SG11201606867QA - Sensor system, substrate handling system and lithographic apparatus - Google Patents

Sensor system, substrate handling system and lithographic apparatus

Info

Publication number
SG11201606867QA
SG11201606867QA SG11201606867QA SG11201606867QA SG11201606867QA SG 11201606867Q A SG11201606867Q A SG 11201606867QA SG 11201606867Q A SG11201606867Q A SG 11201606867QA SG 11201606867Q A SG11201606867Q A SG 11201606867QA SG 11201606867Q A SG11201606867Q A SG 11201606867QA
Authority
SG
Singapore
Prior art keywords
lithographic apparatus
substrate handling
sensor system
handling system
sensor
Prior art date
Application number
SG11201606867QA
Other languages
English (en)
Inventor
Joeri Lof
Joost Kauffman
Martin Dieter Nico Peters
Petrus Theodorus Rutgers
Martijn Hendrikus Wilhelmus Stopel
Den Eijkel Gerard Van
Der Schoot Harmen Klaas Van
Raimond Visser
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG11201606867QA publication Critical patent/SG11201606867QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG11201606867QA 2014-03-12 2015-03-02 Sensor system, substrate handling system and lithographic apparatus SG11201606867QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14159143 2014-03-12
PCT/EP2015/054276 WO2015135782A1 (en) 2014-03-12 2015-03-02 Sensor system, substrate handling system and lithographic apparatus

Publications (1)

Publication Number Publication Date
SG11201606867QA true SG11201606867QA (en) 2016-09-29

Family

ID=50241232

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606867QA SG11201606867QA (en) 2014-03-12 2015-03-02 Sensor system, substrate handling system and lithographic apparatus

Country Status (10)

Country Link
US (1) US10007197B2 (ja)
EP (1) EP3117270B1 (ja)
JP (1) JP6347849B2 (ja)
KR (1) KR101885751B1 (ja)
CN (1) CN106104382B (ja)
IL (1) IL247316B (ja)
NL (1) NL2014374A (ja)
SG (1) SG11201606867QA (ja)
TW (1) TWI654493B (ja)
WO (1) WO2015135782A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9841299B2 (en) * 2014-11-28 2017-12-12 Canon Kabushiki Kaisha Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
KR101682468B1 (ko) * 2015-11-13 2016-12-05 주식회사 이오테크닉스 웨이퍼 정렬방법 및 이를 이용한 정렬장비
US10527957B2 (en) 2015-11-30 2020-01-07 Asml Netherlands B.V. Method and apparatus for processing a substrate in a lithographic apparatus
CN108010875B (zh) * 2016-10-31 2020-04-14 中芯国际集成电路制造(上海)有限公司 基板校准装置以及检测系统
CN111727353A (zh) * 2018-02-27 2020-09-29 Ev 集团 E·索尔纳有限责任公司 标记区、用于确定位置的方法和装置
WO2019176749A1 (ja) * 2018-03-15 2019-09-19 パイオニア株式会社 走査装置及び測定装置
CN110231756A (zh) * 2018-08-10 2019-09-13 上海微电子装备（集团）股份有限公司 曝光装置、曝光方法、半导体器件及其制造方法
WO2020038629A1 (en) * 2018-08-20 2020-02-27 Asml Netherlands B.V. Apparatus and method for measuring a position of alignment marks
JP7446131B2 (ja) * 2020-03-12 2024-03-08 キヤノン株式会社 検出装置、露光装置および物品製造方法
JP2022011045A (ja) 2020-06-29 2022-01-17 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法

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US4376581A (en) * 1979-12-20 1983-03-15 Censor Patent- Und Versuchs-Anstalt Method of positioning disk-shaped workpieces, preferably semiconductor wafers
CA2044649A1 (en) 1990-06-19 1991-12-20 Masanori Nishiguchi Method and apparatus for packaging a semiconductor device
US5737441A (en) * 1991-12-12 1998-04-07 Nikon Corporation Aligning method and apparatus
US5648854A (en) 1995-04-19 1997-07-15 Nikon Corporation Alignment system with large area search for wafer edge and global marks
US5644400A (en) * 1996-03-29 1997-07-01 Lam Research Corporation Method and apparatus for determining the center and orientation of a wafer-like object
JPH10144748A (ja) 1996-11-12 1998-05-29 Shimadzu Corp ウェハステージ
US6162008A (en) 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
JP2002184665A (ja) * 2000-12-13 2002-06-28 Nikon Corp アライメント装置及びアライメント方法、露光装置
IL160164A0 (en) * 2001-08-09 2004-07-25 Integrated Dynamics Engineering Edge gripping pre-aligner
WO2003098668A2 (en) * 2002-05-16 2003-11-27 Asyst Technologies, Inc. Pre-aligner
JP4258828B2 (ja) 2002-06-06 2009-04-30 株式会社安川電機 ウエハプリアライメント装置および方法
US7307695B2 (en) * 2003-10-10 2007-12-11 Asml Netherlands B.V. Method and device for alignment of a substrate
WO2006025386A1 (ja) * 2004-08-31 2006-03-09 Nikon Corporation 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置
WO2007027960A2 (en) 2005-08-30 2007-03-08 Photon Dynamics, Inc. Substrate alignment using linear array sensor
KR20070064950A (ko) 2005-12-19 2007-06-22 삼성전자주식회사 보호커버를 갖는 웨이퍼 플랫 존 얼라인 센서부
JP2008039413A (ja) 2006-08-01 2008-02-21 Honda Electronic Co Ltd 基板検出装置
DE102007049100B4 (de) * 2007-10-11 2009-07-16 Vistec Semiconductor Systems Gmbh Verfahren zur Bestimmung der Centrality von Masken
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Also Published As

Publication number Publication date
KR20160120771A (ko) 2016-10-18
IL247316A0 (en) 2016-09-29
NL2014374A (en) 2015-11-02
US10007197B2 (en) 2018-06-26
EP3117270B1 (en) 2018-07-18
WO2015135782A1 (en) 2015-09-17
US20160370716A1 (en) 2016-12-22
EP3117270A1 (en) 2017-01-18
JP2017511499A (ja) 2017-04-20
TW201535071A (zh) 2015-09-16
TWI654493B (zh) 2019-03-21
CN106104382A (zh) 2016-11-09
JP6347849B2 (ja) 2018-06-27
CN106104382B (zh) 2018-06-26
IL247316B (en) 2021-04-29
KR101885751B1 (ko) 2018-08-06

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