SG11201510022SA - Apparatus and method for taping adhesive film on semiconductor substrate - Google Patents
Apparatus and method for taping adhesive film on semiconductor substrateInfo
- Publication number
- SG11201510022SA SG11201510022SA SG11201510022SA SG11201510022SA SG11201510022SA SG 11201510022S A SG11201510022S A SG 11201510022SA SG 11201510022S A SG11201510022S A SG 11201510022SA SG 11201510022S A SG11201510022S A SG 11201510022SA SG 11201510022S A SG11201510022S A SG 11201510022SA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor substrate
- adhesive film
- taping
- taping adhesive
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2013/077437 WO2014201627A1 (en) | 2013-06-19 | 2013-06-19 | Apparatus and method for taping adhesive film on semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201510022SA true SG11201510022SA (en) | 2016-01-28 |
Family
ID=52103798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201510022SA SG11201510022SA (en) | 2013-06-19 | 2013-06-19 | Apparatus and method for taping adhesive film on semiconductor substrate |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20160022834A (zh) |
| CN (1) | CN105283941B (zh) |
| SG (1) | SG11201510022SA (zh) |
| WO (1) | WO2014201627A1 (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9812344B2 (en) * | 2015-02-03 | 2017-11-07 | Applied Materials, Inc. | Wafer processing system with chuck assembly maintenance module |
| CN107301963A (zh) * | 2016-04-15 | 2017-10-27 | 上海新昇半导体科技有限公司 | 伯努利基座装置及沉积设备 |
| CN106005547A (zh) * | 2016-07-01 | 2016-10-12 | 和信精密科技（吴江）有限公司 | 一种真空贴膜机及其贴膜方法 |
| KR102499977B1 (ko) | 2016-07-13 | 2023-02-15 | 삼성전자주식회사 | 접착 테이프 부착 장치 및 이를 이용한 반도체 패키지의 제조 방법 |
| US10369706B2 (en) * | 2017-08-09 | 2019-08-06 | The Boeing Company | End effectors carrying plies of limp material for shaping by a mandrel |
| WO2020172785A1 (en) * | 2019-02-26 | 2020-09-03 | Yangtze Memory Technologies Co., Ltd. | Method and device for wafer taping |
| JP7437899B2 (ja) * | 2019-09-20 | 2024-02-26 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| CN115008792B (zh) * | 2022-03-31 | 2023-04-28 | 武汉大学 | 一种基于空气射流的功能薄膜贴附方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3685136D1 (de) * | 1985-02-07 | 1992-06-11 | Fujitsu Ltd | Verfahren und vorrichtung zum anheften eines streifens oder films an eine halbleiterscheibe. |
| JPH0725463B2 (ja) * | 1986-07-02 | 1995-03-22 | 富士通株式会社 | 半導体装置の製造方法 |
| JP3156344B2 (ja) * | 1992-03-13 | 2001-04-16 | 富士通株式会社 | 半導体ウェーハへのテープ添着方法とその装置 |
| US6007654A (en) * | 1996-12-31 | 1999-12-28 | Texas Instruments Incorporated | Noncontact method of adhering a wafer to a wafer tape |
| JP2004281534A (ja) * | 2003-03-13 | 2004-10-07 | Tokyo Seimitsu Co Ltd | Ｄａｆテープ貼付装置およびｄａｆテープ貼付方法 |
| JP4601341B2 (ja) * | 2004-07-02 | 2010-12-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP2008066684A (ja) * | 2006-09-08 | 2008-03-21 | Takatori Corp | ダイシングフレームへの基板のマウント装置 |
| JP4773419B2 (ja) * | 2007-12-20 | 2011-09-14 | リンテック株式会社 | シート貼付装置及び貼付方法 |
-
2013
- 2013-06-19 CN CN201380077368.1A patent/CN105283941B/zh active Active
- 2013-06-19 SG SG11201510022SA patent/SG11201510022SA/en unknown
- 2013-06-19 KR KR1020157036841A patent/KR20160022834A/ko not_active Application Discontinuation
- 2013-06-19 WO PCT/CN2013/077437 patent/WO2014201627A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN105283941A (zh) | 2016-01-27 |
| KR20160022834A (ko) | 2016-03-02 |
| CN105283941B (zh) | 2019-02-01 |
| WO2014201627A1 (en) | 2014-12-24 |
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