SG11201909972TA - Hollow sealing structure - Google Patents

Hollow sealing structure

Info

Publication number
SG11201909972TA
SG11201909972TA SG11201909972TA SG11201909972TA SG 11201909972T A SG11201909972T A SG 11201909972TA SG 11201909972T A SG11201909972T A SG 11201909972TA SG 11201909972T A SG11201909972T A SG 11201909972TA
Authority
SG
Singapore
Prior art keywords
electronic component
substrate
sealing structure
hollow sealing
sealing
Prior art date
Application number
Other languages
English (en)
Inventor
Yusuke Watase
Yutaka Nomura
Hiroyuki Ishige
Masahiko Suzuki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11201909972TA publication Critical patent/SG11201909972TA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/06Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG11201909972T 2017-04-28 2018-04-26 Hollow sealing structure SG11201909972TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017089949 2017-04-28
PCT/JP2018/017042 WO2018199254A1 (ja) 2017-04-28 2018-04-26 中空封止構造体

Publications (1)

Publication Number Publication Date
SG11201909972TA true SG11201909972TA (en) 2019-11-28

Family

ID=63920106

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909972T SG11201909972TA (en) 2017-04-28 2018-04-26 Hollow sealing structure

Country Status (6)

Country Link
JP (1) JPWO2018199254A1 (ko)
KR (1) KR20200002883A (ko)
CN (1) CN110574155A (ko)
SG (1) SG11201909972TA (ko)
TW (1) TWI756415B (ko)
WO (1) WO2018199254A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102486856B1 (ko) * 2017-04-28 2023-01-09 쇼와덴코머티리얼즈가부시끼가이샤 봉지용 필름, 봉지 구조체 및 봉지 구조체의 제조 방법
TWI774184B (zh) 2020-03-18 2022-08-11 日商日本航空電子工業股份有限公司 可薄型化半導體裝置及其製造方法
JP2022028180A (ja) 2020-08-03 2022-02-16 日本航空電子工業株式会社 デバイス及びデバイスの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4370615B2 (ja) * 2003-10-27 2009-11-25 エプソントヨコム株式会社 圧電デバイスとその製造方法
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
JP6302693B2 (ja) * 2013-03-28 2018-03-28 日東電工株式会社 中空封止用樹脂シート及び中空パッケージの製造方法
JP6883937B2 (ja) 2015-03-19 2021-06-09 日東電工株式会社 封止用シートおよび中空パッケージの製造方法
JP6620989B2 (ja) * 2015-05-25 2019-12-18 パナソニックIpマネジメント株式会社 電子部品パッケージ

Also Published As

Publication number Publication date
WO2018199254A1 (ja) 2018-11-01
JPWO2018199254A1 (ja) 2020-03-12
TW201843777A (zh) 2018-12-16
KR20200002883A (ko) 2020-01-08
TWI756415B (zh) 2022-03-01
CN110574155A (zh) 2019-12-13

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