SG11201902745RA - Optimizing training sets used for setting up inspection-related algorithms - Google Patents

Optimizing training sets used for setting up inspection-related algorithms

Info

Publication number
SG11201902745RA
SG11201902745RA SG11201902745RA SG11201902745RA SG11201902745RA SG 11201902745R A SG11201902745R A SG 11201902745RA SG 11201902745R A SG11201902745R A SG 11201902745RA SG 11201902745R A SG11201902745R A SG 11201902745RA SG 11201902745R A SG11201902745R A SG 11201902745RA
Authority
SG
Singapore
Prior art keywords
inspection
algorithm
international
california
defects
Prior art date
Application number
SG11201902745RA
Other languages
English (en)
Inventor
Martin Plihal
Erfan Soltanmohammadi
Saravanan Paramasivam
Sairam Ravu
Ankit Jain
Sarath Shekkizhar
Prasanti Uppaluri
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/782,820 external-priority patent/US10267748B2/en
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201902745RA publication Critical patent/SG11201902745RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Software Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • General Engineering & Computer Science (AREA)
  • Computing Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Medical Informatics (AREA)
  • Signal Processing (AREA)
  • Computational Linguistics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Complex Calculations (AREA)
SG11201902745RA 2016-10-17 2017-10-17 Optimizing training sets used for setting up inspection-related algorithms SG11201902745RA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
IN201641035490 2016-10-17
US201762477248P 2017-03-27 2017-03-27
US15/782,820 US10267748B2 (en) 2016-10-17 2017-10-12 Optimizing training sets used for setting up inspection-related algorithms
PCT/US2017/057029 WO2018075547A1 (en) 2016-10-17 2017-10-17 Optimizing training sets used for setting up inspection-related algorithms

Publications (1)

Publication Number Publication Date
SG11201902745RA true SG11201902745RA (en) 2019-05-30

Family

ID=66656811

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201902745RA SG11201902745RA (en) 2016-10-17 2017-10-17 Optimizing training sets used for setting up inspection-related algorithms

Country Status (6)

Country Link
JP (1) JP6833027B2 (zh)
KR (1) KR102293789B1 (zh)
CN (1) CN109844919B (zh)
IL (1) IL265744B (zh)
SG (1) SG11201902745RA (zh)
TW (1) TWI752100B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10677586B2 (en) * 2018-07-27 2020-06-09 Kla-Tencor Corporation Phase revealing optical and X-ray semiconductor metrology
US11468553B2 (en) * 2018-11-02 2022-10-11 Kla Corporation System and method for determining type and size of defects on blank reticles
WO2020166076A1 (ja) * 2019-02-15 2020-08-20 株式会社日立ハイテク 構造推定システム、構造推定プログラム
TWI694250B (zh) * 2019-03-20 2020-05-21 英業達股份有限公司 表面缺陷偵測系統及其方法
US20230175981A1 (en) * 2020-06-12 2023-06-08 Hitachi High-Tech Corporation Method for Defect Inspection, System, and Computer-Readable Medium
KR102203222B1 (ko) * 2020-10-08 2021-01-14 (주)이랑텍 Ai 학습 기반 rf 필터 자동 튜닝 시스템 및 방법
CN116344378B (zh) * 2023-03-31 2024-01-23 江苏神州新能源电力有限公司 一种光伏板生产用智能检测系统及其检测方法
CN116666248B (zh) * 2023-07-26 2023-11-17 北京象帝先计算技术有限公司 测试结果异常确定方法、装置、电子设备及可读存储介质

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061601B2 (en) * 1999-07-02 2006-06-13 Kla-Tencor Technologies Corporation System and method for double sided optical inspection of thin film disks or wafers
JP4908995B2 (ja) * 2006-09-27 2012-04-04 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置並びに欠陥検査装置
US10043264B2 (en) * 2012-04-19 2018-08-07 Applied Materials Israel Ltd. Integration of automatic and manual defect classification
US8948494B2 (en) * 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples
TWI525317B (zh) 2013-10-08 2016-03-11 國立清華大學 整合影像分析與資料挖礦之自動光學檢測缺陷影像分類方法
US9518932B2 (en) * 2013-11-06 2016-12-13 Kla-Tencor Corp. Metrology optimized inspection
US9613411B2 (en) * 2014-03-17 2017-04-04 Kla-Tencor Corp. Creating defect classifiers and nuisance filters
US9286675B1 (en) * 2014-10-23 2016-03-15 Applied Materials Israel Ltd. Iterative defect filtering process
US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
CN106409711B (zh) * 2016-09-12 2019-03-12 佛山市南海区广工大数控装备协同创新研究院 一种太阳能硅晶片缺陷检测系统及方法

Also Published As

Publication number Publication date
KR102293789B1 (ko) 2021-08-24
JP6833027B2 (ja) 2021-02-24
KR20190057402A (ko) 2019-05-28
IL265744B (en) 2021-06-30
JP2020500422A (ja) 2020-01-09
CN109844919A (zh) 2019-06-04
TW201825883A (zh) 2018-07-16
CN109844919B (zh) 2020-12-11
TWI752100B (zh) 2022-01-11
IL265744A (en) 2019-06-30

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