SG11201601914QA - Cleaning flux, cleaning solder paste, and solder joint - Google Patents
Cleaning flux, cleaning solder paste, and solder jointInfo
- Publication number
- SG11201601914QA SG11201601914QA SG11201601914QA SG11201601914QA SG11201601914QA SG 11201601914Q A SG11201601914Q A SG 11201601914QA SG 11201601914Q A SG11201601914Q A SG 11201601914QA SG 11201601914Q A SG11201601914Q A SG 11201601914QA SG 11201601914Q A SG11201601914Q A SG 11201601914QA
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning
- solder
- flux
- solder paste
- solder joint
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3616—Halogen compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
- C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
- C08G65/2612—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aromatic or arylaliphatic hydroxyl groups
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/074752 WO2015037107A1 (ja) | 2013-09-12 | 2013-09-12 | 洗浄用フラックス、洗浄用ソルダペースト及びはんだ継手 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601914QA true SG11201601914QA (en) | 2016-04-28 |
Family
ID=52665249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601914QA SG11201601914QA (en) | 2013-09-12 | 2013-09-12 | Cleaning flux, cleaning solder paste, and solder joint |
Country Status (11)
Country | Link |
---|---|
US (1) | US10259083B2 (de) |
EP (1) | EP3040154B1 (de) |
JP (1) | JP5850206B2 (de) |
KR (1) | KR101706521B1 (de) |
CN (1) | CN105531076B (de) |
BR (1) | BR112016005301B1 (de) |
PH (1) | PH12016500487A1 (de) |
PT (1) | PT3040154T (de) |
SG (1) | SG11201601914QA (de) |
TW (1) | TW201523756A (de) |
WO (1) | WO2015037107A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017141404A1 (ja) * | 2016-02-18 | 2017-08-24 | 千住金属工業株式会社 | フラックス |
JP6338007B1 (ja) * | 2017-11-02 | 2018-06-06 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP6536730B1 (ja) * | 2018-08-10 | 2019-07-03 | 千住金属工業株式会社 | フラックス及びはんだペースト |
JP6764123B1 (ja) * | 2019-10-04 | 2020-09-30 | 千住金属工業株式会社 | ソルダペースト |
JP6795777B1 (ja) * | 2020-03-27 | 2020-12-02 | 千住金属工業株式会社 | 洗浄用フラックス及び洗浄用ソルダペースト |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2898255A (en) * | 1958-06-30 | 1959-08-04 | Ibm | Soldering flux composition |
US3837932A (en) * | 1972-03-27 | 1974-09-24 | Lake Chemical Co | Fluxes for use in bonding plates of storage batteries to connecting straps |
US4077815A (en) * | 1976-12-20 | 1978-03-07 | International Business Machines Corporation | Water soluble flux |
DE3734331A1 (de) | 1987-10-10 | 1989-04-27 | Basf Ag | Verwendung von alkylenoxid-addukten in flussmitteln und umschmelzfluessigkeiten |
WO1992005228A1 (en) | 1990-09-17 | 1992-04-02 | Motorola, Inc. | Solder pastes containing acrylic acid and derivatives thereof |
JPH10202393A (ja) | 1997-01-22 | 1998-08-04 | Nippon Fuiraa Metals:Kk | 水で洗浄可能な高温はんだ付用非ハロゲンフラックス |
JP4486287B2 (ja) | 2001-09-26 | 2010-06-23 | タムラ化研株式会社 | ソルダペースト組成物及びリフローはんだ付方法 |
KR100804293B1 (ko) * | 2004-03-31 | 2008-02-18 | 아사히 가세이 케미칼즈 가부시키가이샤 | 에폭시 수지용 경화제 및 에폭시 수지 조성물 |
WO2007032429A1 (ja) * | 2005-09-15 | 2007-03-22 | Senju Metal Industry Co., Ltd. | フォームはんだとその製造方法 |
JP4609296B2 (ja) * | 2005-12-05 | 2011-01-12 | 株式会社日立製作所 | 高温半田及び高温半田ペースト材、及びそれを用いたパワー半導体装置 |
TW200838378A (en) | 2007-03-15 | 2008-09-16 | Senju Metal Industry Co | Water soluble pressure sensitive adhesive for fine solder ball replacement and alignment of fine solder ball on a printed board |
CN101062536A (zh) * | 2007-06-01 | 2007-10-31 | 中南大学 | 无铅焊锡用无卤素免清洗助焊剂 |
CN101073862A (zh) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | 无铅焊膏用低松香型无卤素免清洗助焊剂 |
KR101133960B1 (ko) | 2007-11-27 | 2012-04-05 | 하리마 카세이 가부시키가이샤 | 납땜용 플럭스 및 땜납 페이스트 조성물 |
WO2010024141A1 (ja) * | 2008-08-27 | 2010-03-04 | 荒川化学工業株式会社 | 鉛フリーはんだフラックス除去用洗浄剤組成物および鉛フリーはんだフラックス除去システム |
-
2013
- 2013-09-12 CN CN201380079547.9A patent/CN105531076B/zh active Active
- 2013-09-12 JP JP2015530178A patent/JP5850206B2/ja active Active
- 2013-09-12 SG SG11201601914QA patent/SG11201601914QA/en unknown
- 2013-09-12 KR KR1020167009195A patent/KR101706521B1/ko active IP Right Grant
- 2013-09-12 BR BR112016005301-0A patent/BR112016005301B1/pt active IP Right Grant
- 2013-09-12 EP EP13893339.5A patent/EP3040154B1/de active Active
- 2013-09-12 WO PCT/JP2013/074752 patent/WO2015037107A1/ja active Application Filing
- 2013-09-12 PT PT13893339T patent/PT3040154T/pt unknown
- 2013-09-12 US US14/917,363 patent/US10259083B2/en active Active
-
2014
- 2014-07-29 TW TW103125806A patent/TW201523756A/zh unknown
-
2016
- 2016-03-11 PH PH12016500487A patent/PH12016500487A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN105531076B (zh) | 2017-05-03 |
BR112016005301A2 (pt) | 2017-11-21 |
WO2015037107A1 (ja) | 2015-03-19 |
US10259083B2 (en) | 2019-04-16 |
PH12016500487B1 (en) | 2016-05-16 |
TW201523756A (zh) | 2015-06-16 |
US20160221128A1 (en) | 2016-08-04 |
TWI561331B (de) | 2016-12-11 |
KR101706521B1 (ko) | 2017-02-13 |
JPWO2015037107A1 (ja) | 2017-03-02 |
EP3040154A4 (de) | 2017-04-12 |
CN105531076A (zh) | 2016-04-27 |
KR20160054553A (ko) | 2016-05-16 |
PT3040154T (pt) | 2018-11-20 |
EP3040154A1 (de) | 2016-07-06 |
JP5850206B2 (ja) | 2016-02-03 |
PH12016500487A1 (en) | 2016-05-16 |
BR112016005301B1 (pt) | 2021-01-19 |
EP3040154B1 (de) | 2018-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PT3000554T (pt) | Pasta de solda | |
HRP20182112T1 (hr) | Legura za lemljenje bez olova | |
GB201312388D0 (en) | Materials and methods for soldering and soldered products | |
EP3219433A4 (de) | Flussmittel für lötpaste, lötpaste und verbundener körper | |
EP2939784A4 (de) | Flussmittel und lötpaste | |
PT3103565T (pt) | Esfera de cu, esfera de núcleo de cu, junta de solda, pasta de solda e espuma de solda | |
PT3012047T (pt) | Esfera de núcleo de cu | |
EP2716404A4 (de) | Lötpastenflussmittel und lötpaste | |
IL244195A0 (en) | Herbicide preparations containing sulphantrazone plus propizamide and also sulphantrazone plus propizamide plus ethalfluralin | |
EP2952283A4 (de) | Elementverbindungsverfahren, struktur aus verbundenen elementen und verbindungsrohr | |
EP2992992A4 (de) | Verbindung von unterschiedlichen materialien | |
EP2752270A4 (de) | Lötpulver und lötpaste mit dem lötpulver | |
PL2945772T3 (pl) | Stopy lutownicze | |
EP3031571A4 (de) | Leitfähiger haftvermittler und lötverbindung | |
EP2862667A4 (de) | Flussmittelzusammensetzung, flüssiges flussmittel, lötmittel mit einem harzflussmittelkern und lötpaste | |
SG11201601920TA (en) | Lead-free solder, lead-free solder ball, solder joint obtained using said lead-free solder, and semiconductor circuit including said solder joint | |
EP3034230A4 (de) | Flussmittel, lötpaste und lötverbindung | |
PL3031566T3 (pl) | Bezołowiowy stop lutowniczy | |
GB201410093D0 (en) | Solder flux | |
EP2805792A4 (de) | Flussmittel für röhrenlot und röhrenlot | |
EP3238872A4 (de) | Flussmittel für schnellerwärmungsverfahren und lötpaste für schnellerwärmungsverfahren | |
HUE044242T2 (hu) | Folyasztószer visszanyerõ eszköz és forrasztó berendezés | |
EP3495090A4 (de) | Lötpastenflussmittel und lötpaste | |
EP3078446A4 (de) | Lötmaterial und verbindungsstruktur | |
EP3124167A4 (de) | Flussmittel und lötpaste |