SG11201701748WA - Mems having micromechanical piezoelectric actuators for realizing high forces and deflections - Google Patents

Mems having micromechanical piezoelectric actuators for realizing high forces and deflections

Info

Publication number
SG11201701748WA
SG11201701748WA SG11201701748WA SG11201701748WA SG11201701748WA SG 11201701748W A SG11201701748W A SG 11201701748WA SG 11201701748W A SG11201701748W A SG 11201701748WA SG 11201701748W A SG11201701748W A SG 11201701748WA SG 11201701748W A SG11201701748W A SG 11201701748WA
Authority
SG
Singapore
Prior art keywords
deflections
mems
piezoelectric actuators
realizing high
high forces
Prior art date
Application number
SG11201701748WA
Other languages
English (en)
Inventor
Fabian Stoppel
Bernhard Wagner
Original Assignee
Fraunhofer Ges Forschung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung filed Critical Fraunhofer Ges Forschung
Publication of SG11201701748WA publication Critical patent/SG11201701748WA/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/002—Damping circuit arrangements for transducers, e.g. motional feedback circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • H10N30/2043—Cantilevers, i.e. having one fixed end connected at their free ends, e.g. parallelogram type

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Micromachines (AREA)
  • Circuit For Audible Band Transducer (AREA)
SG11201701748WA 2014-09-05 2015-09-03 Mems having micromechanical piezoelectric actuators for realizing high forces and deflections SG11201701748WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014217798.7A DE102014217798A1 (de) 2014-09-05 2014-09-05 Mikromechanische piezoelektrische Aktuatoren zur Realisierung hoher Kräfte und Auslenkungen
PCT/EP2015/070124 WO2016034665A1 (fr) 2014-09-05 2015-09-03 Mems comprenant des actionneurs piézoélectriques micromécaniques pour obtenir des forces et des déflexions élevées

Publications (1)

Publication Number Publication Date
SG11201701748WA true SG11201701748WA (en) 2017-04-27

Family

ID=54064328

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201701748WA SG11201701748WA (en) 2014-09-05 2015-09-03 Mems having micromechanical piezoelectric actuators for realizing high forces and deflections

Country Status (10)

Country Link
US (1) US10349182B2 (fr)
EP (1) EP3100467B1 (fr)
KR (1) KR102033228B1 (fr)
CN (1) CN107005769B (fr)
AU (1) AU2015310896B9 (fr)
CA (1) CA2960072C (fr)
DE (1) DE102014217798A1 (fr)
SG (1) SG11201701748WA (fr)
TW (1) TWI595738B (fr)
WO (1) WO2016034665A1 (fr)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3192770B1 (fr) * 2016-01-12 2019-07-17 TRUMPF Schweiz AG Dispositif de deviation bidimensionnelle d'un rayon laser
DE102016121587B4 (de) * 2016-11-10 2023-06-01 Pi Ceramic Gmbh Piezoelektrischer Antrieb, insbesondere für den Einsatz in feuchter Umgebung
DE102017200111B3 (de) * 2017-01-05 2018-03-15 Robert Bosch Gmbh Mikromechanische Schallwandleranordnung und entsprechendes Herstellungsverfahren
DE102017209470B3 (de) * 2017-06-06 2018-11-22 Robert Bosch Gmbh Mikromechanische Vorrichtung und Verfahren zur Erzeugung mechanischer Schwingungen
DE102017125117A1 (de) * 2017-10-26 2019-05-02 USound GmbH Schallwandleranordnung
US11594574B2 (en) * 2018-02-16 2023-02-28 International Business Machines Corporation Piezo-junction device
IT201800004758A1 (it) * 2018-04-20 2019-10-20 Trasduttore acustico mems piezoelettrico e relativo procedimento di fabbricazione
EP3790838B1 (fr) * 2018-06-26 2024-07-10 Huawei Technologies Co., Ltd. Actionneur à deux degrés de liberté et dispositif à microsystème électromécanique
TWI707586B (zh) * 2018-08-14 2020-10-11 美律實業股份有限公司 微機電揚聲器
TWI684367B (zh) * 2018-09-14 2020-02-01 美律實業股份有限公司 揚聲器以及其微機電致動器
DE102019201744B4 (de) 2018-12-04 2020-06-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mems-schallwandler
IT201900001017A1 (it) * 2019-01-23 2020-07-23 St Microelectronics Srl Trasduttore elettroacustico microelettromeccanico ad attuazione piezoelettrica e relativo procedimento di fabbricazione
DE102019205735B3 (de) * 2019-04-18 2020-08-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikromechanischer Schallwandler
IT201900007317A1 (it) * 2019-05-27 2020-11-27 St Microelectronics Srl Trasduttore acustico microelettromeccanico piezoelettrico avente caratteristiche migliorate e relativo procedimento di fabbricazione
US10805751B1 (en) * 2019-09-08 2020-10-13 xMEMS Labs, Inc. Sound producing device
DE102019218769A1 (de) * 2019-12-03 2020-11-19 Robert Bosch Gmbh Mikromechanisches Bauteil für eine Aktor- und/oder Sensorvorrichtung
US11057716B1 (en) * 2019-12-27 2021-07-06 xMEMS Labs, Inc. Sound producing device
US11395073B2 (en) 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
WO2021134665A1 (fr) * 2019-12-31 2021-07-08 瑞声声学科技(深圳)有限公司 Haut-parleur mems et son procédé de fabrication
CN111180573B (zh) * 2020-01-07 2022-01-18 中国科学院声学研究所 十字形板状mems压电指向性传感芯片的制备方法
IT202000015073A1 (it) 2020-06-23 2021-12-23 St Microelectronics Srl Trasduttore microelettromeccanico a membrana con smorzatore attivo
US11972749B2 (en) 2020-07-11 2024-04-30 xMEMS Labs, Inc. Wearable sound device
US11399228B2 (en) 2020-07-11 2022-07-26 xMEMS Labs, Inc. Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer
US12028673B2 (en) 2020-07-11 2024-07-02 xMEMS Labs, Inc. Driving circuit and wearable sound device thereof
US11884535B2 (en) 2020-07-11 2024-01-30 xMEMS Labs, Inc. Device, package structure and manufacturing method of device
US12022253B2 (en) * 2020-07-11 2024-06-25 xMEMS Labs, Inc. Venting device
US11323797B2 (en) * 2020-07-11 2022-05-03 xMEMS Labs, Inc. Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer
CN112187095B (zh) * 2020-09-25 2021-11-02 长安大学 一种基于逆挠曲电效应的双向伸缩作动器及作动方法
KR20220091082A (ko) * 2020-12-23 2022-06-30 엘지디스플레이 주식회사 음향 발생 모듈 및 이를 포함하는 차량
FR3120176B1 (fr) * 2021-02-23 2023-11-03 Commissariat Energie Atomique Haut-parleur MEMS et procédé de microfabrication d’un tel haut-parleur
DE102021201784A1 (de) 2021-02-25 2022-08-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein MEMS-Schallwandler-Array
DE102021203360A1 (de) 2021-04-01 2022-10-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Mems-schallwandler
CN113132875A (zh) * 2021-04-25 2021-07-16 广州蜂鸟传感科技有限公司 一种自校准的微机械扬声器
US11711653B2 (en) * 2021-05-11 2023-07-25 xMEMS Labs, Inc. Sound producing cell and manufacturing method thereof
KR20230018953A (ko) * 2021-07-30 2023-02-07 엘지디스플레이 주식회사 진동 장치와 이를 포함하는 장치
CN116233710A (zh) * 2021-12-03 2023-06-06 悠声股份有限公司 具有由胶粘剂制成的阻尼层的mems音频转换器
US11930321B1 (en) * 2022-05-17 2024-03-12 Vibrant Microsystems Inc. Integrated MEMS micro-speaker device and method
DE102022134733A1 (de) 2022-12-23 2024-07-04 USound GmbH MEMS-Vorrichtung mit einem Verbindungselement

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139799A (ja) * 1983-01-31 1984-08-10 Sony Corp 平板型スピ−カ
ATE393319T1 (de) * 1998-09-03 2008-05-15 Ge Novasensor Inc Proportionale, mikromechanische vorrichtung
JP3552601B2 (ja) * 1998-11-16 2004-08-11 日本ビクター株式会社 光偏向子及びこれを用いた表示装置
DE60230673D1 (de) * 2001-07-05 2009-02-12 Ibm Mikrosystemschalter
US7089069B2 (en) 2001-08-17 2006-08-08 Carnegie Mellon University Method and apparatus for reconstruction of soundwaves from digital signals
US7003125B2 (en) 2001-09-12 2006-02-21 Seung-Hwan Yi Micromachined piezoelectric microspeaker and fabricating method thereof
US7116855B2 (en) * 2004-06-30 2006-10-03 Xerox Corporation Optical shuttle system and method used in an optical switch
DE102005043429A1 (de) * 2005-05-19 2006-11-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zur Schwingungsentkopplung
JP4692739B2 (ja) * 2005-06-14 2011-06-01 ソニー株式会社 可動素子、ならびにその可動素子を内蔵するモジュールおよび電子機器
EP2846557B1 (fr) 2007-11-21 2019-04-10 Audio Pixels Ltd. Appareil de haut-parleur amélioré
JP5391600B2 (ja) * 2008-07-16 2014-01-15 船井電機株式会社 振動ミラー素子
KR101562339B1 (ko) 2008-09-25 2015-10-22 삼성전자 주식회사 압전형 마이크로 스피커 및 그 제조 방법
JP5347473B2 (ja) * 2008-12-15 2013-11-20 船井電機株式会社 振動ミラー素子
KR101561663B1 (ko) * 2009-08-31 2015-10-21 삼성전자주식회사 피스톤 다이어프램을 가진 압전형 마이크로 스피커 및 그 제조 방법
FR2955443B1 (fr) 2010-01-19 2012-03-23 Univ Maine Structure de haut-parleur electrodynamique a technologie mems
FR2990320B1 (fr) 2012-05-07 2014-06-06 Commissariat Energie Atomique Haut-parleur digital a performance amelioree
FR3000354B1 (fr) * 2012-12-20 2015-01-30 Commissariat Energie Atomique Dispositif a membrane a deplacement controle
DE102013209234B4 (de) * 2013-05-17 2018-04-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit einem schwingfähig aufgehängten optischen Element

Also Published As

Publication number Publication date
CA2960072C (fr) 2020-07-21
CN107005769A (zh) 2017-08-01
TWI595738B (zh) 2017-08-11
AU2015310896A1 (en) 2017-04-27
EP3100467B1 (fr) 2019-09-18
US10349182B2 (en) 2019-07-09
AU2015310896B2 (en) 2018-12-13
EP3100467A1 (fr) 2016-12-07
KR102033228B1 (ko) 2019-10-16
US20170325030A1 (en) 2017-11-09
AU2015310896B9 (en) 2019-04-18
CN107005769B (zh) 2019-12-17
WO2016034665A1 (fr) 2016-03-10
DE102014217798A1 (de) 2016-03-10
KR20170054432A (ko) 2017-05-17
TW201622335A (zh) 2016-06-16
CA2960072A1 (fr) 2016-03-10

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