SG11201704382XA - Inspection systems and techniques with enhanced detection - Google Patents

Inspection systems and techniques with enhanced detection

Info

Publication number
SG11201704382XA
SG11201704382XA SG11201704382XA SG11201704382XA SG11201704382XA SG 11201704382X A SG11201704382X A SG 11201704382XA SG 11201704382X A SG11201704382X A SG 11201704382XA SG 11201704382X A SG11201704382X A SG 11201704382XA SG 11201704382X A SG11201704382X A SG 11201704382XA
Authority
SG
Singapore
Prior art keywords
techniques
inspection systems
enhanced detection
enhanced
detection
Prior art date
Application number
SG11201704382XA
Other languages
English (en)
Inventor
Steven R Lange
Shiow-Hwei Hwang
Amir Bar
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201704382XA publication Critical patent/SG11201704382XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8848—Polarisation of light

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201704382XA 2014-12-02 2015-11-30 Inspection systems and techniques with enhanced detection SG11201704382XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462086596P 2014-12-02 2014-12-02
US14/944,124 US9599573B2 (en) 2014-12-02 2015-11-17 Inspection systems and techniques with enhanced detection
PCT/US2015/063020 WO2016089779A1 (en) 2014-12-02 2015-11-30 Inspection systems and techniques with enhanced detection

Publications (1)

Publication Number Publication Date
SG11201704382XA true SG11201704382XA (en) 2017-06-29

Family

ID=56079025

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201704382XA SG11201704382XA (en) 2014-12-02 2015-11-30 Inspection systems and techniques with enhanced detection

Country Status (8)

Country Link
US (2) US9599573B2 (ja)
JP (1) JP6681576B2 (ja)
KR (1) KR102318273B1 (ja)
CN (1) CN107003250B (ja)
IL (1) IL251973A0 (ja)
SG (1) SG11201704382XA (ja)
TW (1) TWI652472B (ja)
WO (1) WO2016089779A1 (ja)

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US9599573B2 (en) 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
US10627227B2 (en) 2016-09-16 2020-04-21 Centre National De La Recherche Scientifique Optical device for characterization of a sample
US10082470B2 (en) * 2016-09-27 2018-09-25 Kla-Tencor Corporation Defect marking for semiconductor wafer inspection
US11047806B2 (en) * 2016-11-30 2021-06-29 Kla-Tencor Corporation Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US11662646B2 (en) * 2017-02-05 2023-05-30 Kla Corporation Inspection and metrology using broadband infrared radiation
DE102017205212A1 (de) * 2017-03-28 2018-10-04 Carl Zeiss Smt Gmbh Verfahren zum Detektieren von Partikeln an der Oberfläche eines Objekts, Wafer und Maskenblank
US10444161B2 (en) 2017-04-05 2019-10-15 Kla-Tencor Corporation Systems and methods for metrology with layer-specific illumination spectra
EP3732469A4 (en) 2017-12-29 2021-03-10 Goldway Technology Limited METHOD AND SYSTEM FOR MEASURING DIAMOND CLARITY
US10937705B2 (en) * 2018-03-30 2021-03-02 Onto Innovation Inc. Sample inspection using topography
US11151711B2 (en) * 2018-06-06 2021-10-19 Kla-Tencor Corporation Cross layer common-unique analysis for nuisance filtering
CN116734749A (zh) * 2018-07-18 2023-09-12 诺威有限公司 用于半导体器件计量以及检测的方法和系统
KR102120551B1 (ko) * 2018-09-14 2020-06-09 (주)오로스 테크놀로지 오버레이 측정장치
US10545099B1 (en) 2018-11-07 2020-01-28 Kla-Tencor Corporation Ultra-high sensitivity hybrid inspection with full wafer coverage capability
WO2020194491A1 (ja) * 2019-03-26 2020-10-01 株式会社日立ハイテク 欠陥検査装置
JP2021001770A (ja) * 2019-06-20 2021-01-07 日本電産サンキョー株式会社 外観検査装置および外観検査方法
US11512948B2 (en) * 2020-05-26 2022-11-29 Kla Corporation Imaging system for buried metrology targets

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US5162867A (en) * 1990-01-26 1992-11-10 Canon Kabushiki Kaisha Surface condition inspection method and apparatus using image transfer
US7136159B2 (en) 2000-09-12 2006-11-14 Kla-Tencor Technologies Corporation Excimer laser inspection system
US6608321B1 (en) 2001-02-01 2003-08-19 Advanced Micro Devices, Inc. Differential wavelength inspection system
US20040207836A1 (en) 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
JP4316853B2 (ja) 2002-10-09 2009-08-19 株式会社トプコン 表面検査方法および装置
JP4901090B2 (ja) * 2004-10-06 2012-03-21 株式会社ニコン 欠陥検査方法及び欠陥検出装置
US7351980B2 (en) 2005-03-31 2008-04-01 Kla-Tencor Technologies Corp. All-reflective optical systems for broadband wafer inspection
US7435528B2 (en) 2005-06-09 2008-10-14 E.I. Du Pont De Nemours And Company Processes and devices using polycyclic fluoroalkanes in vacuum and deep ultraviolet applications
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WO2009154238A1 (ja) 2008-06-19 2009-12-23 旭硝子株式会社 Ｅｕｖリソグラフィ用反射型マスクブランク
US8223327B2 (en) * 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
JP2010203776A (ja) 2009-02-27 2010-09-16 Hitachi High-Technologies Corp 表面検査装置及びその校正方法
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CN102288550B (zh) 2010-06-21 2013-03-27 张国胜 适用于光电检测的差分测量方法及装置
JP2014503843A (ja) * 2010-12-06 2014-02-13 エーエスエムエル ネザーランズ ビー．ブイ． 物品の検査方法および検査装置、ｅｕｖリソグラフィレチクル、リソグラフィ装置、ならびにデバイス製造方法
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US9496425B2 (en) * 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
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US9599573B2 (en) * 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection

Also Published As

Publication number Publication date
US20170176346A1 (en) 2017-06-22
CN107003250A (zh) 2017-08-01
WO2016089779A1 (en) 2016-06-09
JP6681576B2 (ja) 2020-04-15
IL251973A0 (en) 2017-06-29
KR102318273B1 (ko) 2021-10-26
US10126251B2 (en) 2018-11-13
TWI652472B (zh) 2019-03-01
TW201631315A (zh) 2016-09-01
JP2018503244A (ja) 2018-02-01
KR20170091706A (ko) 2017-08-09
CN107003250B (zh) 2020-02-28
US9599573B2 (en) 2017-03-21
US20160153914A1 (en) 2016-06-02

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