SG11201610269WA - Chemical mechanical polishing retaining ring with integrated sensor - Google Patents

Chemical mechanical polishing retaining ring with integrated sensor

Info

Publication number
SG11201610269WA
SG11201610269WA SG11201610269WA SG11201610269WA SG11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA SG 11201610269W A SG11201610269W A SG 11201610269WA
Authority
SG
Singapore
Prior art keywords
retaining ring
mechanical polishing
chemical mechanical
integrated sensor
polishing retaining
Prior art date
Application number
SG11201610269WA
Inventor
Simon Yavelberg
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201610269WA publication Critical patent/SG11201610269WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
SG11201610269WA 2014-06-16 2015-05-28 Chemical mechanical polishing retaining ring with integrated sensor SG11201610269WA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462012812P 2014-06-16 2014-06-16
US14/720,047 US9878421B2 (en) 2014-06-16 2015-05-22 Chemical mechanical polishing retaining ring with integrated sensor
PCT/US2015/032818 WO2015195284A1 (en) 2014-06-16 2015-05-28 Chemical mechanical polishing retaining ring with integrated sensor

Publications (1)

Publication Number Publication Date
SG11201610269WA true SG11201610269WA (en) 2017-01-27

Family

ID=54835382

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610269WA SG11201610269WA (en) 2014-06-16 2015-05-28 Chemical mechanical polishing retaining ring with integrated sensor

Country Status (7)

Country Link
US (2) US9878421B2 (en)
JP (2) JP6586108B2 (en)
KR (1) KR102409848B1 (en)
CN (2) CN106463381B (en)
SG (1) SG11201610269WA (en)
TW (2) TWI720443B (en)
WO (1) WO2015195284A1 (en)

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US9878421B2 (en) * 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
US10207389B2 (en) * 2014-07-17 2019-02-19 Applied Materials, Inc. Polishing pad configuration and chemical mechanical polishing system
JP6400620B2 (en) 2016-03-11 2018-10-03 東芝メモリ株式会社 Control device and control method for semiconductor manufacturing apparatus
SG11201901352XA (en) * 2016-09-15 2019-04-29 Applied Materials Inc Chemical mechanical polishing smart ring
US10930535B2 (en) 2016-12-02 2021-02-23 Applied Materials, Inc. RFID part authentication and tracking of processing components
JP6990980B2 (en) 2017-03-31 2022-01-12 株式会社荏原製作所 Board processing equipment
JP6437608B1 (en) * 2017-09-08 2018-12-12 東芝メモリ株式会社 Polishing apparatus, polishing method, and polishing control apparatus
CN111567061B (en) * 2018-01-11 2022-06-10 国际壳牌研究有限公司 Wireless monitoring and analysis of reactor conditions using multiple sensor-enabled RFID tags with known locations
AU2019206449B2 (en) 2018-01-11 2021-05-06 Shell Internationale Research Maatschappij B.V. Wireless reactor monitoring system using passive sensor enabled RFID tag
JP7268033B2 (en) 2018-01-11 2023-05-02 シエル・インターナシヨナル・リサーチ・マートスハツペイ・ベー・ヴエー Wireless monitoring and profiling of reactor conditions using multiple sensor-enabled RFID tags and multiple transceivers
TWI805709B (en) 2018-03-13 2023-06-21 美商應用材料股份有限公司 Apparatus for monitoring of vibrations during chemical mechanical polishing
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
KR20210122888A (en) * 2019-02-28 2021-10-12 어플라이드 머티어리얼스, 인코포레이티드 Retainers for chemical mechanical polishing carrier heads
TWI834195B (en) * 2019-04-18 2024-03-01 美商應用材料股份有限公司 Computer readable storage medium of temperature-based in-situ edge assymetry correction during cmp
JP2020189366A (en) * 2019-05-22 2020-11-26 株式会社荏原製作所 Polishing device and polishing method
CN110103133A (en) * 2019-06-25 2019-08-09 吉姆西半导体科技（无锡）有限公司 The micro- missing inspection examining system of grinding head
US11623320B2 (en) 2019-08-21 2023-04-11 Applied Materials, Inc. Polishing head with membrane position control
CN118163032A (en) * 2019-09-30 2024-06-11 清华大学 Chemical mechanical polishing retaining ring and chemical mechanical polishing bearing head
JP7365282B2 (en) * 2020-03-26 2023-10-19 株式会社荏原製作所 Polishing head system and polishing equipment
JP7523269B2 (en) * 2020-07-13 2024-07-26 株式会社荏原製作所 Substrate processing apparatus and waterproof device for acoustic sensor
CN113970370B (en) * 2020-07-24 2024-02-02 泉芯集成电路制造(济南)有限公司 Vibration monitoring system and vibration monitoring method of grinding platform
JP2022080370A (en) * 2020-11-18 2022-05-30 株式会社荏原製作所 Substrate holding device
US20220410340A1 (en) * 2021-06-25 2022-12-29 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
CN115026698A (en) * 2022-07-01 2022-09-09 深圳市易天自动化设备股份有限公司 Grinding and cleaning assembly, control method thereof and grinding and cleaning device

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Also Published As

Publication number Publication date
TW201600235A (en) 2016-01-01
JP2017528904A (en) 2017-09-28
CN111421468B (en) 2022-04-12
TW201936320A (en) 2019-09-16
WO2015195284A1 (en) 2015-12-23
US20150360343A1 (en) 2015-12-17
KR20170020462A (en) 2017-02-22
US20180133863A1 (en) 2018-05-17
JP2020078862A (en) 2020-05-28
KR102409848B1 (en) 2022-06-15
CN106463381B (en) 2020-02-11
US9878421B2 (en) 2018-01-30
TWI663023B (en) 2019-06-21
JP6586108B2 (en) 2019-10-02
CN106463381A (en) 2017-02-22
TWI720443B (en) 2021-03-01
CN111421468A (en) 2020-07-17
JP6938585B2 (en) 2021-09-22
US10946496B2 (en) 2021-03-16

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