SG11201607386RA - Substrate angle alignment device, substrate angle alignment method, and substrate transfer method - Google Patents
Substrate angle alignment device, substrate angle alignment method, and substrate transfer methodInfo
- Publication number
- SG11201607386RA SG11201607386RA SG11201607386RA SG11201607386RA SG11201607386RA SG 11201607386R A SG11201607386R A SG 11201607386RA SG 11201607386R A SG11201607386R A SG 11201607386RA SG 11201607386R A SG11201607386R A SG 11201607386RA SG 11201607386R A SG11201607386R A SG 11201607386RA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- angle alignment
- substrate angle
- transfer method
- alignment device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/001714 WO2015145480A1 (en) | 2014-03-25 | 2014-03-25 | Substrate angling device, substrate angling method, and substrate conveying method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201607386RA true SG11201607386RA (en) | 2016-10-28 |
Family
ID=54194090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201607386RA SG11201607386RA (en) | 2014-03-25 | 2014-03-25 | Substrate angle alignment device, substrate angle alignment method, and substrate transfer method |
Country Status (5)
Country | Link |
---|---|
US (1) | US9947566B2 (en) |
KR (1) | KR101883804B1 (en) |
CN (1) | CN106104788B (en) |
SG (1) | SG11201607386RA (en) |
WO (1) | WO2015145480A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6263017B2 (en) * | 2013-12-16 | 2018-01-17 | 川崎重工業株式会社 | Substrate alignment apparatus and method for controlling substrate alignment apparatus |
US10636693B2 (en) * | 2018-09-11 | 2020-04-28 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer device and control method therefor |
KR102675504B1 (en) * | 2019-04-05 | 2024-06-17 | 주식회사 디엠에스 | Substrate transferring apparatus |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06236910A (en) * | 1993-02-08 | 1994-08-23 | Tokyo Electron Yamanashi Kk | Inspection device |
JP3208562B2 (en) * | 1997-07-15 | 2001-09-17 | 東京エレクトロン株式会社 | Positioning device and positioning method |
JPH11129174A (en) * | 1997-10-29 | 1999-05-18 | Seiko Seiki Co Ltd | Conveying device for article |
US6309163B1 (en) * | 1997-10-30 | 2001-10-30 | Applied Materials, Inc. | Wafer positioning device with storage capability |
JP4255091B2 (en) | 1999-04-07 | 2009-04-15 | 株式会社日立国際電気 | Semiconductor manufacturing method |
US6393337B1 (en) * | 2000-01-13 | 2002-05-21 | Applied Materials, Inc. | Method and apparatus for orienting substrates |
JP2002100664A (en) * | 2000-09-25 | 2002-04-05 | Hitachi Kokusai Electric Inc | Wafer processing method and equipment |
JP2003209153A (en) | 2002-01-11 | 2003-07-25 | Hitachi Kokusai Electric Inc | Substrate treatment device and method for manufacturing semiconductor device |
JP4334817B2 (en) | 2002-05-15 | 2009-09-30 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
WO2006104121A1 (en) * | 2005-03-29 | 2006-10-05 | Hitachi Kokusai Electric Inc. | Semiconductor production apparatus |
JP4890067B2 (en) * | 2006-03-28 | 2012-03-07 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate transfer method |
JP5501688B2 (en) * | 2009-07-30 | 2014-05-28 | 東京エレクトロン株式会社 | Substrate alignment mechanism, vacuum prechamber and substrate processing system using the same |
JP6184102B2 (en) * | 2013-01-16 | 2017-08-23 | 株式会社Screenセミコンダクターソリューションズ | Alignment apparatus and substrate processing apparatus |
-
2014
- 2014-03-25 CN CN201480077355.9A patent/CN106104788B/en active Active
- 2014-03-25 WO PCT/JP2014/001714 patent/WO2015145480A1/en active Application Filing
- 2014-03-25 US US15/127,206 patent/US9947566B2/en active Active
- 2014-03-25 KR KR1020167027868A patent/KR101883804B1/en active IP Right Grant
- 2014-03-25 SG SG11201607386RA patent/SG11201607386RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20160132065A (en) | 2016-11-16 |
US20170103909A1 (en) | 2017-04-13 |
CN106104788B (en) | 2018-12-07 |
US9947566B2 (en) | 2018-04-17 |
WO2015145480A1 (en) | 2015-10-01 |
CN106104788A (en) | 2016-11-09 |
KR101883804B1 (en) | 2018-07-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL282376A (en) | Transfer device | |
EP3100966A4 (en) | Transfer device | |
ZA201605346B (en) | Antenna-orientation adjustment device and antenna orientation adjustment method. | |
EP3238369A4 (en) | Systems and methods for authentication using multiple devices | |
EP3097709A4 (en) | Authentication device and method | |
EP3204787A4 (en) | Device and method for orientation and positioning | |
EP3282475A4 (en) | Substrate holding method, substrate holding device, processing method and processing device | |
PT3347127T (en) | Transfer device | |
GB201405647D0 (en) | Transfer method and apparatus | |
EP3147125A4 (en) | Printing device and printing method | |
EP2988583A4 (en) | Substrate working device, substrate working method, and substrate working system | |
SG11201605542RA (en) | Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrate | |
SG11201702887UA (en) | Fluid transfer device, system and method | |
EP3101684A4 (en) | Substrate transfer system and method | |
EP3179446A4 (en) | Orientation estimation method, and orientation estimation device | |
EP3200011A4 (en) | Alignment device and aligning method | |
EP3115206A4 (en) | Printing device and printing method | |
EP3214863A4 (en) | Orientation method, device and system | |
EP3205457A4 (en) | Transfer method and transfer apparatus | |
EP3091481A4 (en) | Marking device and marking method | |
SG11201607386RA (en) | Substrate angle alignment device, substrate angle alignment method, and substrate transfer method | |
SG11201708159UA (en) | Data transfer method and device | |
EP3214517A4 (en) | Electronic device, system and method | |
SG11201710229SA (en) | Substrate processing device | |
SG11201710129RA (en) | Substrate processing device |