SG11201604948WA - Soldering paste comprising adipic acid, oxalic acid and an amine component - Google Patents

Soldering paste comprising adipic acid, oxalic acid and an amine component

Info

Publication number
SG11201604948WA
SG11201604948WA SG11201604948WA SG11201604948WA SG11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA
Authority
SG
Singapore
Prior art keywords
amine component
soldering paste
acid
oxalic acid
adipic acid
Prior art date
Application number
SG11201604948WA
Other languages
English (en)
Inventor
Jens Nachreiner
Joachim Wiese
Sebastian Fritzsche
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of SG11201604948WA publication Critical patent/SG11201604948WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
SG11201604948WA 2013-12-17 2014-12-12 Soldering paste comprising adipic acid, oxalic acid and an amine component SG11201604948WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP13197694.6A EP2886245B1 (de) 2013-12-17 2013-12-17 Lotpaste mit adipinsäure, oxalsäure und aminkomponente
PCT/EP2014/077586 WO2015091272A1 (de) 2013-12-17 2014-12-12 Lotpaste mit adipinsäure, oxalsäure und aminkomponente

Publications (1)

Publication Number Publication Date
SG11201604948WA true SG11201604948WA (en) 2016-07-28

Family

ID=49841529

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201604948WA SG11201604948WA (en) 2013-12-17 2014-12-12 Soldering paste comprising adipic acid, oxalic acid and an amine component

Country Status (10)

Country Link
US (1) US10434610B2 (de)
EP (1) EP2886245B1 (de)
JP (1) JP6296370B2 (de)
KR (1) KR20160101066A (de)
CN (1) CN105813797B (de)
HU (1) HUE045153T2 (de)
MX (1) MX2016007525A (de)
PL (1) PL2886245T3 (de)
SG (1) SG11201604948WA (de)
WO (1) WO2015091272A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338007B1 (ja) * 2017-11-02 2018-06-06 千住金属工業株式会社 フラックス及びソルダペースト
MX2021004334A (es) * 2018-10-24 2021-06-23 Alpha Assembly Solutions Inc Soluciones de soldadura de baja temperatura para sustratos de polimeros, placas de circuito impreso y otras aplicaciones de union.
EP3834980B1 (de) * 2019-12-10 2023-02-22 Heraeus Deutschland GmbH & Co. KG Lotpaste
DE102021110298A1 (de) * 2021-04-22 2022-10-27 Infineon Technologies Ag Bleifreies lotmaterial, schichtstruktur, verfahren zur herstellung eines lotmaterials und verfahren zur herstellung einer schichtstruktur
WO2024011492A1 (en) * 2022-07-14 2024-01-18 Heraeus Materials Technology Shanghai Ltd. Solder paste

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
CA2011030C (en) * 1989-03-20 1994-10-18 Nikhiles Bandyopadhyay Process for reflow soldering
AU5919890A (en) * 1989-08-14 1991-02-14 Multicore Solders Limited Manufacture of printed circuit board assemblies
US5127968A (en) * 1989-08-16 1992-07-07 Yuho Chemicals Inc. Additive for fluxes and soldering pastes
DE4119012C1 (en) 1991-06-08 1992-12-17 Demetron Gmbh, 6450 Hanau, De Soft solder paste which is rinsable with water - contg. soft solder powder binder flux mixt. contg. soluble salts of fatty amine(s) with organic acids, activators, surfactants(s) and solvents
JP3273961B2 (ja) * 1991-12-18 2002-04-15 トヨタ自動車株式会社 クリームはんだ
DE4235575C2 (de) 1992-10-22 1994-11-10 Degussa Weichlotpaste zum Löten von elektronischen Schaltungen
JPH06269988A (ja) * 1993-03-19 1994-09-27 Asahi Glass Co Ltd 半田ペースト組成物
JP3449778B2 (ja) * 1993-04-05 2003-09-22 株式会社日本スペリア社 はんだ付け用フラックス
EP0619162A3 (de) 1993-04-05 1995-12-27 Takeda Chemical Industries Ltd Weichlotflüssmittel.
US5417771A (en) * 1994-02-16 1995-05-23 Takeda Chemical Industries, Ltd. Soldering flux
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
DE102008031004A1 (de) 2008-06-30 2009-12-31 Conti Temic Microelectronic Gmbh Lotmaterial, enthaltend ein Metallstearat sowie Verwendung von Metallstearaten in Lotmaterialien
DE102009039355A1 (de) * 2009-08-29 2011-03-24 Umicore Ag & Co. Kg Lotlegierung
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering

Also Published As

Publication number Publication date
HUE045153T2 (hu) 2019-12-30
JP2017507026A (ja) 2017-03-16
JP6296370B2 (ja) 2018-03-20
PL2886245T3 (pl) 2019-12-31
EP2886245B1 (de) 2019-06-12
MX2016007525A (es) 2016-10-03
CN105813797A (zh) 2016-07-27
WO2015091272A1 (de) 2015-06-25
US10434610B2 (en) 2019-10-08
US20160311067A1 (en) 2016-10-27
KR20160101066A (ko) 2016-08-24
CN105813797B (zh) 2018-03-30
EP2886245A1 (de) 2015-06-24

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