SG11201604739RA - Method and apparatus for design of a metrology target - Google Patents

Method and apparatus for design of a metrology target

Info

Publication number
SG11201604739RA
SG11201604739RA SG11201604739RA SG11201604739RA SG11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA
Authority
SG
Singapore
Prior art keywords
design
metrology target
metrology
target
Prior art date
Application number
SG11201604739RA
Other languages
English (en)
Inventor
Guangqing Chen
Justin Ghan
David Harold Whysong
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG11201604739RA publication Critical patent/SG11201604739RA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11201604739RA 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target SG11201604739RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361921907P 2013-12-30 2013-12-30
PCT/EP2014/076543 WO2015101459A1 (en) 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target

Publications (1)

Publication Number Publication Date
SG11201604739RA true SG11201604739RA (en) 2016-07-28

Family

ID=52016067

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201604739RA SG11201604739RA (en) 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target

Country Status (7)

Country Link
US (1) US10296692B2 (zh)
JP (1) JP6291581B2 (zh)
KR (1) KR101860042B1 (zh)
CN (1) CN105874389B (zh)
SG (1) SG11201604739RA (zh)
TW (1) TWI567507B (zh)
WO (1) WO2015101459A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10354886B2 (en) * 2013-02-22 2019-07-16 Synopsys, Inc. Hybrid evolutionary algorithm for triple-patterning
WO2015189026A2 (en) 2014-06-10 2015-12-17 Asml Netherlands B.V. Computational wafer inspection
CN107077077B (zh) 2014-09-22 2019-03-12 Asml荷兰有限公司 过程窗口识别符
WO2016078861A1 (en) 2014-11-17 2016-05-26 Asml Netherlands B.V. Process based metrology target design
US10216096B2 (en) 2015-08-14 2019-02-26 Kla-Tencor Corporation Process-sensitive metrology systems and methods
CN108027571B (zh) * 2015-08-27 2020-06-23 Asml荷兰有限公司 光刻设备和器件制造方法
NL2017505A (en) * 2015-10-09 2017-04-11 Asml Netherlands Bv Method and apparatus for inspection and metrology
WO2017108453A1 (en) 2015-12-24 2017-06-29 Asml Netherlands B.V. Methods of controlling a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus
KR102169436B1 (ko) * 2016-03-07 2020-10-26 에이에스엠엘 네델란즈 비.브이. 조명 시스템 및 계측 시스템
WO2017178285A1 (en) * 2016-04-15 2017-10-19 Asml Netherlands B.V. Method for adjusting actuation of a lithographic apparatus
CN113552779A (zh) 2016-07-15 2021-10-26 Asml荷兰有限公司 用于量测目标场的设计的方法和设备
EP3358413A1 (en) 2017-02-02 2018-08-08 ASML Netherlands B.V. Metrology method, apparatus and computer program
TWI750155B (zh) * 2017-03-03 2021-12-21 聯華電子股份有限公司 自動產出設計規範驗證(drc)的系統與其方法

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629772A (en) * 1994-12-20 1997-05-13 International Business Machines Corporation Monitoring of minimum features on a substrate
US7541201B2 (en) * 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US6965895B2 (en) * 2001-07-16 2005-11-15 Applied Materials, Inc. Method and apparatus for analyzing manufacturing data
DE10143723B4 (de) 2001-08-31 2006-09-28 Infineon Technologies Ag Verfahren zur Optimierung eines Layouts für eine Maske zur Verwendung bei der Halbleiterherstellung
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
JP4352458B2 (ja) 2002-03-01 2009-10-28 株式会社ニコン 投影光学系の調整方法、予測方法、評価方法、調整方法、露光方法及び露光装置、露光装置の製造方法、プログラム並びにデバイス製造方法
US6721691B2 (en) 2002-03-26 2004-04-13 Timbre Technologies, Inc. Metrology hardware specification using a hardware simulator
JP4080813B2 (ja) * 2002-08-09 2008-04-23 株式会社東芝 マーク設計システム、マーク設計方法、マーク設計プログラムおよびこのマーク設計方法を用いた半導体装置の製造方法
US7020535B1 (en) * 2003-11-06 2006-03-28 Advanced Micro Devices, Inc. Method and apparatus for providing excitation for a process controller
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
DE102005009071B4 (de) 2005-02-28 2008-06-26 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Prozesssteuerung
US7704605B2 (en) 2006-03-28 2010-04-27 Eastman Chemical Company Thermoplastic articles comprising cyclobutanediol having a decorative material embedded therein
US7587704B2 (en) 2005-09-09 2009-09-08 Brion Technologies, Inc. System and method for mask verification using an individual mask error model
US7925486B2 (en) * 2006-03-14 2011-04-12 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
US7415319B2 (en) 2006-04-04 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100456142C (zh) * 2006-10-18 2009-01-28 上海微电子装备有限公司 一种对准标记及其制造方法
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
CN1963679A (zh) * 2006-11-24 2007-05-16 上海微电子装备有限公司 用于晶片对准的对准标记结构
US8175831B2 (en) * 2007-04-23 2012-05-08 Kla-Tencor Corp. Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
US7873504B1 (en) * 2007-05-07 2011-01-18 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
JP2008306030A (ja) * 2007-06-08 2008-12-18 Canon Inc マーク設計装置および位置検出装置
NL1036734A1 (nl) 2008-04-09 2009-10-12 Asml Netherlands Bv A method of assessing a model, an inspection apparatus and a lithographic apparatus.
NL1036750A1 (nl) 2008-04-14 2009-10-15 Brion Tech Inc A Method Of Performing Mask-Writer Tuning and Optimization.
JP4843649B2 (ja) * 2008-08-07 2011-12-21 株式会社東芝 評価パターン作成方法、評価パターン作成プログラムおよびパターン検証方法
NL2003702A (en) 2008-11-10 2010-05-11 Brion Tech Inc Pattern selection for lithographic model calibration.
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
US8180471B2 (en) * 2009-05-27 2012-05-15 Globalfoundries Inc. Tuning a process controller based on a dynamic sampling rate
WO2011011511A1 (en) * 2009-07-22 2011-01-27 Kla-Tencor Corporation Angle-resolved antisymmetric scatterometry
TWI417942B (zh) 2009-12-17 2013-12-01 Ind Tech Res Inst 二維陣列疊對圖樣組之設計方法、疊對誤差量測方法及其量測系統
NL2006700A (en) 2010-06-04 2011-12-06 Asml Netherlands Bv Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods & apparatus.
NL2008957A (en) 2011-07-08 2013-01-09 Asml Netherlands Bv Methods and systems for pattern design with tailored response to wavefront aberration.
US8468471B2 (en) 2011-09-23 2013-06-18 Kla-Tencor Corp. Process aware metrology
NL2009723A (en) 2011-11-30 2013-06-03 Asml Netherlands Bv Inspection method and apparatus, and corresponding lithographic apparatus.
US10354929B2 (en) 2012-05-08 2019-07-16 Kla-Tencor Corporation Measurement recipe optimization based on spectral sensitivity and process variation
NL2010717A (en) 2012-05-21 2013-11-25 Asml Netherlands Bv Determining a structural parameter and correcting an asymmetry property.
US8612898B1 (en) * 2012-08-14 2013-12-17 Globalfoundries Inc. Identification of illegal devices using contact mapping
US9910953B2 (en) 2013-03-04 2018-03-06 Kla-Tencor Corporation Metrology target identification, design and verification
US9857291B2 (en) * 2013-05-16 2018-01-02 Kla-Tencor Corporation Metrology system calibration refinement
US10895810B2 (en) * 2013-11-15 2021-01-19 Kla Corporation Automatic selection of sample values for optical metrology

Also Published As

Publication number Publication date
KR20160103133A (ko) 2016-08-31
JP2017502339A (ja) 2017-01-19
CN105874389A (zh) 2016-08-17
WO2015101459A1 (en) 2015-07-09
US10296692B2 (en) 2019-05-21
CN105874389B (zh) 2018-06-26
TWI567507B (zh) 2017-01-21
US20150186582A1 (en) 2015-07-02
JP6291581B2 (ja) 2018-03-14
KR101860042B1 (ko) 2018-05-21
TW201531812A (zh) 2015-08-16

Similar Documents

Publication Publication Date Title
TWI561938B (en) Method and apparatus for design of a metrology target
SG11201604739RA (en) Method and apparatus for design of a metrology target
HK1215475A1 (zh) 用於三維製造的方法和設備
IL263765A (en) A method and device for designing a target field for metrology
PL3038799T3 (pl) Sposób i system do oceny co najmniej jednej właściwości manipulatora
GB201316102D0 (en) A method and apparatus
GB201311097D0 (en) A method and apparatus for dilution of aerosols
EP2971926A4 (en) METHOD AND APPARATUS FOR INTERIOR PIPE COATING
PT3005298T (pt) Método de reconstrução de um objeto a partir de visualizações de projeção
GB201317195D0 (en) Method of manufacturing a pattern and apparatus therefor
GB2518948B (en) Method and apparatus for tracking an object
EP2967287A4 (en) ENDOSCOPE APPARATUS AND METHODS OF USE THEREOF
GB2537430B (en) Method and apparatus for operating a camera
GB201412190D0 (en) Method of optimization for an application
PL2789061T3 (pl) Urządzenie laserowe i sposób obróbki laserowej materiału docelowego
EP2986385A4 (en) METHOD FOR PRODUCING A DROP GENERATION DEVICE
IL240012A0 (en) Device and methods for defining plasma
GB2515121B (en) A method and apparatus for a strike on a target
GB201305695D0 (en) A method of forming an article
GB2531929B (en) Method and apparatus for coating a screen
PL2879356T3 (pl) Sposób i urządzenie do wizualizacji zakresów protokołu dynamicznej konfiguracji hosta
GB201312916D0 (en) Apparatus and method for moving an object
SG2013062120A (en) A system and method for inspection
GB201305608D0 (en) Method and apparatus for distance measurement
GB2517616B (en) A method and a device for surface determination by means of microwaves