SG11202002290YA - Bond materials with enhanced plasma resistant characteristics and associated methods - Google Patents
Bond materials with enhanced plasma resistant characteristics and associated methodsInfo
- Publication number
- SG11202002290YA SG11202002290YA SG11202002290YA SG11202002290YA SG11202002290YA SG 11202002290Y A SG11202002290Y A SG 11202002290YA SG 11202002290Y A SG11202002290Y A SG 11202002290YA SG 11202002290Y A SG11202002290Y A SG 11202002290YA SG 11202002290Y A SG11202002290Y A SG 11202002290YA
- Authority
- SG
- Singapore
- Prior art keywords
- associated methods
- plasma resistant
- resistant characteristics
- enhanced plasma
- bond materials
- Prior art date
Links
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762559008P | 2017-09-15 | 2017-09-15 | |
PCT/US2018/050294 WO2019055354A1 (en) | 2017-09-15 | 2018-09-10 | BONDING MATERIALS WITH ENHANCED PLASMA RESISTANCE FEATURES AND ASSOCIATED METHODS |
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SG11202002290YA true SG11202002290YA (en) | 2020-04-29 |
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SG11202002290YA SG11202002290YA (en) | 2017-09-15 | 2018-09-10 | Bond materials with enhanced plasma resistant characteristics and associated methods |
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US (1) | US10727195B2 (zh) |
EP (1) | EP3682469A4 (zh) |
JP (1) | JP7232824B2 (zh) |
KR (1) | KR102599763B1 (zh) |
CN (1) | CN111108588B (zh) |
IL (1) | IL273198B (zh) |
SG (1) | SG11202002290YA (zh) |
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FR3103315B1 (fr) * | 2019-11-19 | 2021-12-03 | St Microelectronics Tours Sas | Procédé de fabrication de puces électroniques |
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US4314231A (en) * | 1980-04-21 | 1982-02-02 | Raychem Corporation | Conductive polymer electrical devices |
US5344703A (en) * | 1991-06-25 | 1994-09-06 | The United States Of America As Represented By The Secretary Of The Air Force | Ordered polymer/sol-gel microcomposite laminates with peek resin adhesive |
US5585178A (en) * | 1991-12-31 | 1996-12-17 | Minnesota Mining & Manufacturing Company | Composite adhesive tape |
US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
WO2001051580A1 (fr) | 2000-01-13 | 2001-07-19 | Nitto Denko Corporation | Feuille adhesive poreuse, plaquette a semi-conducteurs munie de la feuille adhesive poreuse, et procede de fabrication associe |
EP1448745B1 (en) | 2001-11-28 | 2009-02-18 | Dow Corning Toray Co., Ltd. | Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
US7220497B2 (en) * | 2003-12-18 | 2007-05-22 | Lam Research Corporation | Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components |
TW201004528A (en) * | 2008-03-28 | 2010-01-16 | Hitachi Chemical Co Ltd | Method of fabricating wiring board, photo-electrical composite parts and photo-electrical composite substrate |
CN102131882B (zh) | 2008-08-27 | 2013-10-30 | 日立化成株式会社 | 感光性粘接剂组合物、膜状感光性粘接剂、粘接剂图案、带粘接剂的半导体晶片、半导体装置及电子部件 |
JP5732815B2 (ja) | 2009-10-30 | 2015-06-10 | 日立化成株式会社 | 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。 |
JP5691244B2 (ja) | 2010-05-26 | 2015-04-01 | 日立化成株式会社 | フィルム状接着剤、接着シート及び半導体装置 |
US20120100379A1 (en) * | 2010-10-20 | 2012-04-26 | Greene, Tweed Of Delaware, Inc. | Fluoroelastomer bonding compositions suitable for high-temperature applications |
WO2014136606A1 (ja) | 2013-03-05 | 2014-09-12 | 住友電気工業株式会社 | 接着シート及び接着シートの製造方法 |
JP6320694B2 (ja) | 2013-07-03 | 2018-05-09 | 住友電工プリントサーキット株式会社 | 電気部品及びその製造方法 |
JP2014225662A (ja) | 2013-04-26 | 2014-12-04 | 住友ベークライト株式会社 | 感光性接着剤組成物および半導体装置 |
JP6436081B2 (ja) | 2013-07-16 | 2018-12-12 | 日立化成株式会社 | 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置 |
CN105580150B (zh) | 2013-09-25 | 2018-12-25 | 琳得科株式会社 | 导热性粘接片、其制造方法以及使用该导热性粘接片的电子器件 |
KR102353030B1 (ko) * | 2014-01-27 | 2022-01-19 | 코닝 인코포레이티드 | 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법 |
JP6539917B2 (ja) * | 2014-12-26 | 2019-07-10 | リンテック株式会社 | 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス |
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WO2019055354A1 (en) | 2019-03-21 |
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EP3682469A1 (en) | 2020-07-22 |
EP3682469A4 (en) | 2021-05-19 |
JP2020534685A (ja) | 2020-11-26 |
CN111108588A (zh) | 2020-05-05 |
TWI796359B (zh) | 2023-03-21 |
IL273198A (en) | 2020-04-30 |
CN111108588B (zh) | 2021-05-11 |
JP7232824B2 (ja) | 2023-03-03 |
KR102599763B1 (ko) | 2023-11-08 |
US20190088613A1 (en) | 2019-03-21 |
IL273198B (en) | 2021-02-28 |
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