BR112018009585A2 - arranjo de pulverização e método de pulverização para distribuição otimizada do fluxo de energia - Google Patents

arranjo de pulverização e método de pulverização para distribuição otimizada do fluxo de energia

Info

Publication number
BR112018009585A2
BR112018009585A2 BR112018009585-0A BR112018009585A BR112018009585A2 BR 112018009585 A2 BR112018009585 A2 BR 112018009585A2 BR 112018009585 A BR112018009585 A BR 112018009585A BR 112018009585 A2 BR112018009585 A2 BR 112018009585A2
Authority
BR
Brazil
Prior art keywords
spray
arrangement
flow distribution
energy flow
optimized energy
Prior art date
Application number
BR112018009585-0A
Other languages
English (en)
Other versions
BR112018009585B1 (pt
Inventor
Krassnitzer Siegfried
Lendi Daniel
Kurapov Denis
Original Assignee
Oerlikon Surface Solutions Ag, Pfäffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag, Pfäffikon filed Critical Oerlikon Surface Solutions Ag, Pfäffikon
Publication of BR112018009585A2 publication Critical patent/BR112018009585A2/pt
Publication of BR112018009585B1 publication Critical patent/BR112018009585B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

a invenção refere-se a um arranjo de pulverização, a uma planta de revestimento a vácuo, e a um método para realizar processos de pulverização catódica com magnetron de alta potência. o arranjo de pulverização apresenta pelo menos duas possibilidades de conexão diferentes, e mudando para a segunda possibilidade de conexão em que dois subconjuntos de pulverização são operados simultaneamente em impulsos de alta potência, a produtividade é aumentada.
BR112018009585-0A 2015-11-12 2016-11-14 Arranjo de pulverização e método de pulverização para distribuição otimizada do fluxo de energia BR112018009585B1 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562254451P 2015-11-12 2015-11-12
US62/254,451 2015-11-12
USUS62/254,451 2015-11-12
PCT/EP2016/001891 WO2017080672A1 (de) 2015-11-12 2016-11-14 Sputter-anordnung und - verfahren zur optimierten verteilung des energieflusses

Publications (2)

Publication Number Publication Date
BR112018009585A2 true BR112018009585A2 (pt) 2018-12-04
BR112018009585B1 BR112018009585B1 (pt) 2022-12-27

Family

ID=57354318

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112018009585-0A BR112018009585B1 (pt) 2015-11-12 2016-11-14 Arranjo de pulverização e método de pulverização para distribuição otimizada do fluxo de energia

Country Status (17)

Country Link
US (1) US10943774B2 (pt)
EP (1) EP3375006B1 (pt)
JP (1) JP6895432B2 (pt)
KR (1) KR20180081776A (pt)
CN (1) CN108352286B (pt)
BR (1) BR112018009585B1 (pt)
CA (1) CA3004920C (pt)
ES (1) ES2883198T3 (pt)
HU (1) HUE055816T2 (pt)
IL (1) IL259263B (pt)
MX (1) MX2018005902A (pt)
MY (1) MY193962A (pt)
PH (1) PH12018501018A1 (pt)
PL (1) PL3375006T3 (pt)
RU (1) RU2741614C2 (pt)
SG (1) SG11201803970RA (pt)
WO (1) WO2017080672A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11473189B2 (en) 2019-02-11 2022-10-18 Applied Materials, Inc. Method for particle removal from wafers through plasma modification in pulsed PVD

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19651615C1 (de) 1996-12-12 1997-07-10 Fraunhofer Ges Forschung Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern
US9771648B2 (en) * 2004-08-13 2017-09-26 Zond, Inc. Method of ionized physical vapor deposition sputter coating high aspect-ratio structures
WO2009132822A2 (de) 2008-04-28 2009-11-05 Cemecon Ag Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern
RU2371514C1 (ru) * 2008-08-20 2009-10-27 Государственное образовательное учреждение высшего профессионального образования "Томский политехнический университет" Дуальная магнетронная распылительная система
DE102008050499B4 (de) * 2008-10-07 2014-02-06 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate
DE102011018363A1 (de) * 2011-04-20 2012-10-25 Oerlikon Trading Ag, Trübbach Hochleistungszerstäubungsquelle
CN103608893B (zh) 2011-04-20 2016-08-31 欧瑞康表面解决方案股份公司，普费菲孔 用于提供顺序功率脉冲的方法
DE102011116576A1 (de) 2011-10-21 2013-04-25 Oerlikon Trading Ag, Trübbach Bohrer mit Beschichtung

Also Published As

Publication number Publication date
EP3375006B1 (de) 2021-05-12
US10943774B2 (en) 2021-03-09
PL3375006T3 (pl) 2021-11-22
HUE055816T2 (hu) 2021-12-28
US20180330931A1 (en) 2018-11-15
BR112018009585B1 (pt) 2022-12-27
EP3375006A1 (de) 2018-09-19
JP2018535323A (ja) 2018-11-29
MY193962A (en) 2022-11-03
CA3004920C (en) 2024-01-23
RU2018120892A (ru) 2019-12-13
MX2018005902A (es) 2019-04-04
RU2018120892A3 (pt) 2020-01-30
CN108352286B (zh) 2020-12-22
PH12018501018A1 (en) 2018-12-17
IL259263A (en) 2018-07-31
WO2017080672A1 (de) 2017-05-18
SG11201803970RA (en) 2018-06-28
CN108352286A (zh) 2018-07-31
JP6895432B2 (ja) 2021-06-30
RU2741614C2 (ru) 2021-01-27
KR20180081776A (ko) 2018-07-17
IL259263B (en) 2022-04-01
CA3004920A1 (en) 2017-05-18
ES2883198T3 (es) 2021-12-07

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 14/11/2016, OBSERVADAS AS CONDICOES LEGAIS