SG11201602499TA - Precision batch production method for manufacturing ferrite rods - Google Patents
Precision batch production method for manufacturing ferrite rodsInfo
- Publication number
- SG11201602499TA SG11201602499TA SG11201602499TA SG11201602499TA SG11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA
- Authority
- SG
- Singapore
- Prior art keywords
- production method
- batch production
- ferrite rods
- manufacturing ferrite
- precision batch
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/19—Phase-shifters using a ferromagnetic device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Chemically Coating (AREA)
- Coating By Spraying Or Casting (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13187538 | 2013-10-07 | ||
| PCT/EP2014/071079 WO2015052059A1 (fr) | 2013-10-07 | 2014-10-01 | Procédé de production de lot de précision pour fabriquer des tiges de ferrite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201602499TA true SG11201602499TA (en) | 2016-04-28 |
Family
ID=49303841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201602499TA SG11201602499TA (en) | 2013-10-07 | 2014-10-01 | Precision batch production method for manufacturing ferrite rods |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9825347B2 (fr) |
| EP (1) | EP3055871A1 (fr) |
| JP (1) | JP6293875B2 (fr) |
| KR (1) | KR20160067940A (fr) |
| CN (1) | CN105814655B (fr) |
| SG (1) | SG11201602499TA (fr) |
| WO (1) | WO2015052059A1 (fr) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6574207B2 (ja) | 2014-05-05 | 2019-09-11 | スリーディー グラス ソリューションズ，インク３Ｄ Ｇｌａｓｓ Ｓｏｌｕｔｉｏｎｓ，Ｉｎｃ | 光活性基板を製造する、２ｄ及び３ｄインダクタ、アンテナ、並びにトランス |
| KR20180134868A (ko) | 2016-02-25 | 2018-12-19 | 3디 글래스 솔루션즈 인코포레이티드 | 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재 |
| WO2017177171A1 (fr) | 2016-04-08 | 2017-10-12 | 3D Glass Solutions, Inc. | Procédés de fabrication de substrats photosensibles appropriés pour un coupleur optique |
| CN108886191A (zh) * | 2016-04-18 | 2018-11-23 | 伊根图有限公司 | 宽频带射频环形器 |
| KR102420212B1 (ko) * | 2017-04-28 | 2022-07-13 | 3디 글래스 솔루션즈 인코포레이티드 | Ｒｆ 서큘레이터 |
| AU2018297035B2 (en) | 2017-07-07 | 2021-02-25 | 3D Glass Solutions, Inc. | 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates |
| CA3084818C (fr) | 2017-12-15 | 2023-01-17 | 3D Glass Solutions, Inc. | Filtre rf resonnant de ligne de transmission couplee |
| WO2019136024A1 (fr) | 2018-01-04 | 2019-07-11 | 3D Glass Solutions, Inc. | Structure conductrice d'adaptation d'impédance pour circuits rf à haute efficacité |
| KR102145746B1 (ko) | 2018-04-10 | 2020-08-19 | 3디 글래스 솔루션즈 인코포레이티드 | Rf 집적형 전력 조절 커패시터 |
| KR102475010B1 (ko) | 2018-05-29 | 2022-12-07 | 3디 글래스 솔루션즈 인코포레이티드 | 저 삽입 손실 rf 전송 라인 |
| EP3853944B1 (fr) | 2018-09-17 | 2023-08-02 | 3D Glass Solutions, Inc. | Antenne à fentes compacte à haut rendement à retour de masse |
| KR102577948B1 (ko) | 2018-11-14 | 2023-09-14 | 옵티시스 인코포레이티드 | 불규칙 육각형 단면을 가지는 중공의 금속 도파관 및 이를 제조하는 방법 |
| US11996600B2 (en) | 2018-11-14 | 2024-05-28 | Optisys, Inc. | Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles |
| US11233304B2 (en) | 2018-11-19 | 2022-01-25 | Optisys, LLC | Irregular hexagon cross-sectioned hollow metal waveguide filters |
| AU2019416327B2 (en) | 2018-12-28 | 2021-12-09 | 3D Glass Solutions, Inc. | Annular capacitor RF, microwave and MM wave systems |
| KR102642603B1 (ko) | 2018-12-28 | 2024-03-05 | 3디 글래스 솔루션즈 인코포레이티드 | 광활성 유리 기판들에서 ｒｆ, 마이크로파, 및 ｍｍ 파 시스템들을 위한 이종 통합 |
| US11962057B2 (en) | 2019-04-05 | 2024-04-16 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
| EP3948954B1 (fr) | 2019-04-18 | 2023-06-14 | 3D Glass Solutions, Inc. | Libération et découpage à l'emporte-pièce à haut rendement |
| US10727216B1 (en) | 2019-05-10 | 2020-07-28 | Sandisk Technologies Llc | Method for removing a bulk substrate from a bonded assembly of wafers |
| CN110202880B (zh) * | 2019-06-03 | 2020-05-22 | 西安交通大学 | 一种柔性微波器件及其制备方法 |
| CA3177603C (fr) | 2020-04-17 | 2024-01-09 | 3D Glass Solutions, Inc. | Induction de large bande |
| US11501905B2 (en) * | 2020-08-31 | 2022-11-15 | Boston Applied Technologies, Inc. | Composition and method of making a monolithic heterostructure of multiferroic thin films |
| CN112103602B (zh) * | 2020-11-05 | 2021-03-16 | 中国电子科技集团公司第九研究所 | 一种宽带高频法拉第隔离器 |
| CN112909458B (zh) * | 2021-02-08 | 2021-09-10 | 湖南国科雷电子科技有限公司 | 一种w波段e面波导滤波器 |
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| JPS5238163A (en) * | 1975-09-20 | 1977-03-24 | Omron Tateisi Electronics Co | Passive element |
| JPS5246787A (en) * | 1975-10-11 | 1977-04-13 | Hitachi Ltd | Coil for integrated circuit and process for production of same |
| JPH02166801A (ja) * | 1988-12-20 | 1990-06-27 | Mitsubishi Electric Corp | ファラデー旋回子用フェライト |
| JPH02188001A (ja) * | 1989-01-17 | 1990-07-24 | Uniden Corp | 円偏波対直線偏波変換器 |
| JPH06164222A (ja) | 1992-11-25 | 1994-06-10 | Murata Mfg Co Ltd | マイクロ波用磁性体及びその製造方法 |
| US5772820A (en) | 1995-08-07 | 1998-06-30 | Northrop Grumman Corporation | Process for fabricating a microwave power device |
| US5828271A (en) | 1997-03-06 | 1998-10-27 | Northrop Grumman Corporation | Planar ferrite toroid microwave phase shifter |
| US5876539A (en) | 1997-06-17 | 1999-03-02 | Northrop Grumman Corporaiton | Fabrication of ferrite toroids |
| US6060433A (en) | 1998-01-26 | 2000-05-09 | Nz Applied Technologies Corporation | Method of making a microwave device having a polycrystalline ferrite substrate |
| US6171886B1 (en) * | 1998-06-30 | 2001-01-09 | Eastman Kodak Company | Method of making integrated hybrid silicon-based micro-actuator devices |
| US6249039B1 (en) * | 1998-09-10 | 2001-06-19 | Bourns, Inc. | Integrated inductive components and method of fabricating such components |
| US6498549B1 (en) | 1998-12-07 | 2002-12-24 | Corning Applied Technologies Corporation | Dual-tuning microwave devices using ferroelectric/ferrite layers |
| US6600601B1 (en) | 1999-04-12 | 2003-07-29 | Shin-Etsu Chemical Co., Ltd. | Polarization-independent optical isolator and production method thereof |
| US6645677B1 (en) | 2000-09-18 | 2003-11-11 | Micronic Laser Systems Ab | Dual layer reticle blank and manufacturing process |
| US6673181B1 (en) * | 2001-10-29 | 2004-01-06 | Northrop Grumman Corporation | Method of manufacturing ferromagnetic toroids used in ferrite phase shifters |
| JP2003264405A (ja) | 2002-03-08 | 2003-09-19 | Opnext Japan Inc | 高周波伝送線路およびそれを用いた電子部品並びに電子装置 |
| US6952042B2 (en) | 2002-06-17 | 2005-10-04 | Honeywell International, Inc. | Microelectromechanical device with integrated conductive shield |
| US7078983B2 (en) | 2004-06-09 | 2006-07-18 | Raytheon Company | Low-profile circulator |
| JP2005244084A (ja) * | 2004-02-27 | 2005-09-08 | Mitsubishi Electric Corp | らせん状高周波コイルとその製造方法 |
| EP1746430A1 (fr) * | 2005-07-22 | 2007-01-24 | Liaisons Electroniques-Mecaniques Lem S.A. | Sonde pour champ magnetique orthogonale ayant un inducteur à noyau saturable |
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| US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
| JP5815353B2 (ja) * | 2011-09-28 | 2015-11-17 | 株式会社フジクラ | コイル配線素子およびコイル配線素子の製造方法 |
| US9293245B2 (en) * | 2013-08-05 | 2016-03-22 | Qualcomm Mems Technologies, Inc. | Integration of a coil and a discontinuous magnetic core |
| CN111789538B (zh) * | 2020-07-07 | 2022-01-07 | 追觅创新科技(苏州)有限公司 | 清洁机构的脏污程度确定方法、装置及存储介质 |
-
2014
- 2014-10-01 SG SG11201602499TA patent/SG11201602499TA/en unknown
- 2014-10-01 EP EP14780474.4A patent/EP3055871A1/fr not_active Withdrawn
- 2014-10-01 US US15/027,286 patent/US9825347B2/en not_active Expired - Fee Related
- 2014-10-01 KR KR1020167011943A patent/KR20160067940A/ko not_active Application Discontinuation
- 2014-10-01 JP JP2016517478A patent/JP6293875B2/ja not_active Expired - Fee Related
- 2014-10-01 CN CN201480066647.2A patent/CN105814655B/zh not_active Expired - Fee Related
- 2014-10-01 WO PCT/EP2014/071079 patent/WO2015052059A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP6293875B2 (ja) | 2018-04-25 |
| CN105814655B (zh) | 2018-08-07 |
| KR20160067940A (ko) | 2016-06-14 |
| US9825347B2 (en) | 2017-11-21 |
| JP2016535930A (ja) | 2016-11-17 |
| US20160254579A1 (en) | 2016-09-01 |
| CN105814655A (zh) | 2016-07-27 |
| EP3055871A1 (fr) | 2016-08-17 |
| WO2015052059A1 (fr) | 2015-04-16 |
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