SG11201900152SA - Retaining ring for cmp - Google Patents

Retaining ring for cmp

Info

Publication number
SG11201900152SA
SG11201900152SA SG11201900152SA SG11201900152SA SG11201900152SA SG 11201900152S A SG11201900152S A SG 11201900152SA SG 11201900152S A SG11201900152S A SG 11201900152SA SG 11201900152S A SG11201900152S A SG 11201900152SA SG 11201900152S A SG11201900152S A SG 11201900152SA
Authority
SG
Singapore
Prior art keywords
california
international
july
pct
publication
Prior art date
Application number
SG11201900152SA
Other languages
English (en)
Inventor
Andrew J Nagengast
Christopher Heung-Gyun Lee
Thomas Li
Anand N Iyer
Jie Diao
Huanbo Zhang
Erik S Rondum
Wei-Cheng Lee
Jeonghoon Oh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201900152SA publication Critical patent/SG11201900152SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Dental Preparations (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
SG11201900152SA 2016-07-25 2017-07-24 Retaining ring for cmp SG11201900152SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662366550P 2016-07-25 2016-07-25
PCT/US2017/043551 WO2018022520A2 (en) 2016-07-25 2017-07-24 Retaining ring for cmp

Publications (1)

Publication Number Publication Date
SG11201900152SA true SG11201900152SA (en) 2019-02-27

Family

ID=60989741

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201900152SA SG11201900152SA (en) 2016-07-25 2017-07-24 Retaining ring for cmp

Country Status (7)

Country Link
US (2) US10322492B2 (zh)
JP (2) JP7329438B2 (zh)
KR (2) KR102420066B1 (zh)
CN (2) CN109475997B (zh)
SG (1) SG11201900152SA (zh)
TW (3) TWI740989B (zh)
WO (1) WO2018022520A2 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7329438B2 (ja) 2016-07-25 2023-08-18 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ用の保持リング
KR102622055B1 (ko) * 2018-11-20 2024-01-09 삼성전자주식회사 에지 링의 패드 부착 방법 및 장치
CN112548846B (zh) 2019-09-25 2022-10-28 夏泰鑫半导体(青岛)有限公司 用于化学机械研磨之固定环
CN111482893A (zh) * 2020-04-16 2020-08-04 华海清科股份有限公司 一种化学机械抛光保持环和化学机械抛光承载头
WO2022010687A1 (en) * 2020-07-08 2022-01-13 Applied Materials, Inc. Multi-toothed, magnetically controlled retaining ring
US20220055181A1 (en) * 2020-08-21 2022-02-24 Applied Materials, Inc. Retaining ring design

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3085480B2 (ja) 1991-10-02 2000-09-11 セイコーエプソン株式会社 ホルモン徐放性コンタクトレンズ
TW295560B (en) * 1995-08-09 1997-01-11 Speedfan Corp Retaining ring for polishing device
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6267643B1 (en) * 1999-08-03 2001-07-31 Taiwan Semiconductor Manufacturing Company, Ltd Slotted retaining ring for polishing head and method of using
JP3085480U (ja) * 2001-10-19 2002-05-10 弘沂 許 ウエハー維持リング
JP2004268194A (ja) 2003-03-07 2004-09-30 Seiko Epson Corp 研磨装置、研磨用ガイドリングおよび研磨用ガイドリングの磨耗判定方法
US6821192B1 (en) * 2003-09-19 2004-11-23 Applied Materials, Inc. Retaining ring for use in chemical mechanical polishing
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
KR20050064316A (ko) * 2003-12-23 2005-06-29 주식회사 하이닉스반도체 화학적 기계적 연마장치의 리테이너링
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
EP1899110A2 (en) 2005-05-24 2008-03-19 Entegris, Inc. Cmp retaining ring
US7520795B2 (en) * 2005-08-30 2009-04-21 Applied Materials, Inc. Grooved retaining ring
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
JP2008177248A (ja) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd 研磨ヘッド用リテーナリング
US8033895B2 (en) 2007-07-19 2011-10-11 Applied Materials, Inc. Retaining ring with shaped profile
KR101775464B1 (ko) * 2011-05-31 2017-09-07 삼성전자주식회사 화학 기계적 연마 장치의 리테이너 링
KR20140054178A (ko) * 2011-08-05 2014-05-08 어플라이드 머티어리얼스, 인코포레이티드 두 부분으로 이루어진 플라스틱 리테이닝 링
US20140224766A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Groove Design for Retaining Ring
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
JP2015123532A (ja) 2013-12-26 2015-07-06 株式会社東芝 リテーナリング、研磨装置および研磨方法
US9368371B2 (en) * 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
CN204183389U (zh) * 2014-09-26 2015-03-04 唐中维 适用于半导体晶圆研磨抛光用的固定环结构
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
JP7329438B2 (ja) 2016-07-25 2023-08-18 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ用の保持リング

Also Published As

Publication number Publication date
US20190291238A1 (en) 2019-09-26
KR20220101766A (ko) 2022-07-19
WO2018022520A3 (en) 2018-07-26
WO2018022520A2 (en) 2018-02-01
TW201806698A (zh) 2018-03-01
US10322492B2 (en) 2019-06-18
CN113997194A (zh) 2022-02-01
CN109475997B (zh) 2021-11-26
TWI818306B (zh) 2023-10-11
TW202338965A (zh) 2023-10-01
KR20190022915A (ko) 2019-03-06
CN109475997A (zh) 2019-03-15
TW202200309A (zh) 2022-01-01
JP2019523146A (ja) 2019-08-22
CN113997194B (zh) 2024-04-05
KR102561746B1 (ko) 2023-07-28
KR102420066B1 (ko) 2022-07-11
US20180021918A1 (en) 2018-01-25
US11673226B2 (en) 2023-06-13
JP2023166383A (ja) 2023-11-21
JP7329438B2 (ja) 2023-08-18
TWI740989B (zh) 2021-10-01

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