SG11201601261SA - Etching method - Google Patents
Etching methodInfo
- Publication number
- SG11201601261SA SG11201601261SA SG11201601261SA SG11201601261SA SG11201601261SA SG 11201601261S A SG11201601261S A SG 11201601261SA SG 11201601261S A SG11201601261S A SG 11201601261SA SG 11201601261S A SG11201601261S A SG 11201601261SA SG 11201601261S A SG11201601261S A SG 11201601261SA
- Authority
- SG
- Singapore
- Prior art keywords
- etching method
- etching
- Prior art date
Links
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013194285 | 2013-09-19 | ||
JP2014020628A JP2015084396A (ja) | 2013-09-19 | 2014-02-05 | エッチング方法 |
PCT/JP2014/073042 WO2015041043A1 (ja) | 2013-09-19 | 2014-09-02 | エッチング方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601261SA true SG11201601261SA (en) | 2016-04-28 |
Family
ID=52688697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601261SA SG11201601261SA (en) | 2013-09-19 | 2014-09-02 | Etching method |
Country Status (8)
Country | Link |
---|---|
US (1) | US20160203998A1 (zh) |
EP (1) | EP3048638A4 (zh) |
JP (1) | JP2015084396A (zh) |
KR (1) | KR20160055788A (zh) |
CN (1) | CN105474368A (zh) |
SG (1) | SG11201601261SA (zh) |
TW (1) | TW201522205A (zh) |
WO (1) | WO2015041043A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6643875B2 (ja) * | 2015-11-26 | 2020-02-12 | 東京エレクトロン株式会社 | エッチング方法 |
US9978563B2 (en) * | 2016-01-27 | 2018-05-22 | Tokyo Electron Limited | Plasma treatment method to meet line edge roughness and other integration objectives |
JP6763750B2 (ja) * | 2016-11-07 | 2020-09-30 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
JP7022651B2 (ja) * | 2018-05-28 | 2022-02-18 | 東京エレクトロン株式会社 | 膜をエッチングする方法及びプラズマ処理装置 |
TWI812762B (zh) * | 2018-07-30 | 2023-08-21 | 日商東京威力科創股份有限公司 | 處理被處理體之方法、處理裝置及處理系統 |
JP7220603B2 (ja) * | 2019-03-20 | 2023-02-10 | 東京エレクトロン株式会社 | 膜をエッチングする方法及びプラズマ処理装置 |
JP2022536631A (ja) * | 2019-06-04 | 2022-08-18 | ラム リサーチ コーポレーション | パターニングにおける反応性イオンエッチングのための重合保護層 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3940546B2 (ja) * | 1999-06-07 | 2007-07-04 | 株式会社東芝 | パターン形成方法およびパターン形成材料 |
JP3883470B2 (ja) * | 2002-05-14 | 2007-02-21 | 沖電気工業株式会社 | 半導体装置の製造方法 |
JP3946724B2 (ja) * | 2004-01-29 | 2007-07-18 | シャープ株式会社 | 半導体装置の製造方法 |
US7347953B2 (en) | 2006-02-02 | 2008-03-25 | International Business Machines Corporation | Methods for forming improved self-assembled patterns of block copolymers |
US8877073B2 (en) * | 2008-10-27 | 2014-11-04 | Canon Nanotechnologies, Inc. | Imprint lithography template |
US8114306B2 (en) | 2009-05-22 | 2012-02-14 | International Business Machines Corporation | Method of forming sub-lithographic features using directed self-assembly of polymers |
WO2011036778A1 (ja) * | 2009-09-25 | 2011-03-31 | 株式会社 東芝 | パターン形成方法 |
US9666414B2 (en) * | 2011-10-27 | 2017-05-30 | Applied Materials, Inc. | Process chamber for etching low k and other dielectric films |
EP2608247A1 (en) * | 2011-12-21 | 2013-06-26 | Imec | EUV photoresist encapsulation |
JP5894445B2 (ja) * | 2012-01-23 | 2016-03-30 | 東京エレクトロン株式会社 | エッチング方法及びエッチング装置 |
JP5802233B2 (ja) * | 2013-03-27 | 2015-10-28 | 株式会社東芝 | パターン形成方法 |
-
2014
- 2014-02-05 JP JP2014020628A patent/JP2015084396A/ja active Pending
- 2014-09-02 EP EP14846557.8A patent/EP3048638A4/en not_active Withdrawn
- 2014-09-02 CN CN201480046269.1A patent/CN105474368A/zh active Pending
- 2014-09-02 KR KR1020167003685A patent/KR20160055788A/ko not_active Application Discontinuation
- 2014-09-02 SG SG11201601261SA patent/SG11201601261SA/en unknown
- 2014-09-02 US US14/912,652 patent/US20160203998A1/en not_active Abandoned
- 2014-09-02 WO PCT/JP2014/073042 patent/WO2015041043A1/ja active Application Filing
- 2014-09-18 TW TW103132283A patent/TW201522205A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN105474368A (zh) | 2016-04-06 |
JP2015084396A (ja) | 2015-04-30 |
EP3048638A1 (en) | 2016-07-27 |
US20160203998A1 (en) | 2016-07-14 |
WO2015041043A1 (ja) | 2015-03-26 |
EP3048638A4 (en) | 2017-05-03 |
KR20160055788A (ko) | 2016-05-18 |
TW201522205A (zh) | 2015-06-16 |
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