KR102293789B1 - 검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화 - Google Patents

검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화 Download PDF

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KR102293789B1
KR102293789B1 KR1020197013523A KR20197013523A KR102293789B1 KR 102293789 B1 KR102293789 B1 KR 102293789B1 KR 1020197013523 A KR1020197013523 A KR 1020197013523A KR 20197013523 A KR20197013523 A KR 20197013523A KR 102293789 B1 KR102293789 B1 KR 102293789B1
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inspection
related algorithm
defects
defect
labeled
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KR1020197013523A
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Korean (ko)
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KR20190057402A (ko
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마틴 플리할
에르판 솔탄모함마디
사라바난 파라마시밤
사이람 라부
안키트 자인
사라스 쉐키자르
파라산티 우팔루리
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케이엘에이 코포레이션
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Priority claimed from US15/782,820 external-priority patent/US10267748B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computing Systems (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • Data Mining & Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Signal Processing (AREA)
  • Computational Linguistics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Complex Calculations (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Analysis (AREA)
KR1020197013523A 2016-10-17 2017-10-17 검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화 KR102293789B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
IN201641035490 2016-10-17
IN201641035490 2016-10-17
US201762477248P 2017-03-27 2017-03-27
US62/477,248 2017-03-27
US15/782,820 2017-10-12
US15/782,820 US10267748B2 (en) 2016-10-17 2017-10-12 Optimizing training sets used for setting up inspection-related algorithms
PCT/US2017/057029 WO2018075547A1 (en) 2016-10-17 2017-10-17 Optimizing training sets used for setting up inspection-related algorithms

Publications (2)

Publication Number Publication Date
KR20190057402A KR20190057402A (ko) 2019-05-28
KR102293789B1 true KR102293789B1 (ko) 2021-08-24

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KR1020197013523A KR102293789B1 (ko) 2016-10-17 2017-10-17 검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화

Country Status (6)

Country Link
JP (1) JP6833027B2 (zh)
KR (1) KR102293789B1 (zh)
CN (1) CN109844919B (zh)
IL (1) IL265744B (zh)
SG (1) SG11201902745RA (zh)
TW (1) TWI752100B (zh)

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US10677586B2 (en) * 2018-07-27 2020-06-09 Kla-Tencor Corporation Phase revealing optical and X-ray semiconductor metrology
US11468553B2 (en) * 2018-11-02 2022-10-11 Kla Corporation System and method for determining type and size of defects on blank reticles
WO2020166076A1 (ja) * 2019-02-15 2020-08-20 株式会社日立ハイテク 構造推定システム、構造推定プログラム
TWI694250B (zh) * 2019-03-20 2020-05-21 英業達股份有限公司 表面缺陷偵測系統及其方法
US20230175981A1 (en) * 2020-06-12 2023-06-08 Hitachi High-Tech Corporation Method for Defect Inspection, System, and Computer-Readable Medium
KR102203222B1 (ko) * 2020-10-08 2021-01-14 (주)이랑텍 Ai 학습 기반 rf 필터 자동 튜닝 시스템 및 방법
CN116344378B (zh) * 2023-03-31 2024-01-23 江苏神州新能源电力有限公司 一种光伏板生产用智能检测系统及其检测方法
CN116666248B (zh) * 2023-07-26 2023-11-17 北京象帝先计算技术有限公司 测试结果异常确定方法、装置、电子设备及可读存储介质

Citations (2)

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JP2008082821A (ja) 2006-09-27 2008-04-10 Hitachi High-Technologies Corp 欠陥分類方法及びその装置並びに欠陥検査装置
US20150098655A1 (en) 2013-10-08 2015-04-09 National Tsing Hua University Method of Defect Image Classification through Integrating Image Analysis and Data Mining

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US7061601B2 (en) * 1999-07-02 2006-06-13 Kla-Tencor Technologies Corporation System and method for double sided optical inspection of thin film disks or wafers
US10043264B2 (en) * 2012-04-19 2018-08-07 Applied Materials Israel Ltd. Integration of automatic and manual defect classification
US8948494B2 (en) * 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples
US9518932B2 (en) * 2013-11-06 2016-12-13 Kla-Tencor Corp. Metrology optimized inspection
US9613411B2 (en) * 2014-03-17 2017-04-04 Kla-Tencor Corp. Creating defect classifiers and nuisance filters
US9286675B1 (en) * 2014-10-23 2016-03-15 Applied Materials Israel Ltd. Iterative defect filtering process
US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
CN106409711B (zh) * 2016-09-12 2019-03-12 佛山市南海区广工大数控装备协同创新研究院 一种太阳能硅晶片缺陷检测系统及方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008082821A (ja) 2006-09-27 2008-04-10 Hitachi High-Technologies Corp 欠陥分類方法及びその装置並びに欠陥検査装置
US20150098655A1 (en) 2013-10-08 2015-04-09 National Tsing Hua University Method of Defect Image Classification through Integrating Image Analysis and Data Mining

Also Published As

Publication number Publication date
JP6833027B2 (ja) 2021-02-24
KR20190057402A (ko) 2019-05-28
IL265744B (en) 2021-06-30
JP2020500422A (ja) 2020-01-09
CN109844919A (zh) 2019-06-04
TW201825883A (zh) 2018-07-16
CN109844919B (zh) 2020-12-11
SG11201902745RA (en) 2019-05-30
TWI752100B (zh) 2022-01-11
IL265744A (en) 2019-06-30

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