SG11201906133PA - Gallium nitride expitaxial structures for power devices - Google Patents
Gallium nitride expitaxial structures for power devicesInfo
- Publication number
- SG11201906133PA SG11201906133PA SG11201906133PA SG11201906133PA SG11201906133PA SG 11201906133P A SG11201906133P A SG 11201906133PA SG 11201906133P A SG11201906133P A SG 11201906133PA SG 11201906133P A SG11201906133P A SG 11201906133PA SG 11201906133P A SG11201906133P A SG 11201906133PA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- qromis
- walsh
- santa clara
- california
- Prior art date
Links
- 229910002601 GaN Inorganic materials 0.000 title abstract 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229910002704 AlGaN Inorganic materials 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
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Abstract
Title: GALLIUM NITRIDE EXPITAXIAL STRUCTURES FOR POWER DEVICES .1 09p:ea. AlGaN or InAIN 16 1 / 6 —j ' 6 %.:///; 4/ ././ .frter /0/0A Undeped GaN Buffer : Si 120 Conducting Channel (2DEG) 1Q structure (102) FIG. (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT ill IIIIIl °mons °nolo VIII imio oimIE (10) International Publication Number WO 2018/136278 Al (51) International Patent Classification: C30B 2 9 / 4 0 (2006.01) C30B 29/68 (2006.01) (21) International Application Number: PCT/US2018/013206 (22) International Filing Date: 10 January 2018 (10.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/447,857 18 January 2017 (18.01.2017) US 62/591,016 27 November 2017 (27.11.2017) US 15/864,977 08 January 2018 (08.01.2018) US (71) Applicant: QROMIS, INC. [US/US]; 2306 Walsh Av- enue, Santa Clara, California 95051 (US). (72) Inventors: ODNOBLYUDOV, Vladimir; c/o Qromis, Inc., 2306 Walsh Avenue, Santa Clara, California 95032 (US). LESTER, Steve; c/o Qromis, Inc., 2306 Walsh Av- enue, Santa Clara, California 95051 (US). AKTAS, Ozgur; c/o Qromis, Inc., 2306 Walsh Avenue, Santa Clara, Califor- nia 95051 (US). (74) Agent: LIU, Rong et al.; Kilpatrick Townsend & Stock- ton LLP, Mailstop: IP Docketing-22, 1100 Peachtree Street, Suite 2800, Atlanta, Georgia 30309 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, GaN Epi (140) 1-1 Engineered substrate N (57) : A method for making a multilayered device on an engineered substrate having a substrate coefficient of thermal ex- pansion includes growing a buffer layer on the engineered substrate, and growing a first epitaxial layer on the buffer layer. The first O epitaxial layer is characterized by an epitaxial coefficient of thermal expansion substantially equal to the substrate coefficient of thermal \" expansion. [Continued on next page] C WO 2018/136278 Al MIDEDIMOHNIMMUMMOMMIIMEDIMMIONEVOIS EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US201762447857P | 2017-01-18 | 2017-01-18 | |
US201762591016P | 2017-11-27 | 2017-11-27 | |
US15/864,977 US10355120B2 (en) | 2017-01-18 | 2018-01-08 | Gallium nitride epitaxial structures for power devices |
PCT/US2018/013206 WO2018136278A1 (en) | 2017-01-18 | 2018-01-10 | Gallium nitride expitaxial structures for power devices |
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SG11201906133PA true SG11201906133PA (en) | 2019-08-27 |
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SG11201906133PA SG11201906133PA (en) | 2017-01-18 | 2018-01-10 | Gallium nitride expitaxial structures for power devices |
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US (4) | US10355120B2 (en) |
EP (1) | EP3571336A4 (en) |
JP (2) | JP7105239B2 (en) |
KR (4) | KR102458634B1 (en) |
CN (2) | CN110177905B (en) |
SG (1) | SG11201906133PA (en) |
TW (2) | TW202305205A (en) |
WO (1) | WO2018136278A1 (en) |
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US10355120B2 (en) * | 2017-01-18 | 2019-07-16 | QROMIS, Inc. | Gallium nitride epitaxial structures for power devices |
US10720520B2 (en) | 2017-06-21 | 2020-07-21 | Infineon Technologies Austria Ag | Method of controlling wafer bow in a type III-V semiconductor device |
FR3071854A1 (en) * | 2017-10-03 | 2019-04-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | METHOD FOR MANUFACTURING A HETEROJUNCTION ELECTRONIC COMPONENT HAVING AN ENTERREE BARRIER LAYER |
CN111146282B (en) * | 2018-11-06 | 2023-03-28 | 世界先进积体电路股份有限公司 | High electron mobility transistor device and method of manufacturing the same |
TWI706563B (en) * | 2019-03-25 | 2020-10-01 | 世界先進積體電路股份有限公司 | Semiconducotr structure, high electron mobility transistor, and method for fabricating semiconductor structure |
US11380763B2 (en) * | 2019-04-29 | 2022-07-05 | Arizona Board Of Regents On Behalf Of Arizona State University | Contact structures for n-type diamond |
US11114555B2 (en) * | 2019-08-20 | 2021-09-07 | Vanguard International Semiconductor Corporation | High electron mobility transistor device and methods for forming the same |
WO2021243653A1 (en) * | 2020-06-04 | 2021-12-09 | 英诺赛科(珠海)科技有限公司 | Semiconductor apparatus and manufacturing method therefor |
US11670505B2 (en) * | 2020-08-28 | 2023-06-06 | Vanguard International Semiconductor Corporation | Semiconductor substrate, semiconductor device, and method for forming semiconductor structure |
CN116783719A (en) * | 2020-12-31 | 2023-09-19 | 华为技术有限公司 | Integrated circuit, power amplifier and electronic equipment |
CN112956029B (en) * | 2021-01-26 | 2022-07-08 | 英诺赛科(苏州)科技有限公司 | Semiconductor device and method for manufacturing the same |
WO2022168572A1 (en) | 2021-02-05 | 2022-08-11 | 信越半導体株式会社 | Nitride semiconductor substrate and method for producing same |
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