) | CN111788737B (zh) |
SG (1) | SG11202004208TA (zh) |
WO (1) | WO2019094477A1 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102545915B1 (ko) * | 2017-11-10 | 2023-06-22 | 레이던 컴퍼니 | 적층 제조 기술(amt) 저 프로파일 라디에이터 |
US11289814B2 (en) | 2017-11-10 | 2022-03-29 | Raytheon Company | Spiral antenna and related fabrication techniques |
IL308118A (en) | 2018-02-28 | 2023-12-01 | Raytheon Co | Radio frequency push connections |
WO2019168996A1 (en) | 2018-02-28 | 2019-09-06 | Raytheon Company | Additive manufacturing technology (amt) low profile signal divider |
IL278607B2 (en) * | 2018-05-22 | 2024-02-01 | Raytheon Co | Millimeter wave display array |
US11089673B2 (en) * | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
US10667394B1 (en) * | 2019-09-24 | 2020-05-26 | Gentherm Inc. | Double-sided, single conductor laminated substrate |
TWI734488B (zh) * | 2020-05-21 | 2021-07-21 | 啟碁科技股份有限公司 | 電子裝置及其天線模組 |
US11757166B2 (en) | 2020-11-10 | 2023-09-12 | Aptiv Technologies Limited | Surface-mount waveguide for vertical transitions of a printed circuit board |
US11901601B2 (en) | 2020-12-18 | 2024-02-13 | Aptiv Technologies Limited | Waveguide with a zigzag for suppressing grating lobes |
US11749883B2 (en) | 2020-12-18 | 2023-09-05 | Aptiv Technologies Limited | Waveguide with radiation slots and parasitic elements for asymmetrical coverage |
US11444364B2 (en) | 2020-12-22 | 2022-09-13 | Aptiv Technologies Limited | Folded waveguide for antenna |
US11616306B2 (en) | 2021-03-22 | 2023-03-28 | Aptiv Technologies Limited | Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board |
US11962085B2 (en) | 2021-05-13 | 2024-04-16 | Aptiv Technologies AG | Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength |
CN113316330B (zh) * | 2021-05-25 | 2022-07-22 | 中国电子科技集团公司第二十九研究所 | 基于多次层压的内埋合成网络基板叠层及设计方法 |
US11616282B2 (en) | 2021-08-03 | 2023-03-28 | Aptiv Technologies Limited | Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0812887B2 (ja) | 1985-04-13 | 1996-02-07 | 富士通株式会社 | 高速集積回路パツケ−ジ |
JP3241139B2 (ja) | 1993-02-04 | 2001-12-25 | 三菱電機株式会社 | フィルムキャリア信号伝送線路 |
US5401175A (en) | 1993-06-25 | 1995-03-28 | M/A-Com, Inc. | Magnetic coaxial connector |
JP4195731B2 (ja) * | 1996-07-25 | 2008-12-10 | 富士通株式会社 | 多層プリント板及びこれを利用した高周波回路装置 |
US5857858A (en) | 1996-12-23 | 1999-01-12 | General Electric Company | Demountable and repairable low pitch interconnect for stacked multichip modules |
JPH10200311A (ja) * | 1997-01-14 | 1998-07-31 | Nec Corp | 裏面接地導体付きコプレーナウエーブガイド線路 |
WO1998047331A1 (fr) | 1997-04-16 | 1998-10-22 | Kabushiki Kaisha Toshiba | Tableau de connexions, son procede de fabrication et boitier de semi-conducteur |
US6000120A (en) * | 1998-04-16 | 1999-12-14 | Motorola, Inc. | Method of making coaxial transmission lines on a printed circuit board |
US6137453A (en) | 1998-11-19 | 2000-10-24 | Wang Electro-Opto Corporation | Broadband miniaturized slow-wave antenna |
JP3282608B2 (ja) * | 1999-03-23 | 2002-05-20 | 日本電気株式会社 | 多層基板 |
JP3710652B2 (ja) | 1999-08-03 | 2005-10-26 | 三菱電機株式会社 | ストリップライン給電装置 |
JP3487283B2 (ja) | 2000-10-31 | 2004-01-13 | 三菱電機株式会社 | 差動ストリップ線路垂直変換器および光モジュール |
US6651322B1 (en) | 2000-12-28 | 2003-11-25 | Unisys Corporation | Method of reworking a multilayer printed circuit board assembly |
DE60200301T2 (de) * | 2001-01-30 | 2004-08-05 | Matsushita Electric Industrial Co., Ltd., Kadoma | Antenne |
US6624787B2 (en) | 2001-10-01 | 2003-09-23 | Raytheon Company | Slot coupled, polarized, egg-crate radiator |
US6747217B1 (en) | 2001-11-20 | 2004-06-08 | Unisys Corporation | Alternative to through-hole-plating in a printed circuit board |
US20030188889A1 (en) | 2002-04-09 | 2003-10-09 | Ppc Electronic Ag | Printed circuit board and method for producing it |
JP4159378B2 (ja) | 2002-04-25 | 2008-10-01 | 三菱電機株式会社 | 高周波装置とその製造方法 |
JP4059085B2 (ja) | 2003-01-14 | 2008-03-12 | 松下電器産業株式会社 | 高周波積層部品およびその製造方法 |
DE10309075A1 (de) | 2003-03-03 | 2004-09-16 | Robert Bosch Gmbh | Planare Antennenanordnung |
US7315223B2 (en) | 2004-06-30 | 2008-01-01 | Emag Technologies, Inc. | Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias |
JP4498258B2 (ja) | 2005-10-13 | 2010-07-07 | 富士通オプティカルコンポーネンツ株式会社 | コイルパッケージ |
US8369950B2 (en) * | 2005-10-28 | 2013-02-05 | Cardiac Pacemakers, Inc. | Implantable medical device with fractal antenna |
US7405477B1 (en) | 2005-12-01 | 2008-07-29 | Altera Corporation | Ball grid array package-to-board interconnect co-design apparatus |
JP2007193999A (ja) * | 2006-01-17 | 2007-08-02 | Sony Chemical & Information Device Corp | 伝送ケーブル |
US7612638B2 (en) * | 2006-07-14 | 2009-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Waveguides in integrated circuits |
DE102007028799A1 (de) * | 2007-06-19 | 2008-12-24 | Technische Universität Ilmenau | Impedanzkontrolliertes koplanares Wellenleitersystem zur dreidimensionalen Verteilung von Signalen hoher Bandbreite |
US20100254094A1 (en) * | 2007-10-25 | 2010-10-07 | Risato Ohhira | High-Frequency Wiring Board and High-Frequency Module That Uses the High-Frequency Wiring Board |
KR100999529B1 (ko) | 2008-09-04 | 2010-12-08 | 삼성전기주식회사 | 마이크로 스트립 라인을 구비한 인쇄회로기판, 스트립라인을 구비한 인쇄회로기판 및 그들의 제조 방법 |
US8134086B2 (en) * | 2009-02-17 | 2012-03-13 | Lockheed Martin Corporation | Electrical isolating structure for conductors in a substrate |
KR101119267B1 (ko) | 2010-04-13 | 2012-03-16 | 고려대학교 산학협력단 | 매칭 기판을 이용한 유전체 공진기 안테나 |
CN201845850U (zh) | 2010-09-30 | 2011-05-25 | 安徽博微长安电子有限公司 | 多路微波大功率分配合成器 |
US20130154773A1 (en) * | 2011-12-15 | 2013-06-20 | Infineon Technologies Ag | Waveguide |
US9806393B2 (en) * | 2012-06-18 | 2017-10-31 | Gapwaves Ab | Gap waveguide structures for THz applications |
CN103022681B (zh) * | 2012-12-21 | 2015-05-06 | 东南大学 | 内嵌金属化过孔幅度校准的基片集成波导天线 |
WO2014174971A1 (ja) * | 2013-04-24 | 2014-10-30 | 株式会社湘南合成樹脂製作所 | 信号伝送用フラットケーブル |
US9374910B2 (en) | 2013-12-31 | 2016-06-21 | International Business Machines Corporation | Printed circuit board copper plane repair |
US10033080B2 (en) | 2014-05-07 | 2018-07-24 | Alcatel Lucent | Electrochromic cell for radio-frequency applications |
US10086432B2 (en) | 2014-12-10 | 2018-10-02 | Washington State University | Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces |
US9893426B2 (en) | 2015-10-26 | 2018-02-13 | Verizon Patent And Licensing Inc. | PCB embedded radiator antenna with exposed tuning stub |
CN106936521B (zh) | 2017-01-12 | 2020-04-28 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 紧凑型天线馈电校准网络 |
CN206742473U (zh) | 2017-05-31 | 2017-12-12 | 中国电子科技集团公司第十三研究所 | 抗电磁干扰的微波功率分配器 |
-
2018
- 2018-11-07 US US16/183,169 patent/US10826147B2/en active Active
- 2018-11-07 CN CN201880072765.2A patent/CN111788737B/zh active Active
- 2018-11-07 KR KR1020207015052A patent/KR102342520B1/ko active IP Right Grant
- 2018-11-07 SG SG11202004208TA patent/SG11202004208TA/en unknown
- 2018-11-07 WO PCT/US2018/059636 patent/WO2019094477A1/en unknown
- 2018-11-07 EP EP18812464.8A patent/EP3707774A1/en active Pending
- 2018-11-07 JP JP2020526004A patent/JP7013579B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP7013579B2 (ja) | 2022-02-15 |
CN111788737B (zh) | 2022-11-15 |
US10826147B2 (en) | 2020-11-03 |
EP3707774A1 (en) | 2020-09-16 |
KR102342520B1 (ko) | 2021-12-22 |
WO2019094477A1 (en) | 2019-05-16 |
US20190148807A1 (en) | 2019-05-16 |
JP2021502769A (ja) | 2021-01-28 |
CN111788737A (zh) | 2020-10-16 |
KR20200079518A (ko) | 2020-07-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11202004208TA (en) | Millimeter wave transmission line architecture | |
PL3692639T3 (pl) | Transmisja referencyjna sondowania | |
ZA201807186B (en) | Adaptive transmission time interval length | |
EP3392967A4 (en) | ANTENNA TRANSMISSION DEVICE AND ANTENNA | |
SG11202010014XA (en) | Repetition-based transmission | |
SG11202006797PA (en) | Coordinated transmission in millimeter wave systems | |
EP3336391A4 (en) | Transmission | |
HK1252266A1 (zh) | 可展開的射頻傳輸線 | |
EP3587859A4 (en) | DRIVE BELT | |
GB2579526B (en) | Reconfigurable radar transmitter | |
IL266906A (en) | A low-loss electrical transmission mechanism and an antenna using it | |
GB2573592B (en) | Transmission system | |
EP3668030A4 (en) | TRANSFER DEVICE | |
EP3709662A4 (en) | TRANSMISSION DEVICE | |
EP3287671A4 (en) | Transmission | |
IL274606A (en) | transmission | |
EP3612761A4 (en) | COUPLING ELEMENT | |
EP3534194A4 (en) | ELECTROMAGNETIC SHAFT TRANSMISSION CABLE | |
EP3546798A4 (en) | TRANSMISSION | |
EP3506416A4 (en) | TRANSMISSION LINE | |
EP3521664A4 (en) | TRANSMISSION | |
EP3506417A4 (en) | TRANSMISSION LINE | |
EP3299669A4 (en) | Transmission | |
PL3659206T3 (pl) | Struktura koncentrycznej linii przesyłowej | |
GB2564424B (en) | Transmission system |