SG11201806263YA - Negative type photosensitive composition curable at low temperature - Google Patents

Negative type photosensitive composition curable at low temperature

Info

Publication number
SG11201806263YA
SG11201806263YA SG11201806263YA SG11201806263YA SG11201806263YA SG 11201806263Y A SG11201806263Y A SG 11201806263YA SG 11201806263Y A SG11201806263Y A SG 11201806263YA SG 11201806263Y A SG11201806263Y A SG 11201806263YA SG 11201806263Y A SG11201806263Y A SG 11201806263YA
Authority
SG
Singapore
Prior art keywords
international
shi
type photosensitive
photosensitive composition
negative type
Prior art date
Application number
SG11201806263YA
Inventor
Motoki Misumi
Daishi Yokoyama
Katsuto Taniguchi
Masahiro Kuzawa
Original Assignee
Az Electronic Mat Luxembourg Sarl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Mat Luxembourg Sarl filed Critical Az Electronic Mat Luxembourg Sarl
Publication of SG11201806263YA publication Critical patent/SG11201806263YA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Silicon Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 24 August 2017 (24.08.2017) WIPO I PCT (10) International Publication Number WO 2017/140409 Al 1111111111111101110101011111010111110 01011111111111110110111011111111111 0111111 (51) International Patent Classification: GO3F 7/075 (2006.01) G03F 7/038 (2006.01) GO3F 7/027 (2006.01) GO3F 7/40 (2006.01) (21) International Application Number: PCT/EP2017/000071 (22) International Filing Date: 20 January 2017 (20.01.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 2016-030242 19 February 2016 (19.02.2016) JP (71) Applicant: AZ ELECTRONIC MATERIALS (LUX- EMBOURG) S.A. R.L. [LU/LU]; 46 Place Guillaume II, 1648 Luxembourg (LU). (72) Inventors: MISUMI, Motoki; 1039-1 -405, Kawai, Fukuroi-shi, Shizuoka 437-0064 (JP). YOKOYAMA, Daishi; c/o Merck Performance Materials Ltd., 3330, Chi- hama, Kakegawa-shi, Shizuoka 437-1412 (JP). TANIGU- CHI, Katsuto; c/o Merck Performance Materials Ltd., 3330, Chihama, Kakegawa-shi, Shizuoka 437-1412 (JP). KUZAWA, Masahiro; c/o Natoco Co., Ltd., 8-3, Futano- cho, Mizuho-ku, Nagoya-shi, Aichi 467-0861 (JP). (74) Agent: B2B PATENTS; c/o Merck Patent GmbH, 64271 Darmstadt (DE). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) W O 20 17 / 140 409 Al (54) Title: NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION CURABLE AT LOW TEMPERATURE (57) : To provide a negative type photosensitive composition curable at a low temperature and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability, and also to provide a pattern-formation meth- od employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising : an alkali-soluble resin, a compound having two or more (meth)acryloyloxy groups, a polysiloxane, a polymerization initiator, and a solvent. The alkali-soluble resin is a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit.
SG11201806263YA 2016-02-19 2017-01-20 Negative type photosensitive composition curable at low temperature SG11201806263YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016030242A JP2017146554A (en) 2016-02-19 2016-02-19 Negative-type photosensitive composition which can be cured at low temperature
PCT/EP2017/000071 WO2017140409A1 (en) 2016-02-19 2017-01-20 Negative type photosensitive composition curable at low temperature

Publications (1)

Publication Number Publication Date
SG11201806263YA true SG11201806263YA (en) 2018-09-27

Family

ID=57909573

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201806263YA SG11201806263YA (en) 2016-02-19 2017-01-20 Negative type photosensitive composition curable at low temperature

Country Status (7)

Country Link
US (1) US11630390B2 (en)
JP (2) JP2017146554A (en)
KR (1) KR102374190B1 (en)
CN (1) CN108700814B (en)
SG (1) SG11201806263YA (en)
TW (1) TWI712861B (en)
WO (1) WO2017140409A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102671237B1 (en) * 2019-03-22 2024-05-30 동우 화인켐 주식회사 Negative-type Photosensitive Resin Composition
JP2021026029A (en) 2019-07-31 2021-02-22 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ Negative type photosensitive composition
CN112180637B (en) * 2020-10-22 2022-08-26 深圳市稻兴实业有限公司 Color filter and preparation method thereof
JP2022102272A (en) * 2020-12-25 2022-07-07 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング Negative photosensitive composition

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JP2933879B2 (en) 1995-08-11 1999-08-16 シャープ株式会社 Transmissive liquid crystal display device and method of manufacturing the same
US6677047B2 (en) * 2000-02-04 2004-01-13 Shin-Etsu Chemical Co., Ltd. Coating composition, coating method, and coated article
US7601480B2 (en) * 2006-12-20 2009-10-13 Az Electronic Materials Usa Corp. Photoactive compounds
WO2009008470A1 (en) * 2007-07-11 2009-01-15 Soken Chemical & Engineering Co., Ltd. Pressure-sensitive adhesive composition for polarizing plates and polarizing plate having pressure-sensitive adhesive layer
CN102171268B (en) * 2008-10-02 2016-05-18 株式会社钟化 Photocurable composition and solidfied material
TWI459137B (en) * 2012-05-10 2014-11-01 Chi Mei Corp Photosensitive resin composition for color filters and uses thereof
JP6315204B2 (en) * 2012-10-02 2018-04-25 日産化学工業株式会社 Negative photosensitive resin composition
CN104969126B (en) * 2013-02-14 2019-10-01 东丽株式会社 Negative-type photosensitive coloured composition, cured film, the manufacturing method of touch panel light-shielding pattern and touch panel
JP2014174374A (en) * 2013-03-11 2014-09-22 Natoko Kk Photosensitive resin composition and cured product of the same
JP6048670B2 (en) * 2013-03-27 2016-12-21 Jsr株式会社 Radiation sensitive resin composition
JP6466087B2 (en) 2013-06-14 2019-02-06 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ Negative photosensitive composition that can be cured at low temperature
TWI541610B (en) * 2013-07-25 2016-07-11 Chi Mei Corp Photosensitive polysiloxane compositions and their use
KR102082722B1 (en) * 2013-07-25 2020-02-28 도레이 카부시키가이샤 Negative-type photosensitive white composition for touch panel, touch panel, and production method for touch panel
JP5409954B1 (en) * 2013-07-29 2014-02-05 太陽インキ製造株式会社 Conductive resin composition and cured product thereof
TWI484296B (en) * 2013-12-03 2015-05-11 Chi Mei Corp Photosensitive resin composition, color filter and method for manufacturing the same, liquid crystal display apparatus
TWI550354B (en) * 2014-04-30 2016-09-21 奇美實業股份有限公司 Photosensitive resin composition for color filter and application thereof

Also Published As

Publication number Publication date
KR102374190B1 (en) 2022-03-15
US20210208503A1 (en) 2021-07-08
KR20180112052A (en) 2018-10-11
JP2017146554A (en) 2017-08-24
TWI712861B (en) 2020-12-11
JP2019510992A (en) 2019-04-18
CN108700814A (en) 2018-10-23
JP6838071B2 (en) 2021-03-03
WO2017140409A1 (en) 2017-08-24
US11630390B2 (en) 2023-04-18
CN108700814B (en) 2022-10-11
TW201804253A (en) 2018-02-01

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