SG11201510190YA - Target, adapted to an indirect cooling device, having a cooling plate - Google Patents
Target, adapted to an indirect cooling device, having a cooling plateInfo
- Publication number
- SG11201510190YA SG11201510190YA SG11201510190YA SG11201510190YA SG11201510190YA SG 11201510190Y A SG11201510190Y A SG 11201510190YA SG 11201510190Y A SG11201510190Y A SG 11201510190YA SG 11201510190Y A SG11201510190Y A SG 11201510190YA SG 11201510190Y A SG11201510190Y A SG 11201510190YA
- Authority
- SG
- Singapore
- Prior art keywords
- target
- indirect
- cooling device
- cooling
- cooling plate
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013011074.2A DE102013011074A1 (de) | 2013-07-03 | 2013-07-03 | An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte |
| PCT/EP2014/001782 WO2015000577A1 (fr) | 2013-07-03 | 2014-06-30 | Cible adaptée sur un dispositif de refroidissement indirect pourvue d'une plaque de refroidissement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201510190YA true SG11201510190YA (en) | 2016-01-28 |
Family
ID=51167845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201510190YA SG11201510190YA (en) | 2013-07-03 | 2014-06-30 | Target, adapted to an indirect cooling device, having a cooling plate |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US10636635B2 (fr) |
| EP (1) | EP3017082A1 (fr) |
| JP (1) | JP6652485B2 (fr) |
| KR (1) | KR102274485B1 (fr) |
| CN (1) | CN105283577B (fr) |
| BR (1) | BR112015032156B1 (fr) |
| CA (1) | CA2916770C (fr) |
| DE (1) | DE102013011074A1 (fr) |
| HK (1) | HK1214309A1 (fr) |
| IL (1) | IL243137B (fr) |
| MX (1) | MX2015016869A (fr) |
| MY (1) | MY186272A (fr) |
| PH (1) | PH12015502733A1 (fr) |
| RU (1) | RU2016103234A (fr) |
| SG (1) | SG11201510190YA (fr) |
| WO (1) | WO2015000577A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11202005861VA (en) * | 2017-12-27 | 2020-08-28 | Ulvac Inc | Sputtering method and sputtering device |
| CN108130516A (zh) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | 一种使用泡沫金属增强冷却的真空镀阴极靶 |
| CN112599446A (zh) * | 2020-12-15 | 2021-04-02 | 华能新能源股份有限公司 | 一种真空蒸镀用基片辅助降温装置 |
| CN113667947B (zh) * | 2021-07-23 | 2023-04-21 | 镇江市德利克真空设备科技有限公司 | 一种应用于阴极平台的智能温控装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4569745A (en) * | 1982-10-05 | 1986-02-11 | Fujitsu Limited | Sputtering apparatus |
| US5082595A (en) * | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
| DE4015388C2 (de) * | 1990-05-14 | 1997-07-17 | Leybold Ag | Kathodenzerstäubungsvorrichtung |
| EP0512456B1 (fr) * | 1991-05-08 | 1997-06-18 | Balzers Aktiengesellschaft | Procédé de montage et démontage d'une plaque cible dans une chambre de traitement sous vide, dispositif de montage, plaque cible et chambre à vide |
| WO1998007565A1 (fr) * | 1996-08-23 | 1998-02-26 | Tosoh Smd, Inc. | Assemblage a l'aide une feuille de materiau conducteur adhesive |
| US5985115A (en) * | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
| EP0951049A1 (fr) * | 1998-04-16 | 1999-10-20 | Balzers Aktiengesellschaft | Baque de retenue, cible et son procédé de fabrication |
| KR100291330B1 (ko) * | 1998-07-02 | 2001-07-12 | 윤종용 | 반도체장치제조용스퍼터링설비및이를이용한스퍼터링방법 |
| JP2001164361A (ja) * | 1999-12-09 | 2001-06-19 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット冷却構造 |
| JP2005537391A (ja) * | 2002-09-03 | 2005-12-08 | ユミコア・マテリアルズ・アクチェンゲゼルシャフト | スパッタ陰極、製造方法およびこれに関する陰極 |
| DE102004058280A1 (de) * | 2004-12-02 | 2006-06-08 | Tesa Ag | Doppelseitige Haftklebebänder zur Herstellung bzw. Verklebung von LC-Displays mit lichtabsorbierenden Eigenschaften |
| EP1752556B1 (fr) * | 2005-08-02 | 2007-10-31 | Applied Materials GmbH & Co. KG | Cathode tubulaire pour pulvérisation cathodique |
| JP5236400B2 (ja) * | 2008-09-04 | 2013-07-17 | 太陽ホールディングス株式会社 | 導電ペーストおよびそれを用いた電極 |
| DE102008060113A1 (de) * | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| CN201778106U (zh) | 2010-07-27 | 2011-03-30 | 上海北玻镀膜技术工业有限公司 | 真空镀膜设备中的矩形平面磁控阴极结构 |
-
2013
- 2013-07-03 DE DE102013011074.2A patent/DE102013011074A1/de not_active Withdrawn
-
2014
- 2014-06-30 CA CA2916770A patent/CA2916770C/fr active Active
- 2014-06-30 RU RU2016103234A patent/RU2016103234A/ru not_active Application Discontinuation
- 2014-06-30 EP EP14737147.0A patent/EP3017082A1/fr active Pending
- 2014-06-30 MY MYPI2015704722A patent/MY186272A/en unknown
- 2014-06-30 KR KR1020167002290A patent/KR102274485B1/ko active IP Right Grant
- 2014-06-30 MX MX2015016869A patent/MX2015016869A/es unknown
- 2014-06-30 WO PCT/EP2014/001782 patent/WO2015000577A1/fr active Application Filing
- 2014-06-30 US US14/902,577 patent/US10636635B2/en active Active
- 2014-06-30 BR BR112015032156-9A patent/BR112015032156B1/pt active IP Right Grant
- 2014-06-30 JP JP2016522328A patent/JP6652485B2/ja not_active Expired - Fee Related
- 2014-06-30 CN CN201480033082.8A patent/CN105283577B/zh active Active
- 2014-06-30 SG SG11201510190YA patent/SG11201510190YA/en unknown
-
2015
- 2015-12-07 PH PH12015502733A patent/PH12015502733A1/en unknown
- 2015-12-15 IL IL243137A patent/IL243137B/en active IP Right Grant
-
2016
- 2016-02-29 HK HK16102317.4A patent/HK1214309A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015000577A1 (fr) | 2015-01-08 |
| BR112015032156A2 (pt) | 2017-07-25 |
| CA2916770C (fr) | 2022-06-07 |
| KR102274485B1 (ko) | 2021-07-09 |
| HK1214309A1 (zh) | 2016-07-22 |
| US20160172166A1 (en) | 2016-06-16 |
| CN105283577B (zh) | 2018-11-20 |
| JP6652485B2 (ja) | 2020-02-26 |
| PH12015502733B1 (en) | 2016-03-07 |
| IL243137B (en) | 2021-03-25 |
| US10636635B2 (en) | 2020-04-28 |
| CN105283577A (zh) | 2016-01-27 |
| RU2016103234A (ru) | 2017-08-08 |
| PH12015502733A1 (en) | 2016-03-07 |
| BR112015032156B1 (pt) | 2021-07-06 |
| MX2015016869A (es) | 2016-09-23 |
| EP3017082A1 (fr) | 2016-05-11 |
| DE102013011074A1 (de) | 2015-01-08 |
| KR20160029081A (ko) | 2016-03-14 |
| CA2916770A1 (fr) | 2015-01-08 |
| JP2016523315A (ja) | 2016-08-08 |
| MY186272A (en) | 2021-07-01 |
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