SG11201807274RA - Flip chip bonding device and bonding method - Google Patents
Flip chip bonding device and bonding methodInfo
- Publication number
- SG11201807274RA SG11201807274RA SG11201807274RA SG11201807274RA SG11201807274RA SG 11201807274R A SG11201807274R A SG 11201807274RA SG 11201807274R A SG11201807274R A SG 11201807274RA SG 11201807274R A SG11201807274R A SG 11201807274RA SG 11201807274R A SG11201807274R A SG 11201807274RA
- Authority
- SG
- Singapore
- Prior art keywords
- flip
- bonding
- unit
- chips
- transfer unit
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53252—Means to simultaneously fasten three or more parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Operations Research (AREA)
- Wire Bonding (AREA)
Abstract
Disclosed is a flip chip bonding device and a bonding method. The bonding device comprises: a supply unit () configured to separate a flip-chip (200) from a carrier (100) and to provide the flip-chip (200), and comprising a flipping device (11); a transfer unit (20) configured to receive the flip-chip (200) from the flipping device (11); a position adjustment unit (30) configured to adjust the position of the flip-chips (200) on the transfer unit (20); a bonding unit (40) configured to bond the flip-chips (200) on the transfer unit (20) to a substrate (400); a transport unit (50) configured to transport the transfer unit (20); and a control unit (60) configured to control the movement of each of the units. Since the transfer unit (20) can handle multiple flip-chips (200), the present invention can complete bonding of multiple flip-chips (200) at one time, thereby saving bonding time and increasing bonding efficiency. In addition, the transfer unit (20) passes through the position adjustment unit (30) during transport, and the position adjustment unit (30) adjusts the position of the flip-chips (200) on the transfer unit (20) so as to ensure accurate positioning of the flip-chips (200) during the subsequent bonding process, achieving highly accurate bonding. 27
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610113099.5A CN107134418B (en) | 2016-02-29 | 2016-02-29 | Flip chip bonding device and bonding method |
PCT/CN2017/075033 WO2017148353A1 (en) | 2016-02-29 | 2017-02-27 | Flip chip bonding device and bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201807274RA true SG11201807274RA (en) | 2018-09-27 |
Family
ID=59720760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201807274RA SG11201807274RA (en) | 2016-02-29 | 2017-02-27 | Flip chip bonding device and bonding method |
Country Status (8)
Country | Link |
---|---|
US (1) | US10903105B2 (en) |
EP (1) | EP3425662B1 (en) |
JP (1) | JP6712648B2 (en) |
KR (1) | KR102088376B1 (en) |
CN (1) | CN107134418B (en) |
SG (1) | SG11201807274RA (en) |
TW (1) | TWI612604B (en) |
WO (1) | WO2017148353A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113345826A (en) * | 2021-05-31 | 2021-09-03 | 深圳市三联盛科技股份有限公司 | Three-dimensional packaging structure with flip bump chips stacked mutually |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107887294B (en) * | 2016-09-30 | 2020-04-10 | 上海微电子装备(集团)股份有限公司 | Chip universal batch bonding device and method |
US10684118B1 (en) * | 2019-04-09 | 2020-06-16 | Asm Technology Singapore Pte Ltd | Apparatus for determining an orientation of a die |
CN112967949B (en) * | 2020-08-11 | 2022-05-20 | 重庆康佳光电技术研究院有限公司 | Transfer member, transfer device and transfer method |
CN113471126B (en) * | 2021-06-29 | 2022-05-17 | 深圳新益昌科技股份有限公司 | Accurate die bonder |
CN117594500B (en) * | 2024-01-19 | 2024-05-07 | 浙江集迈科微电子有限公司 | Chip hot-press bonding device and method |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3504166B2 (en) * | 1998-11-25 | 2004-03-08 | 株式会社新川 | Flip chip bonding equipment |
SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
JP4064795B2 (en) | 2002-11-28 | 2008-03-19 | 松下電器産業株式会社 | Electronic component mounting equipment |
JP4691923B2 (en) | 2004-07-30 | 2011-06-01 | 株式会社日立製作所 | Equipment for mounting semiconductor devices |
JP4595740B2 (en) * | 2005-08-16 | 2010-12-08 | パナソニック株式会社 | Chip inversion device, chip inversion method, and chip mounting device |
KR20100093553A (en) * | 2007-12-03 | 2010-08-25 | 파나소닉 주식회사 | Chip mounting system |
JP4946989B2 (en) | 2008-07-07 | 2012-06-06 | パナソニック株式会社 | Electronic component bonding equipment |
CN201522998U (en) | 2009-11-06 | 2010-07-07 | 华中科技大学 | Chip pickup and overturn device |
JP5358529B2 (en) | 2010-07-23 | 2013-12-04 | ヤマハ発動機株式会社 | Mounting machine |
JP5989313B2 (en) * | 2011-09-15 | 2016-09-07 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
KR20130079031A (en) * | 2012-01-02 | 2013-07-10 | 삼성전자주식회사 | Apparatus for mounting semiconductor chip |
CN103576467B (en) | 2012-08-10 | 2016-02-03 | 上海微电子装备有限公司 | A kind of alignment device and alignment methods |
KR101425613B1 (en) | 2013-03-28 | 2014-08-01 | 한미반도체 주식회사 | Flip chip bonding apparatus and flip chip bonding method |
CN104183527A (en) | 2013-05-28 | 2014-12-03 | 北京中电科电子装备有限公司 | Workpiece bonding system |
CN103367208B (en) | 2013-07-02 | 2015-10-28 | 华中科技大学 | A kind of back bonding platform for superchip |
KR101456138B1 (en) | 2013-11-14 | 2014-11-03 | (주)정원기술 | Chip supplying device for laser chip bonder |
JP2015130414A (en) | 2014-01-08 | 2015-07-16 | 東レエンジニアリング株式会社 | Automatic bonding device |
SE538792C2 (en) * | 2015-02-06 | 2016-11-29 | Stora Enso Oyj | Apparatus and method for component assembly |
CN104701199B (en) | 2015-03-20 | 2018-03-13 | 北京中电科电子装备有限公司 | A kind of flip-chip bonding apparatus |
-
2016
- 2016-02-29 CN CN201610113099.5A patent/CN107134418B/en active Active
-
2017
- 2017-02-27 EP EP17759204.5A patent/EP3425662B1/en active Active
- 2017-02-27 WO PCT/CN2017/075033 patent/WO2017148353A1/en active Application Filing
- 2017-02-27 JP JP2018545316A patent/JP6712648B2/en active Active
- 2017-02-27 US US16/080,426 patent/US10903105B2/en active Active
- 2017-02-27 KR KR1020187027025A patent/KR102088376B1/en active IP Right Grant
- 2017-02-27 SG SG11201807274RA patent/SG11201807274RA/en unknown
- 2017-03-01 TW TW106106664A patent/TWI612604B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113345826A (en) * | 2021-05-31 | 2021-09-03 | 深圳市三联盛科技股份有限公司 | Three-dimensional packaging structure with flip bump chips stacked mutually |
Also Published As
Publication number | Publication date |
---|---|
EP3425662B1 (en) | 2022-10-05 |
JP2019507504A (en) | 2019-03-14 |
TW201735217A (en) | 2017-10-01 |
US10903105B2 (en) | 2021-01-26 |
JP6712648B2 (en) | 2020-06-24 |
TWI612604B (en) | 2018-01-21 |
US20200013656A1 (en) | 2020-01-09 |
EP3425662A1 (en) | 2019-01-09 |
EP3425662A4 (en) | 2019-02-27 |
WO2017148353A1 (en) | 2017-09-08 |
CN107134418A (en) | 2017-09-05 |
CN107134418B (en) | 2020-02-18 |
KR102088376B1 (en) | 2020-03-12 |
KR20180116335A (en) | 2018-10-24 |
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