SG11201610269WA - Chemical mechanical polishing retaining ring with integrated sensor - Google Patents
Chemical mechanical polishing retaining ring with integrated sensorInfo
- Publication number
- SG11201610269WA SG11201610269WA SG11201610269WA SG11201610269WA SG11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA
- Authority
- SG
- Singapore
- Prior art keywords
- retaining ring
- mechanical polishing
- chemical mechanical
- integrated sensor
- polishing retaining
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462012812P | 2014-06-16 | 2014-06-16 | |
US14/720,047 US9878421B2 (en) | 2014-06-16 | 2015-05-22 | Chemical mechanical polishing retaining ring with integrated sensor |
PCT/US2015/032818 WO2015195284A1 (en) | 2014-06-16 | 2015-05-28 | Chemical mechanical polishing retaining ring with integrated sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201610269WA true SG11201610269WA (en) | 2017-01-27 |
Family
ID=54835382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201610269WA SG11201610269WA (en) | 2014-06-16 | 2015-05-28 | Chemical mechanical polishing retaining ring with integrated sensor |
Country Status (7)
Country | Link |
---|---|
US (2) | US9878421B2 (en) |
JP (2) | JP6586108B2 (en) |
KR (1) | KR102409848B1 (en) |
CN (2) | CN106463381B (en) |
SG (1) | SG11201610269WA (en) |
TW (2) | TWI720443B (en) |
WO (1) | WO2015195284A1 (en) |
Families Citing this family (24)
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US9878421B2 (en) * | 2014-06-16 | 2018-01-30 | Applied Materials, Inc. | Chemical mechanical polishing retaining ring with integrated sensor |
US10207389B2 (en) * | 2014-07-17 | 2019-02-19 | Applied Materials, Inc. | Polishing pad configuration and chemical mechanical polishing system |
JP6400620B2 (en) | 2016-03-11 | 2018-10-03 | 東芝メモリ株式会社 | Control device and control method for semiconductor manufacturing apparatus |
SG11201901352XA (en) * | 2016-09-15 | 2019-04-29 | Applied Materials Inc | Chemical mechanical polishing smart ring |
US10930535B2 (en) | 2016-12-02 | 2021-02-23 | Applied Materials, Inc. | RFID part authentication and tracking of processing components |
JP6990980B2 (en) | 2017-03-31 | 2022-01-12 | 株式会社荏原製作所 | Board processing equipment |
JP6437608B1 (en) * | 2017-09-08 | 2018-12-12 | 東芝メモリ株式会社 | Polishing apparatus, polishing method, and polishing control apparatus |
CN111567061B (en) * | 2018-01-11 | 2022-06-10 | 国际壳牌研究有限公司 | Wireless monitoring and analysis of reactor conditions using multiple sensor-enabled RFID tags with known locations |
AU2019206449B2 (en) | 2018-01-11 | 2021-05-06 | Shell Internationale Research Maatschappij B.V. | Wireless reactor monitoring system using passive sensor enabled RFID tag |
JP7268033B2 (en) | 2018-01-11 | 2023-05-02 | シエル・インターナシヨナル・リサーチ・マートスハツペイ・ベー・ヴエー | Wireless monitoring and profiling of reactor conditions using multiple sensor-enabled RFID tags and multiple transceivers |
TWI805709B (en) | 2018-03-13 | 2023-06-21 | 美商應用材料股份有限公司 | Apparatus for monitoring of vibrations during chemical mechanical polishing |
US11731232B2 (en) | 2018-10-30 | 2023-08-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Irregular mechanical motion detection systems and method |
KR20210122888A (en) * | 2019-02-28 | 2021-10-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Retainers for chemical mechanical polishing carrier heads |
TWI834195B (en) * | 2019-04-18 | 2024-03-01 | 美商應用材料股份有限公司 | Computer readable storage medium of temperature-based in-situ edge assymetry correction during cmp |
JP2020189366A (en) * | 2019-05-22 | 2020-11-26 | 株式会社荏原製作所 | Polishing device and polishing method |
CN110103133A (en) * | 2019-06-25 | 2019-08-09 | 吉姆西半导体科技(无锡)有限公司 | The micro- missing inspection examining system of grinding head |
US11623320B2 (en) | 2019-08-21 | 2023-04-11 | Applied Materials, Inc. | Polishing head with membrane position control |
CN118163032A (en) * | 2019-09-30 | 2024-06-11 | 清华大学 | Chemical mechanical polishing retaining ring and chemical mechanical polishing bearing head |
JP7365282B2 (en) * | 2020-03-26 | 2023-10-19 | 株式会社荏原製作所 | Polishing head system and polishing equipment |
JP7523269B2 (en) * | 2020-07-13 | 2024-07-26 | 株式会社荏原製作所 | Substrate processing apparatus and waterproof device for acoustic sensor |
CN113970370B (en) * | 2020-07-24 | 2024-02-02 | 泉芯集成电路制造(济南)有限公司 | Vibration monitoring system and vibration monitoring method of grinding platform |
JP2022080370A (en) * | 2020-11-18 | 2022-05-30 | 株式会社荏原製作所 | Substrate holding device |
US20220410340A1 (en) * | 2021-06-25 | 2022-12-29 | Globalwafers Co., Ltd. | Polishing head assembly having recess and cap |
CN115026698A (en) * | 2022-07-01 | 2022-09-09 | 深圳市易天自动化设备股份有限公司 | Grinding and cleaning assembly, control method thereof and grinding and cleaning device |
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US5222329A (en) | 1992-03-26 | 1993-06-29 | Micron Technology, Inc. | Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials |
US5876265A (en) * | 1995-04-26 | 1999-03-02 | Fujitsu Limited | End point polishing apparatus and polishing method |
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TWI572441B (en) * | 2008-08-05 | 2017-03-01 | 荏原製作所股份有限公司 | Polishing method and apparatus |
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KR101104824B1 (en) * | 2011-01-19 | 2012-01-16 | 김오수 | Carrier head and carrier head unit |
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KR101918800B1 (en) | 2012-02-27 | 2018-11-14 | 어플라이드 머티어리얼스, 인코포레이티드 | Feedback control using detection of clearance and adjustment for uniform topography |
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US9878421B2 (en) * | 2014-06-16 | 2018-01-30 | Applied Materials, Inc. | Chemical mechanical polishing retaining ring with integrated sensor |
-
2015
- 2015-05-22 US US14/720,047 patent/US9878421B2/en active Active
- 2015-05-27 TW TW108109763A patent/TWI720443B/en active
- 2015-05-27 TW TW104117023A patent/TWI663023B/en active
- 2015-05-28 KR KR1020177001345A patent/KR102409848B1/en active IP Right Grant
- 2015-05-28 JP JP2016573818A patent/JP6586108B2/en active Active
- 2015-05-28 SG SG11201610269WA patent/SG11201610269WA/en unknown
- 2015-05-28 WO PCT/US2015/032818 patent/WO2015195284A1/en active Application Filing
- 2015-05-28 CN CN201580030103.5A patent/CN106463381B/en active Active
- 2015-05-28 CN CN201911325272.8A patent/CN111421468B/en active Active
-
2017
- 2017-12-28 US US15/856,503 patent/US10946496B2/en active Active
-
2019
- 2019-09-06 JP JP2019162902A patent/JP6938585B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201600235A (en) | 2016-01-01 |
JP2017528904A (en) | 2017-09-28 |
CN111421468B (en) | 2022-04-12 |
TW201936320A (en) | 2019-09-16 |
WO2015195284A1 (en) | 2015-12-23 |
US20150360343A1 (en) | 2015-12-17 |
KR20170020462A (en) | 2017-02-22 |
US20180133863A1 (en) | 2018-05-17 |
JP2020078862A (en) | 2020-05-28 |
KR102409848B1 (en) | 2022-06-15 |
CN106463381B (en) | 2020-02-11 |
US9878421B2 (en) | 2018-01-30 |
TWI663023B (en) | 2019-06-21 |
JP6586108B2 (en) | 2019-10-02 |
CN106463381A (en) | 2017-02-22 |
TWI720443B (en) | 2021-03-01 |
CN111421468A (en) | 2020-07-17 |
JP6938585B2 (en) | 2021-09-22 |
US10946496B2 (en) | 2021-03-16 |
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