SG11201808579TA - Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device - Google Patents

Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device

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Publication number
SG11201808579TA
SG11201808579TA SG11201808579TA SG11201808579TA SG11201808579TA SG 11201808579T A SG11201808579T A SG 11201808579TA SG 11201808579T A SG11201808579T A SG 11201808579TA SG 11201808579T A SG11201808579T A SG 11201808579TA SG 11201808579T A SG11201808579T A SG 11201808579TA
Authority
SG
Singapore
Prior art keywords
particles
mass
copper particles
copper
manufacturing
Prior art date
Application number
SG11201808579TA
Other languages
English (en)
Inventor
Yuki Kawana
Hideo Nakako
Dai Ishikawa
Chie Sugama
Kazuhiko Kurafuchi
Yoshinori Ejiri
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11201808579TA publication Critical patent/SG11201808579TA/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
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    • B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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    • H01L2224/29163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

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  • Manufacturing & Machinery (AREA)
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SG11201808579TA 2016-04-28 2017-04-20 Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device SG11201808579TA (en)

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WO2019123856A1 (fr) * 2017-12-18 2019-06-27 Dic株式会社 Corps fritté de particules fines de cuivre
JP7093945B2 (ja) * 2018-02-28 2022-07-01 公立大学法人大阪 ナノ銀ペーストを用いた半導体チップ接合方法
JP7187835B2 (ja) * 2018-06-19 2022-12-13 昭和電工マテリアルズ株式会社 導体形成用組成物及びその製造方法、並びに、導体層を有する物品及びその製造方法
CN110729445A (zh) * 2018-07-16 2020-01-24 深圳先进技术研究院 具有涂层的极耳及其制备方法、电芯、电池和电动工具
JP7127407B2 (ja) * 2018-07-25 2022-08-30 昭和電工マテリアルズ株式会社 接合用金属ペースト、接合体及び接合体の製造方法
JP6526889B1 (ja) * 2018-08-01 2019-06-05 Ｊｘ金属株式会社 セラミックス層と銅粉ペースト焼結体の積層体
JP6526888B1 (ja) * 2018-08-01 2019-06-05 Ｊｘ金属株式会社 セラミックス層と銅粉ペースト焼結体の積層体
CN113166945B (zh) * 2018-11-29 2024-01-02 株式会社力森诺科 接合体及半导体装置的制造方法
KR102368533B1 (ko) * 2019-04-23 2022-03-02 주식회사 경동엠텍 레이저 소결에 의한 반도체 칩의 접합방법
KR102258498B1 (ko) * 2019-04-23 2021-06-01 주식회사 경동엠텍 레이저 소결에 의한 반도체 칩의 접합방법
JP2021036067A (ja) * 2019-08-30 2021-03-04 昭和電工マテリアルズ株式会社 物品の製造方法及び金属焼結体層形成用組成物
JPWO2021060204A1 (fr) * 2019-09-25 2021-04-01
JP7463681B2 (ja) 2019-09-30 2024-04-09 株式会社レゾナック 接合体の製造方法及び接合体
US20220371087A1 (en) 2019-09-30 2022-11-24 Showa Denko Materials Co., Ltd. Copper paste for joining, method for manufacturing joined body, and joined body
JP7391678B2 (ja) * 2020-01-24 2023-12-05 大陽日酸株式会社 接合材
JP7508802B2 (ja) 2020-02-14 2024-07-02 株式会社レゾナック 接合用金属ペースト、接合体、半導体装置、及び接合体の製造方法
CN116275058A (zh) * 2023-03-28 2023-06-23 哈尔滨工业大学 一种微纳米合金接头的多场耦合快速制备方法

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JP6199048B2 (ja) 2013-02-28 2017-09-20 国立大学法人大阪大学 接合材
JP6061248B2 (ja) * 2013-03-29 2017-01-18 国立研究開発法人産業技術総合研究所 接合方法及び半導体モジュールの製造方法
JP2015109434A (ja) * 2013-10-23 2015-06-11 日立化成株式会社 ダイボンド層付き半導体素子搭載用支持部材、ダイボンド層付き半導体素子及びダイボンド層付き接合板

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CN109070206A (zh) 2018-12-21
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TW201739927A (zh) 2017-11-16
TWI743112B (zh) 2021-10-21
EP3450053A1 (fr) 2019-03-06
US10748865B2 (en) 2020-08-18
JPWO2017188123A1 (ja) 2019-03-07
MY194769A (en) 2022-12-15
WO2017188123A1 (fr) 2017-11-02
KR20190003516A (ko) 2019-01-09
EP3450053A4 (fr) 2019-12-25
JP6866893B2 (ja) 2021-04-28

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