SG11201700624WA - Packaging system and packaging method for laser-sealed glass package - Google Patents

Packaging system and packaging method for laser-sealed glass package

Info

Publication number
SG11201700624WA
SG11201700624WA SG11201700624WA SG11201700624WA SG11201700624WA SG 11201700624W A SG11201700624W A SG 11201700624WA SG 11201700624W A SG11201700624W A SG 11201700624WA SG 11201700624W A SG11201700624W A SG 11201700624WA SG 11201700624W A SG11201700624W A SG 11201700624WA
Authority
SG
Singapore
Prior art keywords
packaging
laser
sealed glass
glass package
packaging system
Prior art date
Application number
SG11201700624WA
Other languages
English (en)
Inventor
Leili Cheng
Original Assignee
Shanghai Microelectronics Equi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Microelectronics Equi filed Critical Shanghai Microelectronics Equi
Publication of SG11201700624WA publication Critical patent/SG11201700624WA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Mechanical Optical Scanning Systems (AREA)
SG11201700624WA 2014-07-29 2015-05-27 Packaging system and packaging method for laser-sealed glass package SG11201700624WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410367503.2A CN105336876B (zh) 2014-07-29 2014-07-29 激光密封玻璃封装体封装系统和封装方法
PCT/CN2015/079905 WO2016015514A1 (zh) 2014-07-29 2015-05-27 激光密封玻璃封装体封装系统和封装方法

Publications (1)

Publication Number Publication Date
SG11201700624WA true SG11201700624WA (en) 2017-03-30

Family

ID=55216737

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700624WA SG11201700624WA (en) 2014-07-29 2015-05-27 Packaging system and packaging method for laser-sealed glass package

Country Status (6)

Country Link
JP (1) JP6433576B2 (ja)
KR (1) KR20170039704A (ja)
CN (1) CN105336876B (ja)
SG (1) SG11201700624WA (ja)
TW (1) TWI623120B (ja)
WO (1) WO2016015514A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105932175B (zh) * 2016-06-28 2019-04-23 京东方科技集团股份有限公司 待封装基板、封装方法、封装结构及显示装置
CN107565061B (zh) * 2016-06-30 2019-09-17 上海微电子装备（集团）股份有限公司 激光封装系统及封装方法
CN107799667B (zh) * 2016-08-30 2020-01-24 上海微电子装备（集团）股份有限公司 玻璃料封装设备及其封装方法
CN106531905B (zh) * 2016-11-14 2018-07-31 电子科技大学 一种有机电致发光器件的激光封装装置以及方法
CN108123052A (zh) * 2016-11-30 2018-06-05 上海微电子装备（集团）股份有限公司 一种激光封装装置和方法
EP3674029A1 (en) * 2018-12-28 2020-07-01 Etxe-Tar, S.A. Method and system for heating an object using an energy beam
CN111400989B (zh) * 2018-12-29 2022-06-17 上海微电子装备（集团）股份有限公司 激光封装路径获取方法、激光封装方法以及激光封装系统
CN115463905B (zh) * 2022-10-25 2023-11-24 武汉锐科光纤激光技术股份有限公司 一种激光清洗控制系统及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766616A (en) * 1972-03-22 1973-10-23 Statek Corp Microresonator packaging and tuning
US6849825B2 (en) * 2001-11-30 2005-02-01 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
KR100887009B1 (ko) * 2005-12-06 2009-03-04 코닝 인코포레이티드 완전 밀봉 글래스 패키지 및 그 제조방법
KR100837618B1 (ko) * 2006-12-29 2008-06-13 주식회사 엘티에스 유리기판의 밀봉시스템 및 밀봉방법
JP2009104841A (ja) * 2007-10-22 2009-05-14 Toshiba Corp 封止装置、封止方法、電子デバイス、および電子デバイスの製造方法
KR101453878B1 (ko) * 2008-08-07 2014-10-23 삼성디스플레이 주식회사 평판 표시장치의 제조방법
KR101117732B1 (ko) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
CN101804517B (zh) * 2010-03-24 2013-04-24 苏州市博海激光科技有限公司 薄型材料激光在线打孔装置
CN201646001U (zh) * 2010-03-31 2010-11-24 深圳市大族激光科技股份有限公司 一种激光打标机
TW201238387A (en) * 2011-01-06 2012-09-16 Asahi Glass Co Ltd Method and device for manufacturing glass members with sealing material layer, and method for manufacturing electronic devices
CN102116933A (zh) * 2011-02-28 2011-07-06 许小曙 一种用于选择性激光烧结的激光扫描方法
US9472776B2 (en) * 2011-10-14 2016-10-18 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sealed structure including welded glass frits
CN102430860A (zh) * 2011-10-24 2012-05-02 华中科技大学 一种移动式振镜装置
JP6075715B2 (ja) * 2012-09-25 2017-02-08 日本電気硝子株式会社 ビスマス系ガラス及びこれを用いた封着材料
KR102160829B1 (ko) * 2012-11-02 2020-09-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 밀봉체 및 밀봉체의 제작 방법
CN103482857A (zh) * 2013-09-30 2014-01-01 上海大学 激光准同步扫描方法和系统

Also Published As

Publication number Publication date
TW201605096A (zh) 2016-02-01
TWI623120B (zh) 2018-05-01
WO2016015514A1 (zh) 2016-02-04
JP6433576B2 (ja) 2018-12-05
KR20170039704A (ko) 2017-04-11
CN105336876B (zh) 2017-08-29
CN105336876A (zh) 2016-02-17
JP2017530512A (ja) 2017-10-12

Similar Documents

Publication Publication Date Title
ZA201704119B (en) Method and device for sterilizing containers
PL3116788T3 (pl) System kontroli opakowań produktów dla osób palących oraz powiązany sposób
EP3322659C0 (en) METHOD AND SYSTEM FOR PRODUCING PACKS
EP3288835C0 (en) METHOD AND SYSTEM FOR FORMING PACKAGES
EP3288834A4 (en) METHOD AND SYSTEM FOR FORMING PACKAGINGS
SI3322664T1 (sl) Postopek in polnilni sistem za polnjenje vsebnikov
SG11201700622VA (en) Laser packaging system and method
HK1221204A1 (zh) 包裝體及其製造方法
SG11201700624WA (en) Packaging system and packaging method for laser-sealed glass package
TWI560828B (en) Chip package and method for forming the same
EP3238689A4 (en) Package for patch and packaging method
HK1243040A1 (zh) 底部帶有撐板的包裝和熱封方法
PL3237290T3 (pl) Urządzenie i sposób do etykietowania pojedynczych opakowań
PL3380409T3 (pl) System pakowania i wykroje do niego
EP3228550A4 (en) Method and system for sterilizing containers
PT3157816T (pt) Sistema e processo para embalar por sopro, enchimento, e vedação a frio
PL3362369T3 (pl) Urządzenie i sposób etykietowania pojedynczych opakowań
PL3180260T3 (pl) Opakowania z indywidualnie szczelnie zamkniętymi komorami i sposób ich wytwarzania
ZA201706335B (en) Detonator packaging system and method
PL3271254T3 (pl) Urządzenie i sposób etykietowania poszczególnych opakowań
PL3201092T3 (pl) System pakowania w dopasowane pudełko
EP3211685A4 (en) Packaging system and packaging method
TWI561904B (en) Substrate packaging structure and packaging method thereof
GB2550094B (en) Packaging system
PL3218286T3 (pl) Element opakowania i sposób pakownia