KR102293789B1 - 검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화 - Google Patents
검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화 Download PDFInfo
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- KR102293789B1 KR102293789B1 KR1020197013523A KR20197013523A KR102293789B1 KR 102293789 B1 KR102293789 B1 KR 102293789B1 KR 1020197013523 A KR1020197013523 A KR 1020197013523A KR 20197013523 A KR20197013523 A KR 20197013523A KR 102293789 B1 KR102293789 B1 KR 102293789B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N5/00—Computing arrangements using knowledge-based models
- G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Software Systems (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Computation (AREA)
- Artificial Intelligence (AREA)
- General Engineering & Computer Science (AREA)
- Computing Systems (AREA)
- Data Mining & Analysis (AREA)
- Mathematical Physics (AREA)
- Medical Informatics (AREA)
- Signal Processing (AREA)
- Computational Linguistics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Complex Calculations (AREA)
- Image Analysis (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN201641035490 | 2016-10-17 | ||
IN201641035490 | 2016-10-17 | ||
US201762477248P | 2017-03-27 | 2017-03-27 | |
US62/477,248 | 2017-03-27 | ||
US15/782,820 US10267748B2 (en) | 2016-10-17 | 2017-10-12 | Optimizing training sets used for setting up inspection-related algorithms |
US15/782,820 | 2017-10-12 | ||
PCT/US2017/057029 WO2018075547A1 (en) | 2016-10-17 | 2017-10-17 | Optimizing training sets used for setting up inspection-related algorithms |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190057402A KR20190057402A (ko) | 2019-05-28 |
KR102293789B1 true KR102293789B1 (ko) | 2021-08-24 |
Family
ID=66656811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197013523A KR102293789B1 (ko) | 2016-10-17 | 2017-10-17 | 검사 관련 알고리즘을 설정하는데 사용되는 트레이닝 세트의 최적화 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6833027B2 (zh) |
KR (1) | KR102293789B1 (zh) |
CN (1) | CN109844919B (zh) |
IL (1) | IL265744B (zh) |
SG (1) | SG11201902745RA (zh) |
TW (1) | TWI752100B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10677586B2 (en) * | 2018-07-27 | 2020-06-09 | Kla-Tencor Corporation | Phase revealing optical and X-ray semiconductor metrology |
US11468553B2 (en) * | 2018-11-02 | 2022-10-11 | Kla Corporation | System and method for determining type and size of defects on blank reticles |
KR102592253B1 (ko) * | 2019-02-15 | 2023-10-24 | 주식회사 히타치하이테크 | 구조 추정 시스템, 구조 추정 프로그램 |
TWI694250B (zh) * | 2019-03-20 | 2020-05-21 | 英業達股份有限公司 | 表面缺陷偵測系統及其方法 |
WO2021250884A1 (ja) * | 2020-06-12 | 2021-12-16 | 株式会社日立ハイテク | 欠陥検査のための方法、システム、及びコンピューター可読媒体 |
KR102203222B1 (ko) * | 2020-10-08 | 2021-01-14 | (주)이랑텍 | Ai 학습 기반 rf 필터 자동 튜닝 시스템 및 방법 |
CN116344378B (zh) * | 2023-03-31 | 2024-01-23 | 江苏神州新能源电力有限公司 | 一种光伏板生产用智能检测系统及其检测方法 |
CN116666248B (zh) * | 2023-07-26 | 2023-11-17 | 北京象帝先计算技术有限公司 | 测试结果异常确定方法、装置、电子设备及可读存储介质 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008082821A (ja) | 2006-09-27 | 2008-04-10 | Hitachi High-Technologies Corp | 欠陥分類方法及びその装置並びに欠陥検査装置 |
US20150098655A1 (en) | 2013-10-08 | 2015-04-09 | National Tsing Hua University | Method of Defect Image Classification through Integrating Image Analysis and Data Mining |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7061601B2 (en) * | 1999-07-02 | 2006-06-13 | Kla-Tencor Technologies Corporation | System and method for double sided optical inspection of thin film disks or wafers |
US10043264B2 (en) * | 2012-04-19 | 2018-08-07 | Applied Materials Israel Ltd. | Integration of automatic and manual defect classification |
US8948494B2 (en) * | 2012-11-12 | 2015-02-03 | Kla-Tencor Corp. | Unbiased wafer defect samples |
US9518932B2 (en) * | 2013-11-06 | 2016-12-13 | Kla-Tencor Corp. | Metrology optimized inspection |
US9613411B2 (en) * | 2014-03-17 | 2017-04-04 | Kla-Tencor Corp. | Creating defect classifiers and nuisance filters |
US9286675B1 (en) * | 2014-10-23 | 2016-03-15 | Applied Materials Israel Ltd. | Iterative defect filtering process |
US10012599B2 (en) * | 2015-04-03 | 2018-07-03 | Kla-Tencor Corp. | Optical die to database inspection |
CN106409711B (zh) * | 2016-09-12 | 2019-03-12 | 佛山市南海区广工大数控装备协同创新研究院 | 一种太阳能硅晶片缺陷检测系统及方法 |
-
2017
- 2017-10-17 TW TW106135435A patent/TWI752100B/zh active
- 2017-10-17 KR KR1020197013523A patent/KR102293789B1/ko active IP Right Grant
- 2017-10-17 JP JP2019520517A patent/JP6833027B2/ja active Active
- 2017-10-17 SG SG11201902745RA patent/SG11201902745RA/en unknown
- 2017-10-17 CN CN201780063543.XA patent/CN109844919B/zh active Active
-
2019
- 2019-04-01 IL IL265744A patent/IL265744B/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008082821A (ja) | 2006-09-27 | 2008-04-10 | Hitachi High-Technologies Corp | 欠陥分類方法及びその装置並びに欠陥検査装置 |
US20150098655A1 (en) | 2013-10-08 | 2015-04-09 | National Tsing Hua University | Method of Defect Image Classification through Integrating Image Analysis and Data Mining |
Also Published As
Publication number | Publication date |
---|---|
IL265744A (en) | 2019-06-30 |
JP6833027B2 (ja) | 2021-02-24 |
CN109844919A (zh) | 2019-06-04 |
SG11201902745RA (en) | 2019-05-30 |
JP2020500422A (ja) | 2020-01-09 |
IL265744B (en) | 2021-06-30 |
TW201825883A (zh) | 2018-07-16 |
CN109844919B (zh) | 2020-12-11 |
KR20190057402A (ko) | 2019-05-28 |
TWI752100B (zh) | 2022-01-11 |
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