SG11201604948WA - Soldering paste comprising adipic acid, oxalic acid and an amine component - Google Patents
Soldering paste comprising adipic acid, oxalic acid and an amine componentInfo
- Publication number
- SG11201604948WA SG11201604948WA SG11201604948WA SG11201604948WA SG11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA SG 11201604948W A SG11201604948W A SG 11201604948WA
- Authority
- SG
- Singapore
- Prior art keywords
- amine component
- soldering paste
- acid
- oxalic acid
- adipic acid
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13197694.6A EP2886245B1 (en) | 2013-12-17 | 2013-12-17 | Soldering paste with adipic acid, oxalic acid and amine components |
| PCT/EP2014/077586 WO2015091272A1 (en) | 2013-12-17 | 2014-12-12 | Soldering paste comprising adipic acid, oxalic acid and an amine component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201604948WA true SG11201604948WA (en) | 2016-07-28 |
Family
ID=49841529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201604948WA SG11201604948WA (en) | 2013-12-17 | 2014-12-12 | Soldering paste comprising adipic acid, oxalic acid and an amine component |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10434610B2 (en) |
| EP (1) | EP2886245B1 (en) |
| JP (1) | JP6296370B2 (en) |
| KR (1) | KR20160101066A (en) |
| CN (1) | CN105813797B (en) |
| HU (1) | HUE045153T2 (en) |
| MX (1) | MX2016007525A (en) |
| PL (1) | PL2886245T3 (en) |
| SG (1) | SG11201604948WA (en) |
| WO (1) | WO2015091272A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6338007B1 (en) * | 2017-11-02 | 2018-06-06 | 千住金属工業株式会社 | Flux and solder paste |
| KR20240042569A (en) * | 2018-10-24 | 2024-04-02 | 알파 어셈블리 솔루션스 인크. | Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications |
| EP3834980B1 (en) * | 2019-12-10 | 2023-02-22 | Heraeus Deutschland GmbH & Co. KG | Solder paste |
| DE102021110298A1 (en) * | 2021-04-22 | 2022-10-27 | Infineon Technologies Ag | LEAD-FREE SOLDER, LAYER STRUCTURE, METHOD OF MAKING A SOLDER, AND METHOD OF MAKING A LAYER STRUCTURE |
| WO2024011492A1 (en) * | 2022-07-14 | 2024-01-18 | Heraeus Materials Technology Shanghai Ltd. | Solder paste |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
| CA2011030C (en) * | 1989-03-20 | 1994-10-18 | Nikhiles Bandyopadhyay | Process for reflow soldering |
| AU5919890A (en) * | 1989-08-14 | 1991-02-14 | Multicore Solders Limited | Manufacture of printed circuit board assemblies |
| US5127968A (en) * | 1989-08-16 | 1992-07-07 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| DE4119012C1 (en) | 1991-06-08 | 1992-12-17 | Demetron Gmbh, 6450 Hanau, De | Soft solder paste which is rinsable with water - contg. soft solder powder binder flux mixt. contg. soluble salts of fatty amine(s) with organic acids, activators, surfactants(s) and solvents |
| JP3273961B2 (en) * | 1991-12-18 | 2002-04-15 | トヨタ自動車株式会社 | Cream solder |
| DE4235575C2 (en) | 1992-10-22 | 1994-11-10 | Degussa | Soft solder paste for soldering electronic circuits |
| JPH06269988A (en) * | 1993-03-19 | 1994-09-27 | Asahi Glass Co Ltd | Solder paste composition |
| EP0619162A3 (en) | 1993-04-05 | 1995-12-27 | Takeda Chemical Industries Ltd | Soldering flux. |
| JP3449778B2 (en) * | 1993-04-05 | 2003-09-22 | 株式会社日本スペリア社 | Flux for soldering |
| US5417771A (en) * | 1994-02-16 | 1995-05-23 | Takeda Chemical Industries, Ltd. | Soldering flux |
| DE102005053553A1 (en) | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Solder pastes with resin-free flux |
| US7767032B2 (en) * | 2006-06-30 | 2010-08-03 | W.C. Heraeus Holding GmbH | No-clean low-residue solder paste for semiconductor device applications |
| DE102008031004A1 (en) | 2008-06-30 | 2009-12-31 | Conti Temic Microelectronic Gmbh | Solder material containing a metal stearate and use of metal stearates in solder materials |
| DE102009039355A1 (en) * | 2009-08-29 | 2011-03-24 | Umicore Ag & Co. Kg | solder alloy |
| US8434667B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
-
2013
- 2013-12-17 PL PL13197694T patent/PL2886245T3/en unknown
- 2013-12-17 EP EP13197694.6A patent/EP2886245B1/en active Active
- 2013-12-17 HU HUE13197694A patent/HUE045153T2/en unknown
-
2014
- 2014-12-12 JP JP2016539223A patent/JP6296370B2/en not_active Expired - Fee Related
- 2014-12-12 MX MX2016007525A patent/MX2016007525A/en unknown
- 2014-12-12 US US15/105,169 patent/US10434610B2/en active Active
- 2014-12-12 SG SG11201604948WA patent/SG11201604948WA/en unknown
- 2014-12-12 KR KR1020167019218A patent/KR20160101066A/en active IP Right Grant
- 2014-12-12 CN CN201480069066.4A patent/CN105813797B/en active Active
- 2014-12-12 WO PCT/EP2014/077586 patent/WO2015091272A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP6296370B2 (en) | 2018-03-20 |
| CN105813797B (en) | 2018-03-30 |
| MX2016007525A (en) | 2016-10-03 |
| PL2886245T3 (en) | 2019-12-31 |
| EP2886245B1 (en) | 2019-06-12 |
| US10434610B2 (en) | 2019-10-08 |
| US20160311067A1 (en) | 2016-10-27 |
| EP2886245A1 (en) | 2015-06-24 |
| KR20160101066A (en) | 2016-08-24 |
| CN105813797A (en) | 2016-07-27 |
| HUE045153T2 (en) | 2019-12-30 |
| JP2017507026A (en) | 2017-03-16 |
| WO2015091272A1 (en) | 2015-06-25 |
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