SG11201808997TA - Aqueous solution and process for removing substances from substrates - Google Patents

Aqueous solution and process for removing substances from substrates

Info

Publication number
SG11201808997TA
SG11201808997TA SG11201808997TA SG11201808997TA SG11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA SG 11201808997T A SG11201808997T A SG 11201808997TA
Authority
SG
Singapore
Prior art keywords
international
pct
substrates
substances
solution
Prior art date
Application number
SG11201808997TA
Inventor
Richard Peters
Travis Acra
Kimberly Pollard
Original Assignee
Versum Materials Us Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Versum Materials Us Llc filed Critical Versum Materials Us Llc
Publication of SG11201808997TA publication Critical patent/SG11201808997TA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Detergent Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -, Organization 111111110111101110101011111 HO 11111 01E3 1110 1101 OH Mil RIRIE MI International Bureau .. .... ..Yejd (10) International Publication Number (43) International Publication Date ..... .....1 WO 2017/180293 Al 19 October 2017(19.10.2017) WIPO I PCT (51) International Patent Classification: (81) Designated States (unless otherwise indicated, for every GO3F 7/42 (2006.01) Cl 1D 1/10 (2006.01) kind C11D 1/04 (2006.01) C11D 1/40 (2006.01) AO, of national protection available): AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, C11D 1/08 (2006.01) Cl 1D 1/42 (2006.01) BZ, DO, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, (21) International Application Number: HN, PCT/US2017/023301 KP, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, (22) International Filing Date: MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, 21 March 2017 (21.03.2017) NI, RU, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, (25) Filing Language: English TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, (26) Publication Language: English ZA, ZM, ZW. (30) Priority Data: (84) Designated States (unless otherwise indicated, for every 15/096,362 12 April 2016 (12.04.2016) US kind GM, of regional protection available): ARIPO (BW, GH, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, (71) Applicant: DYNALOY, LLC [US/US]; 200 South Wil- TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, cox Drive, Kingsport, TN 37660 (US). TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, (72) Inventors: PETERS, Richard, Dalton; 14902 Warner DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, — LV, Trail, Westfield, IN 46074 (US). ACRA, Travis, W.; 8612 SM, 200 W, Fortville, IN 46040 (US). POLLARD, Kimberly, Dona; 1699 Mink Court, Pendleton, IN 46064 (US). GW, KM, ML, MR, NE, SN, TD, TG). MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, Published: (74) Agent: SMITH, Matthew, W.; P.O.Box 511, Kingsport, = TN 37662-5075 (US). — with international search report (Art. 21(3)) = = = = = = = = = = = Il M C:7 ei © cc ,-1 IN 1-1 (54) Title: AQUEOUS SOLUTION AND PROCESS FOR REMOVING SUBSTANCES FROM SUBSTRATES 0 ei (57) : The disclosure is directed solutions and processes to remove substances from substrates. In some cases, the sub- stances can include photoresist on semiconductor wafers. The solution can include a quaternary ammonium hydroxide an amine, and optionally a corrosion inhibitor and /or a sugar alcohol. One or more sides of the substrate can be contacted with the solution to re - 5 , - move one or more substances from the substrate.
SG11201808997TA 2016-04-12 2017-03-21 Aqueous solution and process for removing substances from substrates SG11201808997TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/096,362 US10073352B2 (en) 2016-04-12 2016-04-12 Aqueous solution and process for removing substances from substrates
PCT/US2017/023301 WO2017180293A1 (en) 2016-04-12 2017-03-21 Aqueous solution and process for removing substances from substrates

Publications (1)

Publication Number Publication Date
SG11201808997TA true SG11201808997TA (en) 2018-11-29

Family

ID=59999361

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808997TA SG11201808997TA (en) 2016-04-12 2017-03-21 Aqueous solution and process for removing substances from substrates

Country Status (7)

Country Link
US (1) US10073352B2 (en)
EP (1) EP3443418B1 (en)
JP (1) JP6942722B2 (en)
KR (1) KR102214372B1 (en)
CN (1) CN109313399B (en)
SG (1) SG11201808997TA (en)
WO (1) WO2017180293A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102029442B1 (en) * 2018-01-04 2019-10-08 삼성전기주식회사 Stripping composition for removing dryfilm resist and stripping method using the same
US11054749B2 (en) * 2018-05-22 2021-07-06 Versum Materials Us, Llc Photoresist stripping composition and method
CN115362246A (en) * 2020-03-31 2022-11-18 日产化学株式会社 Cleaning agent composition and method for producing processed semiconductor substrate

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2906590B2 (en) 1990-06-14 1999-06-21 三菱瓦斯化学株式会社 Surface treatment agent for aluminum wiring semiconductor substrate
AU7221294A (en) 1993-07-30 1995-02-28 Semitool, Inc. Methods for processing semiconductors to reduce surface particles
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US6599370B2 (en) 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
EP1211563B1 (en) 2000-11-30 2011-12-21 Tosoh Corporation Resist stripper composition
WO2003091376A1 (en) 2002-04-24 2003-11-06 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
JP2004101849A (en) * 2002-09-09 2004-04-02 Mitsubishi Gas Chem Co Inc Detergent composition
US8338087B2 (en) 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US20060094613A1 (en) * 2004-10-29 2006-05-04 Lee Wai M Compositions and processes for photoresist stripping and residue removal in wafer level packaging
WO2006081406A1 (en) * 2005-01-27 2006-08-03 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
JP2008166404A (en) 2006-12-27 2008-07-17 Siltronic Ag Wash water for hydrophobic silicon wafer, and cleaning method using the same
JP2009075285A (en) 2007-09-20 2009-04-09 Fujifilm Corp Stripper for semiconductor device and stripping method
US20090120457A1 (en) * 2007-11-09 2009-05-14 Surface Chemistry Discoveries, Inc. Compositions and method for removing coatings and preparation of surfaces for use in metal finishing, and manufacturing of electronic and microelectronic devices
US20090241988A1 (en) 2008-03-31 2009-10-01 Intel Corporation Photoresist and antireflective layer removal solution and method thereof
US8183162B2 (en) 2008-09-12 2012-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a sacrificial layer
JP5399308B2 (en) 2010-03-30 2014-01-29 Ｊｘ日鉱日石金属株式会社 Pretreatment liquid for electroless plating on semiconductor wafer, electroless plating method, and semiconductor device
JP5498843B2 (en) * 2010-04-15 2014-05-21 富士フイルム株式会社 Two-agent type semiconductor substrate cleaning agent
JP5289411B2 (en) * 2010-10-27 2013-09-11 富士フイルム株式会社 Multi-agent type semiconductor substrate cleaning agent, cleaning method using the same, and semiconductor device manufacturing method
WO2012123191A1 (en) 2011-03-11 2012-09-20 Single Buoy Moorings Inc. Yoke damping system
US20130200040A1 (en) 2012-01-04 2013-08-08 International Business Machines Corporation Titanium nitride removal
US20140137899A1 (en) * 2012-11-21 2014-05-22 Dynaloy, Llc Process for removing substances from substrates
US9158202B2 (en) * 2012-11-21 2015-10-13 Dynaloy, Llc Process and composition for removing substances from substrates
CN103869636A (en) * 2012-12-17 2014-06-18 安集微电子科技(上海)有限公司 Photoresist remover
US9291910B2 (en) * 2013-09-27 2016-03-22 Dynaloy, Llc Aqueous solution and process for removing substances from substrates

Also Published As

Publication number Publication date
JP6942722B2 (en) 2021-09-29
KR20180130570A (en) 2018-12-07
EP3443418A1 (en) 2019-02-20
WO2017180293A1 (en) 2017-10-19
EP3443418B1 (en) 2022-02-09
KR102214372B1 (en) 2021-02-08
US10073352B2 (en) 2018-09-11
CN109313399B (en) 2021-11-05
JP2019516130A (en) 2019-06-13
CN109313399A (en) 2019-02-05
US20170293228A1 (en) 2017-10-12
EP3443418A4 (en) 2019-09-11

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