SG11201803970RA - Sputtering arrangement and sputtering method for optimized distribution of the energy flow - Google Patents
Sputtering arrangement and sputtering method for optimized distribution of the energy flowInfo
- Publication number
- SG11201803970RA SG11201803970RA SG11201803970RA SG11201803970RA SG11201803970RA SG 11201803970R A SG11201803970R A SG 11201803970RA SG 11201803970R A SG11201803970R A SG 11201803970RA SG 11201803970R A SG11201803970R A SG 11201803970RA SG 11201803970R A SG11201803970R A SG 11201803970RA
- Authority
- SG
- Singapore
- Prior art keywords
- sputtering
- arrangement
- energy flow
- optimized distribution
- sputtering method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562254451P | 2015-11-12 | 2015-11-12 | |
| PCT/EP2016/001891 WO2017080672A1 (de) | 2015-11-12 | 2016-11-14 | Sputter-anordnung und - verfahren zur optimierten verteilung des energieflusses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201803970RA true SG11201803970RA (en) | 2018-06-28 |
Family
ID=57354318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201803970RA SG11201803970RA (en) | 2015-11-12 | 2016-11-14 | Sputtering arrangement and sputtering method for optimized distribution of the energy flow |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US10943774B2 (zh) |
| EP (1) | EP3375006B1 (zh) |
| JP (1) | JP6895432B2 (zh) |
| KR (1) | KR20180081776A (zh) |
| CN (1) | CN108352286B (zh) |
| BR (1) | BR112018009585B1 (zh) |
| CA (1) | CA3004920C (zh) |
| ES (1) | ES2883198T3 (zh) |
| HU (1) | HUE055816T2 (zh) |
| IL (1) | IL259263B (zh) |
| MX (1) | MX2018005902A (zh) |
| MY (1) | MY193962A (zh) |
| PH (1) | PH12018501018A1 (zh) |
| PL (1) | PL3375006T3 (zh) |
| RU (1) | RU2741614C2 (zh) |
| SG (1) | SG11201803970RA (zh) |
| WO (1) | WO2017080672A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11473189B2 (en) | 2019-02-11 | 2022-10-18 | Applied Materials, Inc. | Method for particle removal from wafers through plasma modification in pulsed PVD |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19651615C1 (de) | 1996-12-12 | 1997-07-10 | Fraunhofer Ges Forschung | Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern |
| US9771648B2 (en) * | 2004-08-13 | 2017-09-26 | Zond, Inc. | Method of ionized physical vapor deposition sputter coating high aspect-ratio structures |
| WO2009132822A2 (de) | 2008-04-28 | 2009-11-05 | Cemecon Ag | Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern |
| RU2371514C1 (ru) * | 2008-08-20 | 2009-10-27 | Государственное образовательное учреждение высшего профессионального образования "Томский политехнический университет" | Дуальная магнетронная распылительная система |
| DE102008050499B4 (de) * | 2008-10-07 | 2014-02-06 | Systec System- Und Anlagentechnik Gmbh & Co. Kg | PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate |
| DE102011018363A1 (de) * | 2011-04-20 | 2012-10-25 | Oerlikon Trading Ag, Trübbach | Hochleistungszerstäubungsquelle |
| CN103608893B (zh) | 2011-04-20 | 2016-08-31 | 欧瑞康表面解决方案股份公司，普费菲孔 | 用于提供顺序功率脉冲的方法 |
| DE102011116576A1 (de) | 2011-10-21 | 2013-04-25 | Oerlikon Trading Ag, Trübbach | Bohrer mit Beschichtung |
-
2016
- 2016-11-14 CA CA3004920A patent/CA3004920C/en active Active
- 2016-11-14 WO PCT/EP2016/001891 patent/WO2017080672A1/de active Application Filing
- 2016-11-14 BR BR112018009585-0A patent/BR112018009585B1/pt active IP Right Grant
- 2016-11-14 KR KR1020187016175A patent/KR20180081776A/ko not_active Application Discontinuation
- 2016-11-14 EP EP16798404.6A patent/EP3375006B1/de active Active
- 2016-11-14 CN CN201680066326.1A patent/CN108352286B/zh active Active
- 2016-11-14 MX MX2018005902A patent/MX2018005902A/es unknown
- 2016-11-14 HU HUE16798404A patent/HUE055816T2/hu unknown
- 2016-11-14 US US15/775,827 patent/US10943774B2/en active Active
- 2016-11-14 ES ES16798404T patent/ES2883198T3/es active Active
- 2016-11-14 JP JP2018524377A patent/JP6895432B2/ja active Active
- 2016-11-14 RU RU2018120892A patent/RU2741614C2/ru active
- 2016-11-14 PL PL16798404T patent/PL3375006T3/pl unknown
- 2016-11-14 MY MYPI2018000736A patent/MY193962A/en unknown
- 2016-11-14 SG SG11201803970RA patent/SG11201803970RA/en unknown
-
2018
- 2018-05-10 IL IL259263A patent/IL259263B/en unknown
- 2018-05-15 PH PH12018501018A patent/PH12018501018A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3375006B1 (de) | 2021-05-12 |
| BR112018009585A2 (pt) | 2018-12-04 |
| US10943774B2 (en) | 2021-03-09 |
| PL3375006T3 (pl) | 2021-11-22 |
| HUE055816T2 (hu) | 2021-12-28 |
| US20180330931A1 (en) | 2018-11-15 |
| BR112018009585B1 (pt) | 2022-12-27 |
| EP3375006A1 (de) | 2018-09-19 |
| JP2018535323A (ja) | 2018-11-29 |
| MY193962A (en) | 2022-11-03 |
| CA3004920C (en) | 2024-01-23 |
| RU2018120892A (ru) | 2019-12-13 |
| MX2018005902A (es) | 2019-04-04 |
| RU2018120892A3 (zh) | 2020-01-30 |
| CN108352286B (zh) | 2020-12-22 |
| PH12018501018A1 (en) | 2018-12-17 |
| IL259263A (en) | 2018-07-31 |
| WO2017080672A1 (de) | 2017-05-18 |
| CN108352286A (zh) | 2018-07-31 |
| JP6895432B2 (ja) | 2021-06-30 |
| RU2741614C2 (ru) | 2021-01-27 |
| KR20180081776A (ko) | 2018-07-17 |
| IL259263B (en) | 2022-04-01 |
| CA3004920A1 (en) | 2017-05-18 |
| ES2883198T3 (es) | 2021-12-07 |
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