SG11201700026XA - Cleaning device and roll cleaning member - Google Patents

Cleaning device and roll cleaning member

Info

Publication number
SG11201700026XA
SG11201700026XA SG11201700026XA SG11201700026XA SG11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA
Authority
SG
Singapore
Prior art keywords
cleaning
roll
cleaning device
cleaning member
roll cleaning
Prior art date
Application number
SG11201700026XA
Other languages
English (en)
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201700026XA publication Critical patent/SG11201700026XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • B08B1/10—
    • B08B1/32—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
SG11201700026XA 2014-07-04 2015-07-01 Cleaning device and roll cleaning member SG11201700026XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014138685 2014-07-04
JP2015129639A JP6366544B2 (ja) 2014-07-04 2015-06-29 洗浄装置及びロール洗浄部材
PCT/JP2015/003314 WO2016002219A1 (ja) 2014-07-04 2015-07-01 洗浄装置及びロール洗浄部材

Publications (1)

Publication Number Publication Date
SG11201700026XA true SG11201700026XA (en) 2017-02-27

Family

ID=55018792

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700026XA SG11201700026XA (en) 2014-07-04 2015-07-01 Cleaning device and roll cleaning member

Country Status (8)

Country Link
US (1) US10453708B2 (ja)
JP (1) JP6366544B2 (ja)
KR (1) KR102282899B1 (ja)
CN (1) CN106663620B (ja)
MY (1) MY176791A (ja)
SG (1) SG11201700026XA (ja)
TW (1) TWI686868B (ja)
WO (1) WO2016002219A1 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269555B2 (en) * 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
KR102629528B1 (ko) * 2018-01-09 2024-01-25 도쿄엘렉트론가부시키가이샤 세정 장치, 세정 방법 및 컴퓨터 기억 매체
USD923890S1 (en) * 2018-09-07 2021-06-29 Maradyne Corporation Mattress surface cleaning agitator
CN109007900B (zh) * 2018-09-20 2023-09-12 安徽科技学院 一种海带无损伤清洗装置及其清洗方法
USD897111S1 (en) * 2019-03-11 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906683S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906681S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906680S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906682S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD897112S1 (en) * 2019-03-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906684S1 (en) * 2019-03-28 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906685S1 (en) * 2019-04-02 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907370S1 (en) * 2019-04-05 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907925S1 (en) * 2019-04-23 2021-01-19 Ali Ebrahimi Afrouzi Side brush
USD897113S1 (en) * 2019-04-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906686S1 (en) * 2019-04-30 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907371S1 (en) * 2019-05-03 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907372S1 (en) * 2019-06-10 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907926S1 (en) * 2019-06-10 2021-01-19 Ali Ebrahimi Afrouzi Side brush
CN111790682B (zh) * 2020-06-30 2022-06-28 鹰潭拓新机电股份有限公司 一种模具零件清洗装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3403108B2 (ja) 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
US7984526B2 (en) * 2003-08-08 2011-07-26 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
JP2006075718A (ja) 2004-09-09 2006-03-23 Aion Kk 弾性ローラ
JP2008311481A (ja) * 2007-06-15 2008-12-25 Sony Corp 基板洗浄方法、基板洗浄装置及び半導体製造方法
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置
US20100043160A1 (en) * 2008-08-20 2010-02-25 United Microelectronics Corp. Wafer cleaning roller
US20130048018A1 (en) 2010-02-22 2013-02-28 Entegris, Inc. Post-cmp cleaning brush
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
JP2011233646A (ja) * 2010-04-26 2011-11-17 Sumitomo Metal Mining Co Ltd 半導体用基板の洗浄方法

Also Published As

Publication number Publication date
JP6366544B2 (ja) 2018-08-01
KR20170029536A (ko) 2017-03-15
WO2016002219A1 (ja) 2016-01-07
MY176791A (en) 2020-08-21
US20170170034A1 (en) 2017-06-15
CN106663620A (zh) 2017-05-10
KR102282899B1 (ko) 2021-07-27
TW201604962A (zh) 2016-02-01
CN106663620B (zh) 2020-03-27
JP2016027641A (ja) 2016-02-18
US10453708B2 (en) 2019-10-22
TWI686868B (zh) 2020-03-01

Similar Documents

Publication Publication Date Title
SG11201700026XA (en) Cleaning device and roll cleaning member
IL249875B (en) Apparatus and system for creating a spray
IL252216B (en) Difluoromethyl-aminopyridines and difluoromethyl-aminopyrimidines
HUE042596T2 (hu) Tisztítóberendezés és az ehhez tartozó mûködési eljárás
HK1249004A1 (zh) 按摩裝置
GB201417457D0 (en) Hygiene device
AU360502S (en) Massage device
HK1195705A2 (en) Portable visual cleaning device
AU360504S (en) Massage device
HK1248996B (zh) 清潔裝置
HK1223815A1 (zh) 按摩裝置
AU360503S (en) Massage device
ZA201702623B (en) Classifier cleaning device
SG11201606317VA (en) Massage device
HK1243077A1 (zh) 呱啶基吡唑並嘧啶酮及其用途
IL247418A0 (en) Ink-jet head cleaning device and method
ZA201700162B (en) Cleaning device
TWM490697U (en) Roll call device
PL3285631T3 (pl) Ręcznie przesuwane urządzenie czyszczące z przeciwbieżnymi rolkami
PL3461798T3 (pl) Urządzenie do czyszczenia wałków
PL3045637T3 (pl) System okuciowy
HK1215128A2 (zh) 離子發生裝置
SG10201606599TA (en) Cleaning device
EP3020315C0 (de) Flächenreinigungsvorrichtung
GB201616789D0 (en) Cleaning device