SG11201703063YA - Semiconductor device, and production method therefor - Google Patents

Semiconductor device, and production method therefor

Info

Publication number
SG11201703063YA
SG11201703063YA SG11201703063YA SG11201703063YA SG11201703063YA SG 11201703063Y A SG11201703063Y A SG 11201703063YA SG 11201703063Y A SG11201703063Y A SG 11201703063YA SG 11201703063Y A SG11201703063Y A SG 11201703063YA SG 11201703063Y A SG11201703063Y A SG 11201703063YA
Authority
SG
Singapore
Prior art keywords
semiconductor device
production method
method therefor
therefor
production
Prior art date
Application number
SG11201703063YA
Inventor
Yasuhiro Taniguchi
Yasuhiko Kawashima
Hideo Kasai
Ryotaro Sakurai
Yutaka Shinagawa
Kosuke Okuyama
Original Assignee
Floadia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Floadia Corp filed Critical Floadia Corp
Publication of SG11201703063YA publication Critical patent/SG11201703063YA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/792Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/4234Gate electrodes for transistors with charge trapping gate insulator
    • H01L29/42344Gate electrodes for transistors with charge trapping gate insulator with at least one additional gate, e.g. program gate, erase gate or select gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/10EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/40EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823437MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
    • H01L21/823456MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different shapes, lengths or dimensions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
SG11201703063YA 2014-10-15 2015-10-06 Semiconductor device, and production method therefor SG11201703063YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014211098 2014-10-15
PCT/JP2015/078336 WO2016060014A1 (en) 2014-10-15 2015-10-06 Semiconductor device, and production method therefor

Publications (1)

Publication Number Publication Date
SG11201703063YA true SG11201703063YA (en) 2017-06-29

Family

ID=55746561

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703063YA SG11201703063YA (en) 2014-10-15 2015-10-06 Semiconductor device, and production method therefor

Country Status (7)

Country Link
JP (1) JP5956093B1 (en)
KR (1) KR101824376B1 (en)
CN (1) CN107112237B (en)
IL (1) IL251714B (en)
SG (1) SG11201703063YA (en)
TW (1) TWI610418B (en)
WO (1) WO2016060014A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5905630B1 (en) * 2015-08-13 2016-04-20 株式会社フローディア Manufacturing method of semiconductor integrated circuit device and semiconductor integrated circuit device
JP7026537B2 (en) * 2018-03-07 2022-02-28 ルネサスエレクトロニクス株式会社 Semiconductor devices and methods for manufacturing semiconductor devices
CN114068726B (en) * 2021-11-23 2023-12-08 武汉新芯集成电路制造有限公司 PIP capacitor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773073B2 (en) * 2004-08-11 2011-09-14 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
KR100936627B1 (en) * 2008-12-24 2010-01-13 주식회사 동부하이텍 Flash memory device and method for manufacturing the same
WO2010082328A1 (en) * 2009-01-15 2010-07-22 ルネサスエレクトロニクス株式会社 Semiconductor device, and method for manufacturing the same
JP5638679B2 (en) * 2009-01-15 2014-12-10 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
JP5404149B2 (en) * 2009-04-16 2014-01-29 ルネサスエレクトロニクス株式会社 Semiconductor memory device
KR101979299B1 (en) 2012-12-26 2019-09-03 에스케이하이닉스 주식회사 Nonvolatile memory device and method of fabricating the same

Also Published As

Publication number Publication date
JP5956093B1 (en) 2016-07-20
IL251714A0 (en) 2017-06-29
TW201622105A (en) 2016-06-16
WO2016060014A1 (en) 2016-04-21
CN107112237B (en) 2019-02-15
KR20170070123A (en) 2017-06-21
KR101824376B1 (en) 2018-01-31
JPWO2016060014A1 (en) 2017-04-27
TWI610418B (en) 2018-01-01
IL251714B (en) 2018-06-28
CN107112237A (en) 2017-08-29

Similar Documents

Publication Publication Date Title
EP3168882A4 (en) Semiconductor device and method for producing semiconductor device
TWI562209B (en) Semiconductor device and method for manufacturing the same
SG10201509454YA (en) Wafer producing method
SG10201509475VA (en) Wafer producing method
HK1231630A1 (en) Semiconductor device and method for manufacturing same
SG11201606536XA (en) Semiconductor device and manufacturing method thereof
EP3125274A4 (en) Method for manufacturing semiconductor device and semiconductor device
HK1223192A1 (en) Semiconductor device and manufacturing method thereof
SG10201912585TA (en) Semiconductor device and method for manufacturing the same
EP3128539A4 (en) Semiconductor device manufacturing method and semiconductor device
GB201614570D0 (en) Coil part,coil module, and coil part production method
SG10201509471YA (en) Wafer producing method
GB201402508D0 (en) Semiconductor modification process and structures
EP3128547A4 (en) Interposer, semiconductor device, interposer manufacturing method, and semiconductor device manufacturing method
HK1246406A1 (en) Measurement device and measurement method, exposure device and exposure method, and device production method
EP3240015A4 (en) Semiconductor device and semiconductor device manufacturing method
TWI562362B (en) Semiconductor device structure and method for forming the same
SG10201509458RA (en) Wafer producing method
TWI563604B (en) Semiconductor device and fabricating method thereof
SG11201605542RA (en) Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrate
EP3174089A4 (en) Semiconductor manufacturing device, and method of manufacturing semiconductor
EP3188232A4 (en) Power semiconductor device and power semiconductor device production method
EP3104399A4 (en) Semiconductor device and manufacturing method for semiconductor device
SG11201703288UA (en) Resin composition, semiconductor device manufacturing method and semiconductor device
HK1254829B (en) Device manufacturing method