SG11201900139RA - Thermally optimized rings - Google Patents
Thermally optimized ringsInfo
- Publication number
- SG11201900139RA SG11201900139RA SG11201900139RA SG11201900139RA SG11201900139RA SG 11201900139R A SG11201900139R A SG 11201900139RA SG 11201900139R A SG11201900139R A SG 11201900139RA SG 11201900139R A SG11201900139R A SG 11201900139RA SG 11201900139R A SG11201900139R A SG 11201900139RA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- annular body
- pct
- hollow inner
- inner cavities
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Devices Affording Protection Of Roads Or Walls For Sound Insulation (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property MD HIM 0 11101 010 11111 01 II 0 0111E011H 010 IRMO 11110 ill 011 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\"\"1 WO 2018/031200 Al 15 February 2018 (15.02.2018) WIP0 I PCT (51) International Patent Classification: (74) Agent: PATTERSON, B. Todd et al.; Patterson & Sheri- HOM 37/32 (2006.01) C23C 14/34 (2006.01) dan, L.L.P., 24 Greenway Plaza, Suite 1600, Houston, C23C 14/56 (2006.01) Texas 77046 (US). (21) International Application Number: (81) Designated States (unless otherwise indicated, for every PCT/US2017/042493 kind of national protection available): AE, AG, AL, AM, (22) International Filing Date: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, 18 July 2017 (18.07.2017) CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, (25) Filing Language: English HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, (26) Publication Language: English KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (30) Priority Data: OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, 15/233,613 10 August 2016 (10.08.2016) US SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (72) Inventors: SHEELAVANT, Gangadhar; 1353A, Ward GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, No. 3, Sheelavant Street, Guledgudd 587203 (IN). BADU- UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, VAMANDA, Cariappa Achappa; #103, Sunshine Apart-TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, ments, East End D Main Road, 9th Block, Jayanagar, Ban- EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, galore 560069 (IN). VASANTHA, Bopanna Ichettira; MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, = #15, 3rd Cross, 4th Block, Kumara Park West, Bangalore — TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, 560020 (IN). KM, ML, MR, NE, SN, TD, TG). = (54) Title: THERMALLY OPTIMIZED RINGS (57) : A process kit ring for use in a plasma processing system = loo 134 \ --, 131 is disclosed herein. The process kit ring includes an annular body and one \ or more hollow inner cavities. The annular body is formed from a plasma 110 The body has an outer diameter I resistant material. annular greater than = \\\\\\\\\\\\\ 200 mm. The annular body includes a top surface and a bottom surface. — 136 ---\".- = ' The top is to face a plasma processing region of a — — = _ _ = —, 4., \ = 132 --- le ) 128 154 112 / --150 156 101 126 Ti — ' \ ---104 surface configured process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. 106 The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged = , 130 — = IS -- r - 71 \ in a circle within the annular body. — 2 10 = 152 ' ;r . '\" 180 . 1'\"A : i / *k X Vc-ri 122 kr r ,' — 11 71 20 124 111 114 118 . \ 116 W8 144 X /1 / / / / 142 © t. © ei 140 GO ,-1 M O_ FIG. 1 1-1 0 ei O [Continued on next page] WO 2018/031200 Al MIDEDIMOMMIDEFIEHEIDEMIDIONIMOVOIS Published: — with international search report (Art. 21(3))
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/233,613 US10435784B2 (en) | 2016-08-10 | 2016-08-10 | Thermally optimized rings |
PCT/US2017/042493 WO2018031200A1 (en) | 2016-08-10 | 2017-07-18 | Thermally optimized rings |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201900139RA true SG11201900139RA (en) | 2019-02-27 |
Family
ID=61160139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201900139RA SG11201900139RA (en) | 2016-08-10 | 2017-07-18 | Thermally optimized rings |
Country Status (6)
Country | Link |
---|---|
US (2) | US10435784B2 (en) |
KR (1) | KR102157819B1 (en) |
CN (1) | CN109478491B (en) |
SG (1) | SG11201900139RA (en) |
TW (1) | TWI746601B (en) |
WO (1) | WO2018031200A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102565805B1 (en) * | 2018-10-30 | 2023-08-10 | 가부시키가이샤 알박 | vacuum processing unit |
USD931240S1 (en) | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
US20210035851A1 (en) * | 2019-07-30 | 2021-02-04 | Applied Materials, Inc. | Low contact area substrate support for etching chamber |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5685914A (en) * | 1994-04-05 | 1997-11-11 | Applied Materials, Inc. | Focus ring for semiconductor wafer processing in a plasma reactor |
US5891350A (en) * | 1994-12-15 | 1999-04-06 | Applied Materials, Inc. | Adjusting DC bias voltage in plasma chambers |
US6206976B1 (en) * | 1999-08-27 | 2001-03-27 | Lucent Technologies Inc. | Deposition apparatus and related method with controllable edge exclusion |
US20050048876A1 (en) | 2003-09-02 | 2005-03-03 | Applied Materials, Inc. | Fabricating and cleaning chamber components having textured surfaces |
US20060138925A1 (en) | 2004-12-28 | 2006-06-29 | Yi-Fang Cheng | Plasma processing device having a ring-shaped air chamber for heat dissipation |
US9127362B2 (en) * | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US7355192B2 (en) | 2006-03-30 | 2008-04-08 | Intel Corporation | Adjustable suspension assembly for a collimating lattice |
US8522715B2 (en) * | 2008-01-08 | 2013-09-03 | Lam Research Corporation | Methods and apparatus for a wide conductance kit |
JP5350043B2 (en) * | 2009-03-31 | 2013-11-27 | 東京エレクトロン株式会社 | Plasma processing apparatus and plasma processing method |
JP5601794B2 (en) * | 2009-05-29 | 2014-10-08 | 株式会社東芝 | Plasma etching equipment |
CN103140913B (en) * | 2010-10-29 | 2016-09-28 | 应用材料公司 | Deposition ring and electrostatic chuck for physical vapor deposition chamber |
US9682398B2 (en) * | 2012-03-30 | 2017-06-20 | Applied Materials, Inc. | Substrate processing system having susceptorless substrate support with enhanced substrate heating control |
US9863648B2 (en) * | 2013-02-21 | 2018-01-09 | Benjamin J. Weinraub | Equipment protector with buoyant rim |
EP2984674B1 (en) | 2013-04-08 | 2018-06-06 | Oerlikon Surface Solutions AG, Pfäffikon | Sputtering target having increased power compatibility |
US9293304B2 (en) | 2013-12-17 | 2016-03-22 | Applied Materials, Inc. | Plasma thermal shield for heat dissipation in plasma chamber |
US20160155657A1 (en) * | 2014-12-02 | 2016-06-02 | Applied Materials, Inc. | Surface profile modifications for extended life of consumable parts in semiconductor processing equipment |
KR102401501B1 (en) | 2014-12-19 | 2022-05-23 | 어플라이드 머티어리얼스, 인코포레이티드 | Edge ring for substrate processing chamber |
KR20180082509A (en) * | 2015-12-07 | 2018-07-18 | 어플라이드 머티어리얼스, 인코포레이티드 | Merge type cover ring |
-
2016
- 2016-08-10 US US15/233,613 patent/US10435784B2/en active Active
-
2017
- 2017-07-18 WO PCT/US2017/042493 patent/WO2018031200A1/en active Application Filing
- 2017-07-18 CN CN201780044368.XA patent/CN109478491B/en active Active
- 2017-07-18 KR KR1020197005795A patent/KR102157819B1/en active IP Right Grant
- 2017-07-18 SG SG11201900139RA patent/SG11201900139RA/en unknown
- 2017-07-25 TW TW106124826A patent/TWI746601B/en active
-
2019
- 2019-06-19 US US16/446,188 patent/US20190301007A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN109478491A (en) | 2019-03-15 |
WO2018031200A1 (en) | 2018-02-15 |
US20180044783A1 (en) | 2018-02-15 |
US10435784B2 (en) | 2019-10-08 |
CN109478491B (en) | 2021-02-09 |
KR102157819B1 (en) | 2020-09-18 |
US20190301007A1 (en) | 2019-10-03 |
TW201829816A (en) | 2018-08-16 |
TWI746601B (en) | 2021-11-21 |
KR20190025050A (en) | 2019-03-08 |
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