SG11201605229PA - Cassette positioning device and semiconductor processing apparatus - Google Patents
Cassette positioning device and semiconductor processing apparatusInfo
- Publication number
- SG11201605229PA SG11201605229PA SG11201605229PA SG11201605229PA SG11201605229PA SG 11201605229P A SG11201605229P A SG 11201605229PA SG 11201605229P A SG11201605229P A SG 11201605229PA SG 11201605229P A SG11201605229P A SG 11201605229PA SG 11201605229P A SG11201605229P A SG 11201605229PA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- positioning device
- semiconductor processing
- cassette positioning
- cassette
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310737644.4A CN104752294B (en) | 2013-12-27 | 2013-12-27 | Film magazine positioner and semiconductor processing equipment |
| PCT/CN2014/092378 WO2015096587A1 (en) | 2013-12-27 | 2014-11-27 | Cassette positioning device and semiconductor processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201605229PA true SG11201605229PA (en) | 2016-08-30 |
Family
ID=53477512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201605229PA SG11201605229PA (en) | 2013-12-27 | 2014-11-27 | Cassette positioning device and semiconductor processing apparatus |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160329228A1 (en) |
| JP (1) | JP6336088B2 (en) |
| KR (1) | KR20160102564A (en) |
| CN (1) | CN104752294B (en) |
| SG (1) | SG11201605229PA (en) |
| TW (1) | TWI581358B (en) |
| WO (1) | WO2015096587A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107309894B (en) * | 2017-06-20 | 2019-10-01 | 京东方科技集团股份有限公司 | A kind of vacuum mechanical-arm and substrate transfer device |
| CN109962029B (en) * | 2017-12-14 | 2021-06-08 | 北京北方华创微电子装备有限公司 | Cassette rotation mechanism and loading chamber |
| CN108321109A (en) * | 2018-03-29 | 2018-07-24 | 德清晶生光电科技有限公司 | Wafer bonding structure |
| CN109368271B (en) * | 2018-09-30 | 2024-08-20 | 苏州展德自动化设备有限公司 | Automatic feeding and discharging equipment for rotation of crystal expanding ring |
| JP7134072B2 (en) * | 2018-11-14 | 2022-09-09 | 株式会社ダイフク | Goods transfer equipment |
| CN110666372A (en) * | 2019-11-13 | 2020-01-10 | 江西志浩电子科技有限公司 | A positioner for radium-shine processing of HDI board |
| CN110993530B (en) * | 2019-11-25 | 2024-02-27 | 北京北方华创微电子装备有限公司 | Workpiece caching device, equipment front-end module and semiconductor equipment |
| CN112053982B (en) * | 2020-09-23 | 2022-04-05 | 北京七星华创集成电路装备有限公司 | Storage box door opening device and semiconductor process equipment |
| CN113068082A (en) * | 2021-03-11 | 2021-07-02 | 安徽超清科技股份有限公司 | 5G base station installation equipment |
| CN113063379B (en) * | 2021-03-16 | 2023-11-14 | 北京北方华创微电子装备有限公司 | Position calibration equipment of box |
| JP7455411B2 (en) | 2022-04-14 | 2024-03-26 | 株式会社アンレット | Packaged vacuum pump unit |
| CN114975209B (en) * | 2022-07-22 | 2022-11-01 | 智程半导体设备科技(昆山)有限公司 | Feeding equipment of semiconductor wafer cleaning machine |
| CN217955834U (en) * | 2022-09-08 | 2022-12-02 | 台湾积体电路制造股份有限公司 | Wafer boat carrying device and wafer processing system |
| CN116190294B (en) * | 2023-04-24 | 2023-07-25 | 上海果纳半导体技术有限公司 | Crown block teaching method |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63134442A (en) * | 1986-11-20 | 1988-06-07 | Toshiba Corp | Article delivering device |
| US5664926A (en) * | 1995-07-11 | 1997-09-09 | Progressive System Technologies, Inc. | Stage assembly for a substrate processing system |
| US5779203A (en) * | 1996-06-28 | 1998-07-14 | Edlinger; Erich | Adjustable wafer cassette stand |
| JPH1092902A (en) * | 1996-09-17 | 1998-04-10 | Toshiba Corp | Carrier elevator mechanism apparatus having wafer drop preventing |
| JPH10139159A (en) * | 1996-11-13 | 1998-05-26 | Tokyo Electron Ltd | Cassette chamber and cassette carrying-in and out mechanism |
| CN2306570Y (en) * | 1997-07-08 | 1999-02-03 | 财团法人工业技术研究院 | Fixing mechanism for wafer |
| US6152680A (en) * | 1997-08-26 | 2000-11-28 | Daitron, Inc. | Wafer cassette rotation mechanism |
| JPH11150170A (en) * | 1997-11-17 | 1999-06-02 | Dainippon Screen Mfg Co Ltd | Substrate transferring equipment |
| JPH11154700A (en) * | 1997-11-21 | 1999-06-08 | Toshiba Corp | Substrate transporter |
| JP4048551B2 (en) * | 1998-01-23 | 2008-02-20 | 株式会社安川電機 | Wafer cassette lifting device |
| JP4056141B2 (en) * | 1998-08-07 | 2008-03-05 | 松下電器産業株式会社 | Substrate transfer device |
| JP2000061832A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Load cassette tilting mechanism for polishing device |
| JP3945736B2 (en) * | 1999-09-10 | 2007-07-18 | 株式会社日立国際電気 | Substrate processing apparatus and semiconductor device manufacturing method |
| JP2001144166A (en) * | 1999-11-17 | 2001-05-25 | Futaba Corp | Substrate-positioning apparatus and substrate-handling method |
| JP4724334B2 (en) * | 2001-09-18 | 2011-07-13 | 東京エレクトロン株式会社 | Automated guided vehicle |
| JP4999414B2 (en) * | 2006-09-27 | 2012-08-15 | 信越ポリマー株式会社 | Substrate handling apparatus and substrate handling method |
| CN200969344Y (en) * | 2006-10-16 | 2007-10-31 | 家登精密工业股份有限公司 | Wafer box and its wafer fastener |
| CN101383315B (en) * | 2008-10-24 | 2011-04-27 | 陈百捷 | Silicon chip kit platform having pitching function |
| CN103412578B (en) * | 2013-07-22 | 2015-10-28 | 同济大学 | A kind of sun power ecliptic tracker |
-
2013
- 2013-12-27 CN CN201310737644.4A patent/CN104752294B/en active Active
-
2014
- 2014-11-25 TW TW103140793A patent/TWI581358B/en active
- 2014-11-27 WO PCT/CN2014/092378 patent/WO2015096587A1/en active Application Filing
- 2014-11-27 SG SG11201605229PA patent/SG11201605229PA/en unknown
- 2014-11-27 US US15/108,493 patent/US20160329228A1/en not_active Abandoned
- 2014-11-27 JP JP2016542971A patent/JP6336088B2/en active Active
- 2014-11-27 KR KR1020167020674A patent/KR20160102564A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP6336088B2 (en) | 2018-06-06 |
| US20160329228A1 (en) | 2016-11-10 |
| CN104752294A (en) | 2015-07-01 |
| TW201526146A (en) | 2015-07-01 |
| WO2015096587A1 (en) | 2015-07-02 |
| TWI581358B (en) | 2017-05-01 |
| JP2017502520A (en) | 2017-01-19 |
| CN104752294B (en) | 2018-01-09 |
| KR20160102564A (en) | 2016-08-30 |
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