SG11201610269WA - Chemical mechanical polishing retaining ring with integrated sensor - Google Patents

Chemical mechanical polishing retaining ring with integrated sensor

Info

Publication number
SG11201610269WA
SG11201610269WA SG11201610269WA SG11201610269WA SG11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA
Authority
SG
Singapore
Prior art keywords
retaining ring
mechanical polishing
chemical mechanical
integrated sensor
polishing retaining
Prior art date
Application number
SG11201610269WA
Other languages
English (en)
Inventor
Simon Yavelberg
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201610269WA publication Critical patent/SG11201610269WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
SG11201610269WA 2014-06-16 2015-05-28 Chemical mechanical polishing retaining ring with integrated sensor SG11201610269WA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462012812P 2014-06-16 2014-06-16
US14/720,047 US9878421B2 (en) 2014-06-16 2015-05-22 Chemical mechanical polishing retaining ring with integrated sensor
PCT/US2015/032818 WO2015195284A1 (en) 2014-06-16 2015-05-28 Chemical mechanical polishing retaining ring with integrated sensor

Publications (1)

Publication Number Publication Date
SG11201610269WA true SG11201610269WA (en) 2017-01-27

Family

ID=54835382

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610269WA SG11201610269WA (en) 2014-06-16 2015-05-28 Chemical mechanical polishing retaining ring with integrated sensor

Country Status (7)

Country Link
US (2) US9878421B2 (ja)
JP (2) JP6586108B2 (ja)
KR (1) KR102409848B1 (ja)
CN (2) CN106463381B (ja)
SG (1) SG11201610269WA (ja)
TW (2) TWI720443B (ja)
WO (1) WO2015195284A1 (ja)

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US10207389B2 (en) * 2014-07-17 2019-02-19 Applied Materials, Inc. Polishing pad configuration and chemical mechanical polishing system
JP6400620B2 (ja) 2016-03-11 2018-10-03 東芝メモリ株式会社 半導体製造装置の制御装置および制御方法
US10513008B2 (en) 2016-09-15 2019-12-24 Applied Materials, Inc. Chemical mechanical polishing smart ring
US10930535B2 (en) * 2016-12-02 2021-02-23 Applied Materials, Inc. RFID part authentication and tracking of processing components
JP6990980B2 (ja) * 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
JP6437608B1 (ja) * 2017-09-08 2018-12-12 東芝メモリ株式会社 研磨装置、研磨方法、および研磨制御装置
AU2019206449B2 (en) 2018-01-11 2021-05-06 Shell Internationale Research Maatschappij B.V. Wireless reactor monitoring system using passive sensor enabled RFID tag
JP7268033B2 (ja) 2018-01-11 2023-05-02 シエル・インターナシヨナル・リサーチ・マートスハツペイ・ベー・ヴエー 複数のセンサー対応ｒｆｉｄタグおよび複数のトランシーバーを使用する反応器条件の無線による監視およびプロファイリング
EP3738320A1 (en) 2018-01-11 2020-11-18 Shell Internationale Research Maatschappij B.V. Wireless monitoring and profiling of reactor conditions using plurality of sensor-enabled rfid tags having known locations
US11701749B2 (en) 2018-03-13 2023-07-18 Applied Materials, Inc. Monitoring of vibrations during chemical mechanical polishing
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
KR20210122888A (ko) * 2019-02-28 2021-10-12 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 캐리어 헤드를 위한 리테이너
TWI834195B (zh) * 2019-04-18 2024-03-01 美商應用材料股份有限公司 Ｃｍｐ期間基於溫度的原位邊緣不對稱校正的電腦可讀取儲存媒體
JP2020189366A (ja) * 2019-05-22 2020-11-26 株式会社荏原製作所 研磨装置および研磨方法
CN110103133A (zh) * 2019-06-25 2019-08-09 吉姆西半导体科技（无锡）有限公司 研磨头微漏检测系统
JP7339811B2 (ja) * 2019-08-27 2023-09-06 株式会社荏原製作所 リテーナリングに局所荷重を伝達するローラーの異常検出方法および研磨装置
CN118163032A (zh) * 2019-09-30 2024-06-11 清华大学 一种化学机械抛光保持环和化学机械抛光承载头
JP7365282B2 (ja) * 2020-03-26 2023-10-19 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP2022017108A (ja) * 2020-07-13 2022-01-25 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
CN113970370B (zh) * 2020-07-24 2024-02-02 泉芯集成电路制造(济南)有限公司 一种研磨平台的振动监测系统及振动监测方法
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
CN115026698A (zh) * 2022-07-01 2022-09-09 深圳市易天自动化设备股份有限公司 研磨清洁组件及其控制方法和研磨清洁装置

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Also Published As

Publication number Publication date
CN106463381A (zh) 2017-02-22
TWI720443B (zh) 2021-03-01
JP6938585B2 (ja) 2021-09-22
TW201600235A (zh) 2016-01-01
CN111421468B (zh) 2022-04-12
KR102409848B1 (ko) 2022-06-15
US9878421B2 (en) 2018-01-30
CN106463381B (zh) 2020-02-11
CN111421468A (zh) 2020-07-17
WO2015195284A1 (en) 2015-12-23
TW201936320A (zh) 2019-09-16
US20180133863A1 (en) 2018-05-17
TWI663023B (zh) 2019-06-21
JP6586108B2 (ja) 2019-10-02
US20150360343A1 (en) 2015-12-17
JP2020078862A (ja) 2020-05-28
JP2017528904A (ja) 2017-09-28
US10946496B2 (en) 2021-03-16
KR20170020462A (ko) 2017-02-22

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