HK1232365A1 - 具有執行器結構和與其間隔開的隔膜的 揚聲器 - Google Patents

具有執行器結構和與其間隔開的隔膜的 揚聲器

Info

Publication number
HK1232365A1
HK1232365A1 HK17105731.4A HK17105731A HK1232365A1 HK 1232365 A1 HK1232365 A1 HK 1232365A1 HK 17105731 A HK17105731 A HK 17105731A HK 1232365 A1 HK1232365 A1 HK 1232365A1
Authority
HK
Hong Kong
Prior art keywords
mems
spaced apart
apart therefrom
actuator structure
loudspeaker
Prior art date
Application number
HK17105731.4A
Other languages
English (en)
Inventor
Clerici Andrea Rusconi
Ferruccio Bottoni
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of HK1232365A1 publication Critical patent/HK1232365A1/zh

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021Transducers for transforming electrical into mechanical energy or vice versa
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0037For increasing stroke, i.e. achieve large displacement of actuated parts
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/02Transducers using more than one principle simultaneously
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/16Mounting or tensioning of diaphragms or cones
    • H04R7/18Mounting or tensioning of diaphragms or cones at the periphery
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0257Microphones or microspeakers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/03Static structures
    • B81B2203/0315Cavities
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Multimedia (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
HK17105731.4A 2014-05-14 2017-06-09 具有執行器結構和與其間隔開的隔膜的 揚聲器 HK1232365A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014106753.3A DE102014106753B4 (de) 2014-05-14 2014-05-14 MEMS-Lautsprecher mit Aktuatorstruktur und davon beabstandeter Membran

Publications (1)

Publication Number Publication Date
HK1232365A1 true HK1232365A1 (zh) 2018-01-05

Family

ID=53177488

Family Applications (1)

Application Number Title Priority Date Filing Date
HK17105731.4A HK1232365A1 (zh) 2014-05-14 2017-06-09 具有執行器結構和與其間隔開的隔膜的 揚聲器

Country Status (11)

Country Link
US (2) US10034097B2 (zh)
EP (3) EP3143777B1 (zh)
KR (2) KR102307144B1 (zh)
CN (2) CN106537938B (zh)
AU (2) AU2015261458B2 (zh)
CA (2) CA2948731A1 (zh)
DE (1) DE102014106753B4 (zh)
HK (1) HK1232365A1 (zh)
MY (1) MY177874A (zh)
SG (5) SG11201609518SA (zh)
WO (2) WO2015173334A1 (zh)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114245A1 (de) 2015-08-27 2017-03-02 USound GmbH MEMS-Schallwandler mit geschlossenem Regelsystem
DE102015116640B4 (de) * 2015-10-01 2024-09-05 USound GmbH MEMS-Leiterplattenmodul mit integrierter piezoelektrischer Struktur sowie Schallwandleranordnung
JP6983006B2 (ja) 2017-08-23 2021-12-17 株式会社ジャパンディスプレイ 表示装置
DE102017216907B4 (de) * 2017-09-25 2021-03-25 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung und Verfahren zur Herstellung derselben
US11444556B1 (en) * 2018-03-01 2022-09-13 John M. Leslie Piezoelectric electric energy generating device
IT201800004758A1 (it) * 2018-04-20 2019-10-20 Trasduttore acustico mems piezoelettrico e relativo procedimento di fabbricazione
KR102167474B1 (ko) * 2018-04-25 2020-10-19 주식회사 이엠텍 하이브리드 액추에이터
TWI707586B (zh) * 2018-08-14 2020-10-11 美律實業股份有限公司 微機電揚聲器
TWI684367B (zh) * 2018-09-14 2020-02-01 美律實業股份有限公司 揚聲器以及其微機電致動器
CN110856085B (zh) * 2018-11-30 2021-07-09 美律电子(深圳)有限公司 扬声器结构
TWI683460B (zh) * 2018-11-30 2020-01-21 美律實業股份有限公司 揚聲器結構
TWI716916B (zh) * 2019-06-26 2021-01-21 美律實業股份有限公司 揚聲器結構
IT201900001017A1 (it) * 2019-01-23 2020-07-23 St Microelectronics Srl Trasduttore elettroacustico microelettromeccanico ad attuazione piezoelettrica e relativo procedimento di fabbricazione
CN110290449A (zh) * 2019-05-09 2019-09-27 安徽奥飞声学科技有限公司 一种音频装置及电子设备
IT201900007317A1 (it) 2019-05-27 2020-11-27 St Microelectronics Srl Trasduttore acustico microelettromeccanico piezoelettrico avente caratteristiche migliorate e relativo procedimento di fabbricazione
CN110213705B (zh) * 2019-05-30 2022-08-16 歌尔科技有限公司 Mems扬声器
DE102019125815A1 (de) 2019-09-25 2021-03-25 USound GmbH Schallwandlereinheit zum Erzeugen und/oder Erfassen von Schallwellen im hörbaren Wellenlängenbereich und/oder im Ultraschallbereich
KR102375721B1 (ko) * 2019-11-04 2022-03-17 (주)에스제이인스트루먼트 초음파 트랜스듀서 조립체
WO2021134686A1 (zh) * 2019-12-31 2021-07-08 瑞声声学科技(深圳)有限公司 一种mems扬声器
IT202000015073A1 (it) 2020-06-23 2021-12-23 St Microelectronics Srl Trasduttore microelettromeccanico a membrana con smorzatore attivo
CN111918187B (zh) * 2020-07-08 2021-10-29 瑞声科技(南京)有限公司 Mems扬声器
CN111885467B (zh) * 2020-07-09 2021-09-21 诺思(天津)微系统有限责任公司 Mems压电扬声器
US11595758B2 (en) 2020-07-09 2023-02-28 Apple Inc. MEMS speaker
CN111918188B (zh) * 2020-07-10 2021-12-14 瑞声科技(南京)有限公司 一种mems扬声器及其制造工艺
FR3120176B1 (fr) 2021-02-23 2023-11-03 Commissariat Energie Atomique Haut-parleur MEMS et procédé de microfabrication d’un tel haut-parleur
FR3122023B1 (fr) 2021-04-15 2023-12-29 Commissariat Energie Atomique Haut-parleur micrométrique
US20220332568A1 (en) * 2021-04-19 2022-10-20 Skyworks Solutions, Inc. Dual membrane piezoelectric microelectromechanical system microphone
CN113179472A (zh) * 2021-04-28 2021-07-27 广州博良电子有限公司 一种利用液压传动放大振幅的发声方法和结构
FR3143172A1 (fr) 2022-12-12 2024-06-14 Commissariat A L' Energie Atomique Et Aux Energies Alternatives Dispositif acoustique à fréquence de résonance variable
FR3143170A1 (fr) 2022-12-12 2024-06-14 Commissariat A L' Energie Atomique Et Aux Energies Alternatives Dispositif électromécanique à fréquence de résonance variable et dispositif acoustique associé

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577298U (zh) * 1980-06-12 1982-01-14
JPS59139799A (ja) * 1983-01-31 1984-08-10 Sony Corp 平板型スピ−カ
AU676639B2 (en) * 1994-05-20 1997-03-13 Shinsei Corporation Sound generating device
GB0211508D0 (en) * 2002-05-20 2002-06-26 New Transducers Ltd Transducer
CN1494354A (zh) * 2003-09-27 2004-05-05 百富非凡机电设备(北京)有限公司 改进的喇叭的振膜基材构件及其制造方法
WO2005064989A1 (ja) 2003-12-25 2005-07-14 Murata Manufacturing Co., Ltd. 圧電型電気音響変換器
JP5012512B2 (ja) * 2005-12-27 2012-08-29 日本電気株式会社 圧電アクチュエータおよび電子機器
US20080019543A1 (en) * 2006-07-19 2008-01-24 Yamaha Corporation Silicon microphone and manufacturing method therefor
JP2008030182A (ja) * 2006-08-01 2008-02-14 National Institute Of Advanced Industrial & Technology 定振幅機構及びこれを用いた電位センサ
EP2165565A1 (en) * 2007-06-29 2010-03-24 Nxp B.V. Membrane for an acoustic device and acoustic device
CN101203064B (zh) * 2007-12-24 2012-03-14 瑞声声学科技(常州)有限公司 复合振膜及其制造方法
BRPI0920481A2 (pt) * 2009-01-27 2015-12-22 Hewlett Packard Development Co dispositivo transdutor acústico, microfone e transdutor
KR101561663B1 (ko) 2009-08-31 2015-10-21 삼성전자주식회사 피스톤 다이어프램을 가진 압전형 마이크로 스피커 및 그 제조 방법
KR101561661B1 (ko) * 2009-09-25 2015-10-21 삼성전자주식회사 진동막에 부착된 질량체를 가진 압전형 마이크로 스피커 및 그 제조 방법
KR101573517B1 (ko) * 2009-10-12 2015-12-02 삼성전자주식회사 압전형 마이크로 스피커
DE102012200957A1 (de) * 2011-07-21 2013-01-24 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur
KR101273700B1 (ko) 2011-09-15 2013-06-12 삼성전기주식회사 Mems 소자
US9402137B2 (en) 2011-11-14 2016-07-26 Infineon Technologies Ag Sound transducer with interdigitated first and second sets of comb fingers
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
JP5987572B2 (ja) * 2012-09-11 2016-09-07 オムロン株式会社 音響トランスデューサ
JP5991475B2 (ja) * 2012-09-14 2016-09-14 オムロン株式会社 音響トランスデューサ
CN104541521B (zh) 2013-08-06 2017-12-26 歌尔股份有限公司 抗冲击硅基mems麦克风、包含该麦克风的系统和封装

Also Published As

Publication number Publication date
WO2015173334A1 (de) 2015-11-19
EP3143777B1 (de) 2021-01-06
CN106537938B (zh) 2020-03-27
EP3143778A1 (de) 2017-03-22
AU2015261459A1 (en) 2016-12-15
CN106688245A (zh) 2017-05-17
US9980051B2 (en) 2018-05-22
DE102014106753A1 (de) 2015-11-19
AU2015261458B2 (en) 2019-05-16
KR20160149284A (ko) 2016-12-27
SG10201810091WA (en) 2018-12-28
DE102014106753B4 (de) 2022-08-11
EP3143777A1 (de) 2017-03-22
SG11201609519TA (en) 2016-12-29
CA2948731A1 (en) 2015-11-19
CN106537938A (zh) 2017-03-22
CA2948725A1 (en) 2015-11-19
US20170085994A1 (en) 2017-03-23
KR102307144B1 (ko) 2021-09-30
SG10201810071TA (en) 2018-12-28
AU2015261459B2 (en) 2019-03-14
CN106688245B (zh) 2020-06-16
US10034097B2 (en) 2018-07-24
EP3823304B1 (de) 2024-04-03
US20170094418A1 (en) 2017-03-30
WO2015173333A1 (de) 2015-11-19
EP3143778B1 (de) 2021-06-16
AU2015261458A1 (en) 2016-12-15
SG10202001750SA (en) 2020-04-29
MY177874A (en) 2020-09-24
SG11201609518SA (en) 2016-12-29
EP3823304A1 (de) 2021-05-19
KR20170007413A (ko) 2017-01-18

Similar Documents

Publication Publication Date Title
HK1232365A1 (zh) 具有執行器結構和與其間隔開的隔膜的 揚聲器
EP3518558A4 (en) MEMS MICROPHONE
EP3370435C0 (en) HEARING AID DEVICE WITH A SENSOR ELEMENT
HK1247015A1 (zh) 具有mems聲音轉換器的聲音轉換器組件
EP3162622A4 (en) Acoustic device
EP3136751B8 (de) Mems-lautsprecher mit positionssensor
HK1250555A1 (zh) 具有封閉控制系統的mems聲換能器
EP3297294A4 (en) Mems microphone
GB201801387D0 (en) Interated mems transducers
HK1218209A1 (zh) 電聲學隔膜
EP3192279A4 (en) Mems device with acoustic leak control features
GB2538809B (en) Loudspeaker diaphragm
GB2555534B (en) Loudspeaker assembly
EP3153461A4 (en) Mems device
EP3118873A4 (en) Electret sheet and piezoelectric sensor
EP3100466A4 (en) Acoustic structure with passive diaphragm
EP3073763A4 (en) Speaker device
EP3213358A4 (en) Electromagnetic mems device
EP3190806A4 (en) Loudspeaker
EP3166335A4 (en) Speaker device
EP3140998A4 (en) Speaker
EP3214854A4 (en) Speaker device
GB201712487D0 (en) Loudspeaker structure
EP3119110A4 (en) Loudspeaker
EP3229492A4 (en) Microphone

Legal Events

Date Code Title Description
AM Amended specification (according sect 146 of patent law)

Free format text: CORRECTION OF NAME OF INVENTOR FROM ROSCONI CLERICI, ANDREA T

Effective date: 20181218