SG11201707344SA - Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions - Google Patents

Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions

Info

Publication number
SG11201707344SA
SG11201707344SA SG11201707344SA SG11201707344SA SG11201707344SA SG 11201707344S A SG11201707344S A SG 11201707344SA SG 11201707344S A SG11201707344S A SG 11201707344SA SG 11201707344S A SG11201707344S A SG 11201707344SA SG 11201707344S A SG11201707344S A SG 11201707344SA
Authority
SG
Singapore
Prior art keywords
probes
testing head
under different
sliding movement
guide holes
Prior art date
Application number
SG11201707344SA
Other languages
English (en)
Inventor
Roberto Crippa
Raffaele Vallauri
Emanuele Bertarelli
Daniele Perego
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201707344SA publication Critical patent/SG11201707344SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/42—Securing in a demountable manner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG11201707344SA 2015-03-13 2016-03-11 Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions SG11201707344SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMI20150384 2015-03-13
PCT/EP2016/055228 WO2016146499A1 (en) 2015-03-13 2016-03-11 Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions

Publications (1)

Publication Number Publication Date
SG11201707344SA true SG11201707344SA (en) 2017-10-30

Family

ID=53052983

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707344SA SG11201707344SA (en) 2015-03-13 2016-03-11 Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions

Country Status (9)

Country Link
US (1) US10551433B2 (ko)
EP (1) EP3268752A1 (ko)
JP (1) JP2018513389A (ko)
KR (1) KR20170125070A (ko)
CN (1) CN107533084A (ko)
PH (1) PH12017501673A1 (ko)
SG (1) SG11201707344SA (ko)
TW (1) TW201636622A (ko)
WO (1) WO2016146499A1 (ko)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3540280A4 (en) * 2016-11-08 2019-11-27 Fujikin Incorporated VALVE DEVICE, METHOD FOR CONTROLLING THE FLOW RATE WITH THIS VALVE DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR
IT201600127507A1 (it) * 2016-12-16 2018-06-16 Technoprobe Spa Sonda di contatto e relativa testa di misura per un’apparecchiatura di test di dispositivi elettronici
WO2018118075A1 (en) * 2016-12-23 2018-06-28 Intel Corporation Fine pitch probe card methods and systems
JP2018179721A (ja) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス 電気的接続装置
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
CN109581006B (zh) * 2017-09-29 2021-09-07 中华精测科技股份有限公司 探针装置及其矩形探针
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
CN109752576B (zh) * 2017-11-01 2021-01-08 中华精测科技股份有限公司 探针卡装置及其信号传输模块
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10866264B2 (en) 2018-01-05 2020-12-15 Intel Corporation Interconnect structure with varying modulus of elasticity
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
IT201800002877A1 (it) * 2018-02-20 2019-08-20 Technoprobe Spa Apparato e metodo per l’assemblaggio automatizzato di una testa di misura
JP2019160937A (ja) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 位置補正方法、検査装置及びプローブカード
CN110346616B (zh) * 2018-04-03 2021-06-15 中华精测科技股份有限公司 探针卡装置及探针座
TWI695173B (zh) * 2018-07-04 2020-06-01 旺矽科技股份有限公司 具有線型探針之探針頭
WO2020012799A1 (ja) * 2018-07-13 2020-01-16 日本電産リード株式会社 検査治具、及び検査装置
KR102072451B1 (ko) * 2018-07-27 2020-02-04 주식회사 에스디에이 프로브카드 헤드블록
KR102072452B1 (ko) * 2018-07-27 2020-02-04 주식회사 에스디에이 프로브카드 헤드블럭의 제조방법
IT201800007898A1 (it) * 2018-08-06 2020-02-06 Technoprobe Spa Sonda di contatto con prestazioni migliorate e relativa testa di misura
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
IT201800021253A1 (it) * 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
JP7381209B2 (ja) * 2019-03-06 2023-11-15 株式会社日本マイクロニクス 電気的接続装置
TWM588248U (zh) * 2019-07-01 2019-12-21 技鼎股份有限公司 探針頭及其導電探針
US11821918B1 (en) * 2020-04-24 2023-11-21 Microfabrica Inc. Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
TWI737291B (zh) * 2020-05-08 2021-08-21 中華精測科技股份有限公司 垂直式測試裝置
CN111351970B (zh) * 2020-05-08 2022-05-10 沈阳圣仁电子科技有限公司 一种使多个探针具有均匀弹性的垂直探针卡
US11493536B2 (en) * 2020-05-26 2022-11-08 Mpi Corporation Probe head with linear probe
TWI755945B (zh) * 2020-11-24 2022-02-21 中華精測科技股份有限公司 探針卡裝置及自對準探針
JP2022144851A (ja) * 2021-03-19 2022-10-03 株式会社日本マイクロニクス プローブおよびプローブカード
US20220326280A1 (en) * 2021-04-12 2022-10-13 Kes Systems & Service (1993) Pte Ltd. Probe assembly for test and burn-in having a compliant contact element
KR102321083B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브
KR102321081B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브 조립체
CN115684677A (zh) * 2021-07-29 2023-02-03 迪科特测试科技(苏州)有限公司 探针及探针卡装置
CN113703204A (zh) * 2021-09-03 2021-11-26 苏州凌云光工业智能技术有限公司 一种探针及显示屏点灯治具
USD1015282S1 (en) 2022-02-01 2024-02-20 Johnstech International Corporation Spring pin tip
US20230258688A1 (en) * 2022-02-07 2023-08-17 Johnstech International Corporation Spring probe assembly for a kelvin testing system
WO2023163271A1 (ko) * 2022-02-25 2023-08-31 (주)티에스이 저마찰형 프로브 헤드
EP4261547A1 (en) * 2022-04-12 2023-10-18 Microtest S.p.A. Testing head with vertical probes for a probe card and corresponding method of assembly

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027935A (en) 1976-06-21 1977-06-07 International Business Machines Corporation Contact for an electrical contactor assembly
DE3142817A1 (de) 1980-10-30 1982-07-08 Everett/Charles, Inc., 91730 Rancho Cucamonga, Calif. Uebertragungseinrichtung, test-spannvorrichtung mit uebertragungseinrichtung und verfahren zur bildung einer uebertragungseinrichtung
DE3123627A1 (de) 1981-06-15 1982-12-30 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum gleichzeitigen kontaktieren mehrerer eng beisammenliegender pruefpunkte, insbesondere von rasterfeldern
DE3337915A1 (de) 1982-10-21 1984-05-24 Feinmetall Gmbh, 7033 Herrenberg Kontaktiervorrichtung
DE3903060A1 (de) 1989-02-02 1990-08-09 Minnesota Mining & Mfg Vorrichtung zum pruefen von integrierten schaltungsanordnungen
US5415559A (en) 1992-05-18 1995-05-16 Japan Aviation Electronics Industry, Ltd. Electrical connector having a plurality of contact pin springs
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
ATE261129T1 (de) * 1997-11-05 2004-03-15 Feinmetall Gmbh Prüfkopf für mikrostrukturen mit schnittstelle
ATE260470T1 (de) 1997-11-05 2004-03-15 Feinmetall Gmbh Prüfkopf für mikrostrukturen mit schnittstelle
IT1318734B1 (it) * 2000-08-04 2003-09-10 Technoprobe S R L Testa di misura a sonde verticali.
ITMI20010567A1 (it) 2001-03-19 2002-09-19 Technoprobe S R L Testa di misura a sonde verticali per dispositivi elettronici integrati su semiconduttore
AU2003211215A1 (en) 2003-02-17 2004-09-06 Kabushiki Kaisha Nihon Micronics Electrical connection device
PL1580562T3 (pl) * 2004-03-24 2008-02-29 Technoprobe Spa Sonda kontaktowa do głowicy testującej
KR100701498B1 (ko) * 2006-02-20 2007-03-29 주식회사 새한마이크로텍 반도체 검사용 프로브핀 조립체 및 그 제조방법
JP5337341B2 (ja) * 2006-11-30 2013-11-06 株式会社日本マイクロニクス 電気的接続装置およびその組み立て方法
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
ITMI20080710A1 (it) 2008-04-17 2009-10-18 Technoprobe Spa Testa di misura a sonde verticali munite di mezzi di arresto per impedirne la fuoriuscita verso l'alto e verso il basso dai rispettivi fori guida.
EP2110673A1 (en) * 2008-04-17 2009-10-21 Technoprobe S.p.A Testing head having vertical probes provided with stopping means to avoid their upward and downward escape from respective guide holes
JP5341456B2 (ja) * 2008-10-06 2013-11-13 日本電子材料株式会社 プローブカード
US8222912B2 (en) * 2009-03-12 2012-07-17 Sv Probe Pte. Ltd. Probe head structure for probe test cards
US8723538B2 (en) * 2011-06-17 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head formation methods employing guide plate raising assembly mechanism
JP2013257299A (ja) * 2012-06-14 2013-12-26 Sumitomo Electric Ind Ltd コンタクトプローブ、プローブカード及び電子部品の検査方法
US10359447B2 (en) 2012-10-31 2019-07-23 Formfactor, Inc. Probes with spring mechanisms for impeding unwanted movement in guide holes
SG11201510255QA (en) * 2013-07-11 2016-01-28 Johnstech Int Corp Testing apparatus for wafer level ic testing

Also Published As

Publication number Publication date
KR20170125070A (ko) 2017-11-13
EP3268752A1 (en) 2018-01-17
US20180003767A1 (en) 2018-01-04
TW201636622A (zh) 2016-10-16
US10551433B2 (en) 2020-02-04
JP2018513389A (ja) 2018-05-24
CN107533084A (zh) 2018-01-02
WO2016146499A1 (en) 2016-09-22
PH12017501673A1 (en) 2018-03-19

Similar Documents

Publication Publication Date Title
SG11201707344SA (en) Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions
SG11201707864TA (en) Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications
SG11201707348QA (en) Testing head with vertical probes, particularly for high frequency applications
SG11201704433TA (en) Contact probe for testing head
SG11201800262YA (en) Defect measurement method, defect measurement device, and testing probe
ZA201904235B (en) Methods for improved rapid antimicrobial susceptibility testing
IL260466B (en) Methods for rapid testing of antimicrobial susceptibility
GB201417164D0 (en) Measurement Probe
HK1213981A1 (zh) 檢驗設備和檢驗空心體內壁的方法
GB2520375B (en) NMR probe head with improved centering of the sample vial
GB201501276D0 (en) Data retention probes and related methods
DK3283499T3 (da) Dual quencher probes
GB201719423D0 (en) Diagnostic tests
GB201704454D0 (en) An interface probe
ZA201803835B (en) Device for digitizing and evaluating movement
EP3596429C0 (en) INTERFACE DEVICES FOR USE WITH IMPROVED FUNCTIONALITY MEASURING PROBE
SG11201800264QA (en) Defect measurement method, defect measurement device, and testing probe
EP3512627C0 (en) TEST SYSTEM WITH RECIRCULATING FLUID REACTOR
SG11201610683PA (en) Semiconductor device tester with dut data streaming
GB201604331D0 (en) Fibre-optic probe
DE112016003376A5 (de) Sondeneinrichtung, Rotierkopf und Prüfgerät
GB2569326B (en) Probe
GB201719617D0 (en) Test specimen
IL257711A (en) Method and device for detecting surface structure and properties of test media
GB201713743D0 (en) Ophthalmic probes