SG11201706097UA - Resin composition, solid imaging element obtained using same, and process for producing same - Google Patents

Resin composition, solid imaging element obtained using same, and process for producing same

Info

Publication number
SG11201706097UA
SG11201706097UA SG11201706097UA SG11201706097UA SG11201706097UA SG 11201706097U A SG11201706097U A SG 11201706097UA SG 11201706097U A SG11201706097U A SG 11201706097UA SG 11201706097U A SG11201706097U A SG 11201706097UA SG 11201706097U A SG11201706097U A SG 11201706097UA
Authority
SG
Singapore
Prior art keywords
same
resin composition
imaging element
element obtained
solid imaging
Prior art date
Application number
SG11201706097UA
Other languages
English (en)
Inventor
Toshiyasu Hibino
Manami Fujii
Mitsuhito Suwa
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201706097UA publication Critical patent/SG11201706097UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
    • C08J3/095—Oxygen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/111—Anti-reflection coatings using layers comprising organic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
SG11201706097UA 2015-01-30 2016-01-20 Resin composition, solid imaging element obtained using same, and process for producing same SG11201706097UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015017051 2015-01-30
JP2015182491 2015-09-16
PCT/JP2016/051580 WO2016121598A1 (ja) 2015-01-30 2016-01-20 樹脂組成物、それを用いた固体撮像素子およびその製造方法

Publications (1)

Publication Number Publication Date
SG11201706097UA true SG11201706097UA (en) 2017-08-30

Family

ID=56543213

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201706097UA SG11201706097UA (en) 2015-01-30 2016-01-20 Resin composition, solid imaging element obtained using same, and process for producing same

Country Status (7)

Country Link
US (1) US10316146B2 (ja)
JP (1) JP6711269B2 (ja)
KR (1) KR20170110070A (ja)
CN (1) CN107001799B (ja)
SG (1) SG11201706097UA (ja)
TW (1) TWI679230B (ja)
WO (1) WO2016121598A1 (ja)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4318939A (en) * 1980-08-21 1982-03-09 Western Electric Co., Incorporated Stabilized catalyzed organopolysiloxanes
GB2116189A (en) 1982-02-17 1983-09-21 Gen Electric Low modulusone-component RTV compositions and processes
US4513115A (en) 1982-02-17 1985-04-23 General Electric Company Low modulus one component RTV compositions processes
CA1327207C (en) 1987-08-27 1994-02-22 Jeffrey Hayward Wengrovius Polyalkoxysilyl-terminated polydiorganosiloxanes, methods for their preparation, and room temperature vulcanizable compositions containing them
US4863992A (en) 1987-08-27 1989-09-05 General Electric Company Polyalkoxysilyl-terminated polydiorganosiloxanes, methods for their preparation, and room temperature vulcanizable compositions containing them
JP2722304B2 (ja) 1992-12-22 1998-03-04 信越化学工業株式会社 １液型オルガノポリシロキサン組成物
JP3635692B2 (ja) 1994-10-20 2005-04-06 日産化学工業株式会社 低屈折率反射防止膜
JP4158001B2 (ja) 1999-12-24 2008-10-01 Ｊｓｒ株式会社 膜形成用組成物、膜の形成方法および低密度化膜
JP3921952B2 (ja) 2001-02-28 2007-05-30 凸版印刷株式会社 撮像素子及びその製造方法
JP2003258224A (ja) 2002-03-06 2003-09-12 Toppan Printing Co Ltd 固体撮像素子及びその製造方法
US20080167425A1 (en) * 2004-06-16 2008-07-10 Nippon Paint Co., Ltd. Composition and Method for Producing Same
US20060105155A1 (en) * 2004-11-16 2006-05-18 Fuji Photo Film Co., Ltd. Optical film, polarizing plate and method for forming optical film
CN1718659A (zh) * 2005-07-26 2006-01-11 浙江新安化工集团股份有限公司 一种低表面能有机硅涂料及其用途
JP5418617B2 (ja) 2005-10-03 2014-02-19 東レ株式会社 シロキサン系樹脂組成物、硬化膜および光学物品
JP2007270056A (ja) 2006-03-31 2007-10-18 Jsr Corp 金属酸化物微粒子含有ポリシロキサン組成物およびその製造方法
CN101522839B (zh) * 2006-10-12 2014-01-15 日产化学工业株式会社 低折射率被膜形成用涂布液、其制造方法及防反射材料
US8492450B2 (en) * 2008-11-27 2013-07-23 Toray Industries, Inc. Siloxane resin composition and protective film for touch panel using the same
JP5434252B2 (ja) 2009-05-14 2014-03-05 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
WO2013047131A1 (en) 2011-09-30 2013-04-04 Fujifilm Corporation Curable resin composition, optical member set, method of producing the same, and solid state imaging device using the same
JP5922013B2 (ja) * 2011-12-28 2016-05-24 富士フイルム株式会社 光学部材セット及びこれを用いた固体撮像素子

Also Published As

Publication number Publication date
JPWO2016121598A1 (ja) 2017-11-02
CN107001799B (zh) 2020-11-27
KR20170110070A (ko) 2017-10-10
CN107001799A (zh) 2017-08-01
WO2016121598A1 (ja) 2016-08-04
TWI679230B (zh) 2019-12-11
US10316146B2 (en) 2019-06-11
TW201708340A (zh) 2017-03-01
US20180016399A1 (en) 2018-01-18
JP6711269B2 (ja) 2020-06-17

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