SG11201609642QA - Lithographic apparatus, method of transferring a substrate and device manufacturing method - Google Patents
Lithographic apparatus, method of transferring a substrate and device manufacturing methodInfo
- Publication number
- SG11201609642QA SG11201609642QA SG11201609642QA SG11201609642QA SG11201609642QA SG 11201609642Q A SG11201609642Q A SG 11201609642QA SG 11201609642Q A SG11201609642Q A SG 11201609642QA SG 11201609642Q A SG11201609642Q A SG 11201609642QA SG 11201609642Q A SG11201609642Q A SG 11201609642QA
- Authority
- SG
- Singapore
- Prior art keywords
- transferring
- substrate
- device manufacturing
- lithographic apparatus
- lithographic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Robotics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14172626 | 2014-06-16 | ||
EP14178554 | 2014-07-25 | ||
EP14198779 | 2014-12-18 | ||
PCT/EP2015/060427 WO2015193036A1 (en) | 2014-06-16 | 2015-05-12 | Lithographic apparatus, method of transferring a substrate and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201609642QA true SG11201609642QA (en) | 2016-12-29 |
Family
ID=53199963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201609642QA SG11201609642QA (en) | 2014-06-16 | 2015-05-12 | Lithographic apparatus, method of transferring a substrate and device manufacturing method |
Country Status (10)
Country | Link |
---|---|
US (2) | US10409174B2 (en) |
EP (1) | EP3155482B1 (en) |
JP (2) | JP6251825B2 (en) |
KR (1) | KR101941596B1 (en) |
CN (2) | CN110941151A (en) |
IL (1) | IL249047A0 (en) |
NL (1) | NL2014792A (en) |
SG (1) | SG11201609642QA (en) |
TW (2) | TWI585545B (en) |
WO (1) | WO2015193036A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105717754A (en) * | 2016-04-07 | 2016-06-29 | 上海华力微电子有限公司 | Developing apparatus and method for reducing water stain defects by using same |
JP6892727B2 (en) * | 2016-09-26 | 2021-06-23 | カンタツ株式会社 | Pattern manufacturing equipment, pattern manufacturing method and pattern manufacturing program |
EP3577525A1 (en) | 2017-02-03 | 2019-12-11 | ASML Netherlands B.V. | Exposure apparatus |
KR20200056515A (en) * | 2018-11-14 | 2020-05-25 | 삼성전자주식회사 | method for drying substrate, photoresist developing method and photolithography method using the same |
EP3764165A1 (en) | 2019-07-12 | 2021-01-13 | ASML Netherlands B.V. | Substrate shape measuring device |
US20220382168A1 (en) * | 2021-05-28 | 2022-12-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing semiconductor devices using a photomask |
Family Cites Families (43)
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US5874820A (en) | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
TW446858B (en) * | 1999-04-21 | 2001-07-21 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using such a lithographic projection apparatus, and device made by such a method of manufacturing |
JP2001308003A (en) | 2000-02-15 | 2001-11-02 | Nikon Corp | Exposure method and system, and method of device manufacturing |
JP2002305140A (en) | 2001-04-06 | 2002-10-18 | Nikon Corp | Aligner and substrate processing system |
US20030012631A1 (en) * | 2001-07-12 | 2003-01-16 | Pencis Christopher H. | High temperature substrate transfer robot |
EP2495613B1 (en) | 2002-11-12 | 2013-07-31 | ASML Netherlands B.V. | Lithographic apparatus |
JP3977324B2 (en) | 2002-11-12 | 2007-09-19 | エーエスエムエル ネザーランズ ビー.ブイ. | Lithographic apparatus |
US7384484B2 (en) * | 2002-11-18 | 2008-06-10 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing method, substrate processing apparatus and substrate processing system |
KR101037057B1 (en) | 2002-12-10 | 2011-05-26 | 가부시키가이샤 니콘 | Exposure apparatus and method for manufacturing device |
WO2004102646A1 (en) | 2003-05-15 | 2004-11-25 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
TWI616932B (en) | 2003-05-23 | 2018-03-01 | Nikon Corp | Exposure device and component manufacturing method |
US7070915B2 (en) * | 2003-08-29 | 2006-07-04 | Tokyo Electron Limited | Method and system for drying a substrate |
JP2005136364A (en) * | 2003-10-08 | 2005-05-26 | Zao Nikon Co Ltd | Substrate carrying device, exposure device and device manufacturing method |
KR20060126949A (en) | 2003-10-08 | 2006-12-11 | 가부시키가이샤 니콘 | Substrate transporting apparatus and method, exposure apparatus and method, and device producing method |
US7927429B2 (en) | 2003-11-18 | 2011-04-19 | Tokyo Electron Limited | Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium |
US7616383B2 (en) | 2004-05-18 | 2009-11-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7304715B2 (en) | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006080143A (en) * | 2004-09-07 | 2006-03-23 | Matsushita Electric Ind Co Ltd | Aligner and pattern formation method |
JP4324527B2 (en) | 2004-09-09 | 2009-09-02 | 東京エレクトロン株式会社 | Substrate cleaning method and developing apparatus |
WO2006038472A1 (en) * | 2004-10-06 | 2006-04-13 | Ebara Corporation | Substrate treatment apparatus and substrate treatment method |
JP2006310724A (en) | 2004-11-10 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | Substrate processing equipment and method |
US7446850B2 (en) * | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN100535757C (en) * | 2004-12-06 | 2009-09-02 | 株式会社迅动 | Substrate processing apparatus |
US8211242B2 (en) | 2005-02-07 | 2012-07-03 | Ebara Corporation | Substrate processing method, substrate processing apparatus, and control program |
JP2006222284A (en) * | 2005-02-10 | 2006-08-24 | Toshiba Corp | Pattern forming method and manufacturing method for semiconductor device |
JP2007027545A (en) | 2005-07-20 | 2007-02-01 | Canon Inc | Semiconductor exposure device |
JP2007109741A (en) | 2005-10-11 | 2007-04-26 | Canon Inc | Exposure device and exposure method |
JP4667252B2 (en) | 2006-01-16 | 2011-04-06 | 株式会社Sokudo | Substrate processing equipment |
JP4771816B2 (en) | 2006-01-27 | 2011-09-14 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP2007311439A (en) | 2006-05-17 | 2007-11-29 | Dainippon Screen Mfg Co Ltd | Method and apparatus for processing substrate |
JP4832201B2 (en) | 2006-07-24 | 2011-12-07 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
KR100940136B1 (en) | 2006-08-29 | 2010-02-03 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate processing method and substrate processing apparatus |
JP2008066341A (en) | 2006-09-04 | 2008-03-21 | Canon Inc | Carrying device, and exposure device and method |
US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
US20080212050A1 (en) * | 2007-02-06 | 2008-09-04 | Nikon Corporation | Apparatus and methods for removing immersion liquid from substrates using temperature gradient |
US7817241B2 (en) | 2007-07-05 | 2010-10-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP5192206B2 (en) | 2007-09-13 | 2013-05-08 | 株式会社Sokudo | Substrate processing apparatus and substrate processing method |
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KR101109074B1 (en) | 2009-01-30 | 2012-02-20 | 세메스 주식회사 | System and method for treating substrates |
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-
2015
- 2015-05-12 JP JP2016573870A patent/JP6251825B2/en active Active
- 2015-05-12 WO PCT/EP2015/060427 patent/WO2015193036A1/en active Application Filing
- 2015-05-12 US US15/317,386 patent/US10409174B2/en active Active
- 2015-05-12 NL NL2014792A patent/NL2014792A/en unknown
- 2015-05-12 SG SG11201609642QA patent/SG11201609642QA/en unknown
- 2015-05-12 KR KR1020177001213A patent/KR101941596B1/en active IP Right Grant
- 2015-05-12 EP EP15723888.2A patent/EP3155482B1/en active Active
- 2015-05-12 CN CN201911298755.3A patent/CN110941151A/en active Pending
- 2015-05-12 CN CN201580031670.2A patent/CN106507684B/en active Active
- 2015-06-09 TW TW104118650A patent/TWI585545B/en active
- 2015-06-09 TW TW106112185A patent/TWI647544B/en active
-
2016
- 2016-11-17 IL IL249047A patent/IL249047A0/en unknown
-
2017
- 2017-11-22 JP JP2017224512A patent/JP6634429B2/en active Active
-
2019
- 2019-09-09 US US16/564,969 patent/US10916453B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2015193036A1 (en) | 2015-12-23 |
TWI585545B (en) | 2017-06-01 |
JP2017524974A (en) | 2017-08-31 |
CN106507684A (en) | 2017-03-15 |
IL249047A0 (en) | 2017-01-31 |
US20170108781A1 (en) | 2017-04-20 |
TWI647544B (en) | 2019-01-11 |
TW201725453A (en) | 2017-07-16 |
JP6634429B2 (en) | 2020-01-22 |
CN106507684B (en) | 2020-01-10 |
EP3155482B1 (en) | 2018-07-04 |
KR101941596B1 (en) | 2019-01-23 |
EP3155482A1 (en) | 2017-04-19 |
NL2014792A (en) | 2016-03-31 |
US10916453B2 (en) | 2021-02-09 |
JP2018032047A (en) | 2018-03-01 |
TW201602736A (en) | 2016-01-16 |
KR20170016007A (en) | 2017-02-10 |
JP6251825B2 (en) | 2017-12-20 |
CN110941151A (en) | 2020-03-31 |
US10409174B2 (en) | 2019-09-10 |
US20190391499A1 (en) | 2019-12-26 |
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