SG11201913862WA - Reflective photomask blank and reflective photomask - Google Patents
Reflective photomask blank and reflective photomaskInfo
- Publication number
- SG11201913862WA SG11201913862WA SG11201913862WA SG11201913862WA SG11201913862WA SG 11201913862W A SG11201913862W A SG 11201913862WA SG 11201913862W A SG11201913862W A SG 11201913862WA SG 11201913862W A SG11201913862W A SG 11201913862WA SG 11201913862W A SG11201913862W A SG 11201913862WA
- Authority
- SG
- Singapore
- Prior art keywords
- reflective photomask
- blank
- reflective
- photomask blank
- photomask
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/52—Reflectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017132027 | 2017-07-05 | ||
| PCT/JP2018/024890 WO2019009212A1 (ja) | 2017-07-05 | 2018-06-29 | 反射型フォトマスクブランク及び反射型フォトマスク |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201913862WA true SG11201913862WA (en) | 2020-01-30 |
Family
ID=64950999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201913862WA SG11201913862WA (en) | 2017-07-05 | 2018-06-29 | Reflective photomask blank and reflective photomask |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11067886B2 (de) |
| EP (1) | EP3650935A4 (de) |
| JP (2) | JP7169970B2 (de) |
| KR (1) | KR102632988B1 (de) |
| CN (1) | CN110785704A (de) |
| SG (1) | SG11201913862WA (de) |
| TW (1) | TWI770217B (de) |
| WO (1) | WO2019009212A1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6919699B2 (ja) * | 2019-11-28 | 2021-08-18 | 凸版印刷株式会社 | 反射型フォトマスクブランク及び反射型フォトマスク |
| JP2021179549A (ja) * | 2020-05-14 | 2021-11-18 | 凸版印刷株式会社 | 反射型マスクブランク及び反射型マスク |
| WO2024029409A1 (ja) * | 2022-08-03 | 2024-02-08 | Ａｇｃ株式会社 | 反射型マスクブランク及び反射型マスク |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060121218A (ko) * | 2003-12-22 | 2006-11-28 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 프로그램 가능 리소그래픽 마스크와, 무 마스크 광학리소그래피 시스템과, 광학 리소그래픽 단계 수행 방법과,기판 라벨링 방법 및 장치 마스킹 방법 |
| JP5194888B2 (ja) * | 2007-09-27 | 2013-05-08 | 凸版印刷株式会社 | 反射型フォトマスクブランク及びその製造方法、反射型フォトマスク及びその製造方法並びに半導体素子の製造方法 |
| JP5332741B2 (ja) * | 2008-09-25 | 2013-11-06 | 凸版印刷株式会社 | 反射型フォトマスク |
| US8962220B2 (en) * | 2009-04-02 | 2015-02-24 | Toppan Printing Co., Ltd. | Reflective photomask and reflective photomask blank |
| EP2453464A1 (de) | 2009-07-08 | 2012-05-16 | Asahi Glass Company, Limited | Reflexionsmaskenrohling für die euv-lithographie |
| JP5418293B2 (ja) | 2010-02-25 | 2014-02-19 | 凸版印刷株式会社 | 反射型フォトマスクおよび反射型フォトマスクブランクならびにその製造方法 |
| EP2583138B1 (de) * | 2010-06-15 | 2020-01-22 | Carl Zeiss SMT GmbH | Maske für euv-lithografie, euv-lithografiesystem und verfahren zur optimierung der bildgebung einer maske |
| KR102127907B1 (ko) * | 2013-09-27 | 2020-06-29 | 호야 가부시키가이샤 | 도전막 부착 기판, 다층 반사막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 장치의 제조방법 |
| US9529250B2 (en) | 2014-10-31 | 2016-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | EUV mask with ITO absorber to suppress out of band radiation |
| JP6888258B2 (ja) * | 2016-09-15 | 2021-06-16 | 凸版印刷株式会社 | 反射型フォトマスク及び反射型フォトマスクブランク |
| JP6915280B2 (ja) | 2017-01-23 | 2021-08-04 | 凸版印刷株式会社 | 反射型フォトマスク及び反射型フォトマスクブランク |
-
2018
- 2018-06-29 EP EP18827918.6A patent/EP3650935A4/de active Pending
- 2018-06-29 JP JP2019527678A patent/JP7169970B2/ja active Active
- 2018-06-29 WO PCT/JP2018/024890 patent/WO2019009212A1/ja unknown
- 2018-06-29 CN CN201880042388.8A patent/CN110785704A/zh active Pending
- 2018-06-29 US US16/625,652 patent/US11067886B2/en active Active
- 2018-06-29 KR KR1020197037743A patent/KR102632988B1/ko active IP Right Grant
- 2018-06-29 SG SG11201913862WA patent/SG11201913862WA/en unknown
- 2018-07-05 TW TW107123247A patent/TWI770217B/zh active
-
2021
- 2021-10-13 JP JP2021168248A patent/JP7279131B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3650935A1 (de) | 2020-05-13 |
| TW201907223A (zh) | 2019-02-16 |
| KR20200019629A (ko) | 2020-02-24 |
| CN110785704A (zh) | 2020-02-11 |
| TWI770217B (zh) | 2022-07-11 |
| WO2019009212A1 (ja) | 2019-01-10 |
| EP3650935A4 (de) | 2020-08-05 |
| US11067886B2 (en) | 2021-07-20 |
| JP7279131B2 (ja) | 2023-05-22 |
| JP7169970B2 (ja) | 2022-11-11 |
| JP2022003417A (ja) | 2022-01-11 |
| US20200218143A1 (en) | 2020-07-09 |
| KR102632988B1 (ko) | 2024-02-01 |
| JPWO2019009212A1 (ja) | 2020-05-07 |
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