SG11201808997TA - Aqueous solution and process for removing substances from substrates - Google Patents

Aqueous solution and process for removing substances from substrates

Info

Publication number
SG11201808997TA
SG11201808997TA SG11201808997TA SG11201808997TA SG11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA
Authority
SG
Singapore
Prior art keywords
international
pct
substrates
substances
solution
Prior art date
Application number
SG11201808997TA
Other languages
English (en)
Inventor
Richard Peters
Travis Acra
Kimberly Pollard
Original Assignee
Versum Materials Us Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Versum Materials Us Llc filed Critical Versum Materials Us Llc
Publication of SG11201808997TA publication Critical patent/SG11201808997TA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Detergent Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201808997TA 2016-04-12 2017-03-21 Aqueous solution and process for removing substances from substrates SG11201808997TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/096,362 US10073352B2 (en) 2016-04-12 2016-04-12 Aqueous solution and process for removing substances from substrates
PCT/US2017/023301 WO2017180293A1 (fr) 2016-04-12 2017-03-21 Solution aqueuse et procédé d'élimination de substances de substrats

Publications (1)

Publication Number Publication Date
SG11201808997TA true SG11201808997TA (en) 2018-11-29

Family

ID=59999361

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808997TA SG11201808997TA (en) 2016-04-12 2017-03-21 Aqueous solution and process for removing substances from substrates

Country Status (7)

Country Link
US (1) US10073352B2 (fr)
EP (1) EP3443418B1 (fr)
JP (1) JP6942722B2 (fr)
KR (1) KR102214372B1 (fr)
CN (1) CN109313399B (fr)
SG (1) SG11201808997TA (fr)
WO (1) WO2017180293A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102029442B1 (ko) * 2018-01-04 2019-10-08 삼성전기주식회사 드라이필름 레지스트 제거용 박리조성물 및 이를 이용한 드라이필름 레지스트의 박리방법
US11054749B2 (en) * 2018-05-22 2021-07-06 Versum Materials Us, Llc Photoresist stripping composition and method
JPWO2021201047A1 (fr) * 2020-03-31 2021-10-07

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2906590B2 (ja) 1990-06-14 1999-06-21 三菱瓦斯化学株式会社 アルミニウム配線半導体基板の表面処理剤
WO1995004372A1 (fr) 1993-07-30 1995-02-09 Semitool, Inc. Procede de traitement des semi-conducteurs pour eliminer les particules de leur surface
US5780406A (en) 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US6599370B2 (en) 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
TW554258B (en) 2000-11-30 2003-09-21 Tosoh Corp Resist stripper
AU2003225178A1 (en) 2002-04-24 2003-11-10 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
JP2004101849A (ja) * 2002-09-09 2004-04-02 Mitsubishi Gas Chem Co Inc 洗浄剤組成物
US8338087B2 (en) 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US20060094613A1 (en) * 2004-10-29 2006-05-04 Lee Wai M Compositions and processes for photoresist stripping and residue removal in wafer level packaging
JP5600376B2 (ja) * 2005-01-27 2014-10-01 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 半導体基材の処理のための組成物
JP2008166404A (ja) 2006-12-27 2008-07-17 Siltronic Ag 疎水性シリコンウエハ用洗浄水及びそれを用いた洗浄方法
JP2009075285A (ja) 2007-09-20 2009-04-09 Fujifilm Corp 半導体デバイスの剥離液、及び、剥離方法
US20090120457A1 (en) * 2007-11-09 2009-05-14 Surface Chemistry Discoveries, Inc. Compositions and method for removing coatings and preparation of surfaces for use in metal finishing, and manufacturing of electronic and microelectronic devices
US20090241988A1 (en) 2008-03-31 2009-10-01 Intel Corporation Photoresist and antireflective layer removal solution and method thereof
US8183162B2 (en) 2008-09-12 2012-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a sacrificial layer
JP5399308B2 (ja) 2010-03-30 2014-01-29 Ｊｘ日鉱日石金属株式会社 半導体ウエハ上への無電解めっきの前処理液、無電解めっき方法、及び半導体装置
JP5498843B2 (ja) 2010-04-15 2014-05-21 富士フイルム株式会社 ２剤型半導体基板用洗浄剤
JP5289411B2 (ja) 2010-10-27 2013-09-11 富士フイルム株式会社 多剤型半導体基板用洗浄剤、それを用いた洗浄方法及び半導体素子の製造方法
EP2683604B1 (fr) 2011-03-11 2016-11-23 Single Buoy Moorings, Inc. Système d'amortissement de fourche
US20130200040A1 (en) 2012-01-04 2013-08-08 International Business Machines Corporation Titanium nitride removal
US20140137899A1 (en) * 2012-11-21 2014-05-22 Dynaloy, Llc Process for removing substances from substrates
US9158202B2 (en) * 2012-11-21 2015-10-13 Dynaloy, Llc Process and composition for removing substances from substrates
CN103869636A (zh) * 2012-12-17 2014-06-18 安集微电子科技(上海)有限公司 一种光刻胶去除剂
US9291910B2 (en) * 2013-09-27 2016-03-22 Dynaloy, Llc Aqueous solution and process for removing substances from substrates

Also Published As

Publication number Publication date
JP6942722B2 (ja) 2021-09-29
CN109313399B (zh) 2021-11-05
JP2019516130A (ja) 2019-06-13
US10073352B2 (en) 2018-09-11
EP3443418A1 (fr) 2019-02-20
KR20180130570A (ko) 2018-12-07
KR102214372B1 (ko) 2021-02-08
EP3443418A4 (fr) 2019-09-11
WO2017180293A1 (fr) 2017-10-19
US20170293228A1 (en) 2017-10-12
CN109313399A (zh) 2019-02-05
EP3443418B1 (fr) 2022-02-09

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