CN217955834U

CN217955834U - Wafer boat carrying device and wafer processing system

Info

Publication number: CN217955834U
Application number: CN202222382968.8U
Authority: CN
Inventors: 张通; 江军中; 施杰
Original assignee: TSMC China Co Ltd; Taiwan Semiconductor Manufacturing Co TSMC Ltd
Current assignee: TSMC China Co Ltd; Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2022-12-02
Anticipated expiration: 2032-09-08
Also published as: WO2024050887A1

Abstract

The embodiment of the application provides a wafer boat bearing device and a wafer processing system, a wafer boat comprises two wafer boat pieces which are oppositely arranged, each wafer boat piece comprises a first side face and a second side face which are adjacently arranged, the wafer boat bearing device comprises a bearing unit which is in one-to-one correspondence with the wafer boat pieces, each bearing unit comprises a bearing plate and a limiting plate, each limiting plate is arranged on the corresponding bearing plate and comprises a first limiting portion and a second limiting portion which are connected with each other, the first limiting portions are provided with first limiting faces which extend along a first direction, the first limiting faces are used for being abutted to at least parts of the first side faces, the second limiting portions are provided with second limiting faces which extend along a second direction, the second limiting faces are used for being abutted to at least parts of the second side faces, so that the wafer boat pieces cannot deviate along the first direction and the second direction, the possibility that wafers located in the wafer boat pieces are scratched or collided with a process furnace is reduced, and the processing yield of the chips is improved.

Description

Wafer boat carrying device and wafer processing system

Technical Field

The application belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer boat bearing device and a wafer processing system.

Background

The wafer boat refers to a tool for carrying wafers as semiconductor materials in a manufacturing process of semiconductor chips. Because the process of semiconductor chip processing is complex and the processing flow is many, the position of the wafer is inevitably required to be moved in the processing process to meet different process conditions, especially in the processes of heat treatment of the wafer and the like, the process can be completed only by moving the wafer to a process furnace because the environment requirement is severe.

Because the structure of the process furnace is complex, the wafers are easily scratched or collided with the process furnace during the movement of the wafer boat, which affects the performance of the produced semiconductor chips and even causes the rejection of the chips, resulting in the reduction of the processing yield of the chips.

However, during the moving process of the movable carrier, due to the influence of factors such as inertia, the wafer boat may also shift on the movable carrier to a certain extent, so that the wafers in the wafer boat may scratch or collide with the process furnace, and the processing yield of the semiconductor chips is finally affected.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a boat bearing device and a wafer processing system, which can avoid the deviation of a boat on the boat bearing device so as to reduce the possibility of scratch or collision between wafers in the boat and a process furnace.

In a first aspect, an embodiment of the present application provides a wafer boat carrying device, wherein a wafer boat includes two wafer boat sheets that are arranged oppositely, each wafer boat sheet includes a first side surface and a second side surface that are arranged adjacently, the wafer boat carrying device includes a carrying unit that corresponds to one wafer boat sheet one by one, the carrying unit includes a carrying plate and a limiting plate, the limiting plate is arranged on the carrying plate, the limiting plate includes a first limiting portion and a second limiting portion that are connected to each other, the first limiting portion is formed with a first limiting surface that extends along a first direction, the first limiting surface is used for abutting against at least part of the first side surface of the wafer boat sheet, the second limiting portion is formed with a second limiting surface that extends along a second direction, the second limiting surface is used for abutting against at least part of the second side surface of the wafer boat sheet, and the first direction and the second direction are arranged in an intersecting manner.

As a specific implementation manner, the wafer boat further includes a third side surface opposite to the first side surface, a third limiting surface is further formed on a side of the first limiting portion away from the first limiting surface, the third limiting surface extends along the first direction, and the third limiting surface is used for abutting against at least part of the third side surface of the wafer boat.

As a specific implementation mode, the bearing plate is detachably connected with the limiting plate.

As a specific implementation manner, the bearing unit further includes a connection fitting member, a first connection hole matched with the connection fitting member is provided on the bearing plate, a second connection hole matched with the connection fitting member is provided on the limiting plate, the bearing plate and the limiting plate are connected with the second connection hole and the connection fitting member through the first connection hole, the first connection hole is a long-strip-shaped hole, and/or the second connection hole is a long-strip-shaped hole.

As a specific embodiment, the first connection hole and the second connection hole both extend in the first direction, or either one of the first connection hole and the second connection hole extends in the first direction and the other extends in the second direction.

In one embodiment, the second connection holes are a plurality of second connection holes, and the plurality of second connection holes are spaced along the first direction, and/or the plurality of second connection holes are spaced along the second direction.

As a specific embodiment, the wafer boat carrying apparatus further includes a connecting platform, and the connecting platform is connected between the two carrying plates of the two carrying units.

As a specific implementation manner, the boat carrier further includes a driving mechanism, the driving mechanism is connected to a side of the connecting platform away from the boat in a third direction, and the third direction is perpendicular to both the first direction and the second direction.

As a specific embodiment, the carrying plate further has a plurality of yielding portions, at least one of the yielding portions is located on one side of the carrying plate away from the limiting plate along the second direction, and at least two of the yielding portions are disposed on two opposite sides of the carrying plate along the first direction.

In a second aspect, an embodiment of the present application further provides a wafer processing system, which includes a wafer boat and any one of the above wafer boat carriers, where the wafer boat is used to accommodate a wafer, and the wafer boat carrier is used to carry the wafer boat.

The wafer boat bearing device and the wafer processing system provided by the embodiment of the application have the advantages that the bearing units which are in one-to-one correspondence with the wafer boat sheets in the wafer boat bear the corresponding wafer boat sheets, each bearing unit comprises a bearing plate and a limiting plate, the limiting plates are arranged on the bearing plates and comprise a first limiting part and a second limiting part which are connected with each other, the first limiting parts are formed with first limiting surfaces extending along a first direction, the second limiting parts are formed with second limiting surfaces extending along a second direction, so that at least part of the first side surfaces of the wafer boat sheets is abutted with the corresponding first limiting surfaces, at least part of the second side surfaces of the wafer boat sheets is abutted with the corresponding second limiting surfaces, the wafer boat sheets are guaranteed not to generate position deviation along the first direction and the second direction, the possibility that wafers in the wafer boat sheets are scratched or collided with a process furnace in the process of being conveyed to the process furnace is reduced, the damage rate of the wafers is reduced, and the processing yield of the wafers is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of a substrate boat according to some embodiments of the present disclosure;

FIG. 2 is a schematic structural diagram of a boat carrier according to some embodiments of the present disclosure;

FIG. 3 is a schematic view of an assembly of a boat carrier and a boat according to some embodiments of the present disclosure;

fig. 4 is a schematic structural diagram of a carrying unit in a boat carrying device according to some embodiments of the present disclosure;

fig. 5 is another schematic structural diagram of a carrying unit of a boat carrier according to some embodiments of the present disclosure;

fig. 6 is a schematic view of another structure of a carrying unit of a boat carrier according to some embodiments of the present disclosure;

FIG. 7 is a schematic view of another embodiment of a boat carrier;

fig. 8 is a schematic view of another structure of a carrying unit of a boat carrier according to some embodiments of the present disclosure;

description of reference numerals:

a boat carrier 100; a carrier unit 110; a carrier plate 111; a limit plate 112; a first stopper 113; a first stopper surface 113a; a third stopper surface 113b; a second stopper 114; a second limiting surface 114a; a first connection hole 115; a second connection hole 116; a connection platform 120; a carry-over section 117;

a wafer boat 200; the wafer boat 210; a first side 211; a second side 212; a third side 213;

a first direction X; a second direction Y; a third direction Z.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

In order to solve the problem of the prior art, the embodiment of the application provides a wafer boat bearing device and a wafer processing system. First, the boat carrier provided in the embodiments of the present application will be described.

Fig. 1 is a schematic structural diagram of a boat provided in some embodiments of the present application, fig. 2 is a schematic structural diagram of a boat carrier provided in some embodiments of the present application, and fig. 3 is a schematic assembly diagram of the boat carrier and the boat provided in some embodiments of the present application.

As shown in fig. 1 to fig. 3, an embodiment of the present invention provides a boat carrier 100, wherein a boat 200 includes two boat wafers 210 disposed opposite to each other, the boat wafers 210 include a first side surface 211 and a second side surface 212 disposed adjacent to each other, the boat carrier 100 includes carrier units 110 corresponding to the boat wafers 210 one by one, each carrier unit 110 includes a carrier plate 111 and a limit plate 112, the limit plate 112 is disposed on the carrier plate 111, the limit plate 112 includes a first limit portion 113 and a second limit portion 114 connected to each other, the first limit portion 113 includes a first limit surface 113a extending along a first direction X, the first limit surface 113a is configured to abut against at least a portion of the first side surface 211 of the boat wafer 210, the second limit portion 114 includes a second limit surface 114a extending along a second direction Y, the second limit surface 114a is configured to abut against at least a portion of the second side surface 212 of the boat wafer 210, and the first direction X and the second direction Y are disposed to intersect with each other.

It is understood that the wafer boat 200 refers to a tool for carrying semiconductor materials, i.e., wafers, during the manufacturing process of semiconductor chips, the wafer boat 200 may specifically include two wafer boat sheets 210 disposed opposite to each other, the two wafer boat sheets 210 may be fixedly connected to each other through a connecting member, each wafer boat sheet 210 is provided with a plurality of carrying grooves for carrying wafers, the wafer boat sheet 210 may include a first protruding portion extending along the first direction X, and the first side surface 211 and the second side surface 212 are disposed on the first protruding portion.

The first direction X and the second direction Y are arranged in an intersecting manner, where the intersecting in this application means that an included angle is formed between the first direction X and the second direction Y, and the size of the included angle can be determined according to actual situations, for example, the included angle between the first direction X and the second direction Y can be 90 °, and the first direction X is perpendicular to the second direction Y. For convenience of understanding, the first direction X in the embodiment of the present application is set to be a direction in which an X axis is located in a spatial rectangular coordinate system, and the second direction Y in the embodiment of the present application is set to be a direction in which a Y axis is located in the spatial rectangular coordinate system.

According to the boat carrier 100 provided by the embodiment of the application, the corresponding boat sheets 210 are carried by the carrying units 110 corresponding to the boat sheets 210 in the boat 200 one by one, each carrying unit 110 includes the carrying plate 111 and the limiting plate 112, the limiting plate 112 is disposed on the carrying plate 111, and the limiting plate 112 includes the first limiting portion 113 and the second limiting portion 114 connected to each other, the first limiting portion 113 is formed with the first limiting surface 113a extending along the first direction X, and the second limiting portion 114 is formed with the second limiting surface 114a extending along the second direction Y, so that the first limiting surface 113a is at least partially abutted to the first side surface 211 of the corresponding boat sheet 210, and the second limiting surface 114a is at least partially abutted to the second side surface 212 of the corresponding boat sheet 210, thereby ensuring that the boat sheet 210 does not shift in position along the first direction X and the second direction Y, thereby reducing the possibility that wafers located in the boat sheets 210 are rubbed or collided with a process furnace in the process of being conveyed to the process furnace, and reducing the wafer yield, and improving the wafer yield.

Referring to fig. 1 to fig. 3, as a specific embodiment, the boat sheet 210 further includes a third side surface 213 opposite to the first side surface 211, a third limiting surface 113b is further formed on a side of the first limiting portion 113 away from the first limiting surface 113a, the third limiting surface 113b extends along the first direction X, and the third limiting surface 113b is used for abutting at least a portion of the third side surface 213 of the boat sheet 210.

In the wafer boat 210, the second protruding portion is disposed opposite to the first protruding portion along the second direction Y, the third side surface 213 is disposed on the second protruding portion, and the first side surface 211 on the first protruding portion is disposed opposite to the third side surface 213 on the second protruding portion, so that the first side surface 211 and the third side surface 213 can be clamped on two opposite sides of the first limiting portion 113 along the second direction Y, thereby limiting the movement of the wafer boat 210 along the second direction Y.

In this embodiment, the third limit surface 113b abuts against at least part of the third side surface 213 of the boat wafer 210, and the first limit surface 113a of the limit plate 112 also abuts against at least part of the first side surface 211 of the boat wafer 210, and the first limit surface 113a and the third limit surface 113b are located on two opposite sides of the first limit portion 113 along the second direction Y, so that the position of the boat wafer 210 in the second direction Y at this time is limited by the first limit portion 113, thereby further ensuring that the boat wafer 210 does not have a position deviation in the second direction Y, further reducing the possibility of scratch or collision between the wafer in the boat wafer 210 and the process furnace in the process of being conveyed to the process furnace, and improving the processing yield of the wafer.

As a specific embodiment, an end of the first protruding portion of the wafer boat 210 away from the limit plate 112 in the first direction X and an end of the second protruding portion away from the limit plate 112 in the first direction X may be connected to each other and form a fourth side surface, so that the fourth side surface abuts against a side of the first limit portion 113 away from the second limit portion 114 in the first direction X to further limit the position deviation of the wafer boat 210 in the first direction X.

As a specific embodiment, the carrier plate 111 is detachably connected to the limiting plate 112.

Specifically, the detachable connection between the limiting plate 112 and the bearing plate 111 can be realized through the cooperation of a bolt and a nut, or can be realized through the cooperation of a pin and a pin hole, or the detachable connection between the limiting plate 112 and the bearing plate 111 can also be realized through other connecting structures such as a hinge, and of course, the connection mode between the limiting plate 112 and the bearing plate 111 is not limited thereto, and in practical application, all connection modes that the limiting plate 112 is fixed on the bearing plate 111 are all within the protection range of the application. For easy understanding, the detachable connection between the bearing plate 111 and the limiting plate 112 is realized by the cooperation of a pin and a pin hole in the present embodiment.

It can be understood that, since the boat carrier 100 needs to carry the boat 200 to complete each processing of the wafers, in the process, each structure in the boat carrier 100 inevitably has a certain loss, and at this time, in order to ensure the normal operation of the boat carrier 100, the damaged structure needs to be replaced in time. Currently, since each boat carrier 100 is integrally disposed, when a structure in the apparatus is damaged, the apparatus needs to be replaced as a whole, which causes resource waste and cost increase to some extent.

In this embodiment, because in the working process of the boat carrier 100, the damage of the carrier plate 111 and the limiting plate 112 is relatively large, therefore, the carrier plate 111 and the limiting plate 112 are detachably connected, so that when the carrier plate 111 or the limiting plate 112 is worn out and cannot work continuously, the damaged carrier plate 111 or the damaged limiting plate 112 is replaced in time, thereby avoiding the situation that one of the carrier plate 111 or the limiting plate 112 is damaged and the whole boat carrier 100 or the carrier unit 110 therein is replaced, improving the service life of the boat carrier 100 or the carrier unit 110 therein to a certain extent, reducing the waste of resources, and reducing the cost.

Fig. 4 is a schematic structural diagram of a carrying unit in a boat carrying device according to some embodiments of the present disclosure.

As shown in fig. 4, as a specific embodiment, the bearing unit 110 further includes a connection fitting member (not shown), a first connection hole 115 is disposed on the bearing plate 111 and is matched with the connection fitting member, a second connection hole 116 is disposed on the limiting plate 112 and is matched with the connection fitting member, the bearing plate 111 and the limiting plate 112 are connected with the second connection hole 116 and the connection fitting member through the first connection hole 115, the first connection hole 115 is an elongated hole, and/or the second connection hole 116 is an elongated hole.

The connection fitting may be a pin, a combination of a bolt and a nut, a combination of a screw and a nut, or the like.

It can be understood that, when the carrier plate 111 and the restriction plate 112 are fixed by the engagement of the first and second connection holes 115 and 116 and the connection fitting member, if the first and/or second connection holes 115 and 116 are elongated holes, the position of the restriction plate 112 can be adjusted over the length of the first and/or second connection holes 115 and 116.

Specifically, when the first connection hole 115 may be an elongated hole, the position of the limiting plate 112 on the carrier plate 111 is adjustable within the length range of the first connection hole 115; when the second connection hole 116 can be an elongated hole, the position of the limiting plate 112 on the bearing plate 111 can be adjusted within the length range of the second connection hole 116; or, when the first connection hole 115 and the second connection hole 116 are both elongated holes, the position of the limiting plate 112 on the bearing plate 111 may be adjustable within the length range of the first connection hole 115, or adjustable within the length range of the second connection hole 116, and the position of the limiting plate 112 may be adjusted again within the length range of the second connection hole 116 on the basis of the adjusted position within the length range of the first connection hole 115, so that the position adjustment range of the limiting plate 112 is expanded to a certain extent.

In the embodiment, the position-limiting plate 112 is fixed on the bearing plate 111 by the cooperation of the first connecting hole 115, the second connecting hole 116 and the connection fitting piece, and the position of the position-limiting plate 112 on the bearing plate 111 is adjustable within the length range of the first connecting hole 115 and/or the second connecting hole 116 because the first connecting hole 115 and/or the second connecting hole 116 are elongated holes; in practical application, the positions of the limit plates 112 can be adjusted according to actual conditions of the wafer boat 200 and the wafers, so that the wafers in the wafer boat 200 limited by the limit plates 112 cannot scratch or collide with a process furnace in the process of being conveyed to the process furnace, the application range of the wafer boat bearing device 100 is expanded to a certain extent, and the wafer boat bearing device 100 can adapt to wafer boats 200 with more sizes.

Fig. 5 is a schematic structural diagram of a carrying unit of a boat carrier according to some embodiments of the present disclosure.

As shown in fig. 4 and 5, as a specific embodiment, both the first connection hole 115 and the second connection hole 116 extend in the first direction X, or either one of the first connection hole 115 and the second connection hole 116 extends in the first direction X and the other extends in the second direction Y.

Specifically, the first connection hole 115 and the second connection hole 116 may both extend in the first direction X, and at this time, the position of the limitation plate 112 in the first direction X may be adjusted within a combined length range of the first connection hole 115 and the second connection hole 116; alternatively, the first connection hole 115 may extend along the first direction X, and the second connection hole 116 may extend along the second direction Y, at this time, the position of the limiting plate 112 along the first direction X may be adjusted within the length range of the first connection hole 115, and the position of the limiting plate 112 along the second direction Y may be adjusted within the length range of the second connection hole 116; alternatively, the first connection hole 115 may extend along the second direction Y, and the second connection hole 116 may extend along the first direction X, at this time, the position of the limiting plate 112 along the first direction X may be adjusted within the length range of the second connection hole 116, and the position of the limiting plate 112 along the second direction Y may be adjusted within the length range of the second connection hole 116.

In the embodiment, when the first connection hole 115 and the first and second connection holes 115 and 116 extend along the first direction X, the position of the limiting plate 112 along the first direction X can be adjusted within the range of the combined length of the first and second connection holes 115 and 116, and compared with the case that the position of the limiting plate 112 is adjusted only within the range of the length of the first connection hole 115 or the position of the limiting plate 112 is adjusted only within the range of the length of the second connection hole 116, the adjustment range of the position of the limiting plate 112 along the first direction X in the embodiment is larger, so that the practical application range is wider; or, when one of the first connection hole 115 and the second connection hole 116 may extend along the first direction X and the other one extends along the second direction Y, the position of the limiting plate 112 may be adjusted along the first direction X and the second direction Y, so that the position of the limiting plate 112 in the bearing unit 110 on the bearing plate 111 is more flexible, and the application range of the boat bearing device 100 is expanded to a certain extent.

Fig. 6 is a schematic structural diagram of a carrying unit of a boat carrier according to some embodiments of the present disclosure.

As shown in fig. 6, as a specific embodiment, the second connection holes 116 are plural, and the plural second connection holes 116 are arranged at intervals along the first direction X, and/or the plural second connection holes 116 are arranged at intervals along the second direction Y.

Specifically, when the plurality of second connection holes 116 are arranged at intervals along the first direction X, in the process of installing the limiting plate 112, the limiting plate 112 is installed at different positions of the bearing plate 111 along the first direction X by selecting the second connection holes 116 located at different positions in the first direction X, so that the position of the limiting plate 112 along the first direction X is adjusted; when the plurality of second connecting holes 116 are arranged at intervals along the second direction Y, in the process of installing the limiting plate 112, the limiting plate 112 is installed at different positions of the bearing plate 111 along the second direction Y by selecting the second connecting holes 116 located at different positions along the second direction Y, so that the position of the limiting plate 112 along the second direction Y is adjusted; when the plurality of second connection holes 116 are arranged at intervals along the first direction X and the second direction Y, the positions of the limiting plates 112 in the first direction X on the bearing plate 111 and the positions of the limiting plates 112 in the second direction Y on the bearing plate 111 can be adjusted by selecting the second connection holes 116 at different positions, so that the mounting positions of the limiting plates 112 on the bearing plate 111 are more flexible, and the boat carrier 100 can be more widely applied.

In order to further expand the position adjustment range of the limiting plate 112 in the first direction X or the second direction Y, so that the boat carrier 100 can carry and limit more types of boats 200, as a specific embodiment, the plurality of second connecting holes 116 are arranged in a staggered manner along the first direction X, or the plurality of second connecting holes 116 are arranged in a staggered manner along the second direction Y.

Fig. 7 is a schematic structural diagram of a wafer boat carrier according to some embodiments of the present disclosure.

As shown in fig. 7, as a specific embodiment, the boat carrier 100 further includes a connecting platform 120, and the connecting platform 120 is connected between the two carrier plates 111 of the two carrier units 110.

It is understood that the connection between the carrier plate 111 and the connection platform 120 can be realized by the cooperation of pins and pin holes, and can also be realized by other connection methods.

Specifically, a plurality of pin holes may be formed in one side of the bearing plate 111 close to the connecting platform 120, and matching holes corresponding to the pin holes one to one may be formed in the connecting platform 120, so that the bearing plate 111 is fixed on the connecting platform 120 by matching the pins with the pin holes and the matching holes; in addition, in order to improve the fixing effect, a groove matched with the bearing plate 111 may be formed on the side wall of the connecting platform 120 close to the bearing plate 111, and the bearing plate 111 is clamped in the corresponding groove and then fixed by the matching of the pin, the pin hole and the matching hole.

In this embodiment, the connecting platform 120 is disposed between the two carrier units 110, and the two carrier units 110 are connected by the connecting platform 120, so that stability of the boat 200 carried by the boat carrier 100 is improved, a range and possibility of the boat 200 shifting on the boat carrier 100 are reduced, possibility of scratching or collision between the wafers in the boat 200 and the process furnace during transportation of the wafers to the process furnace is further ensured, and a processing yield of chips is improved.

As a specific embodiment, the boat carrier 100 further includes a driving mechanism (not shown), and the driving mechanism is connected to a side of the connection platform 120 facing away from the boat 200 along a third direction Z, which is perpendicular to the first direction X and the second direction Y.

For convenience of understanding, when the first direction X is a direction represented by an X axis and the second direction Y is a direction represented by a Y axis, the third direction Z may be a direction represented by a Z axis.

The driving mechanism may be a stepping motor, a hydraulic cylinder, a pneumatic cylinder, or other driving devices, for example, the driving mechanism may be a permanent magnet stepping motor, a reaction stepping motor, or a hybrid stepping motor, and the driving mechanism may also be a piston hydraulic cylinder, a plunger hydraulic cylinder, or a telescopic hydraulic cylinder, and the like, which are all within the protection scope of the present application.

In this embodiment, the driving mechanism is connected to the side of the connecting platform 120 departing from the boat 200 along the third direction Z, so that the driving mechanism can drive the connecting platform 120 to move along the third direction Z, and the connecting platform 120 drives the bearing unit 110 and the boat 200 thereon to move along the third direction Z, so as to transport the boat 200 into the process furnace, in this process, the driving mechanism transports the boat 200 together with the whole boat bearing device 100 into the process furnace, so as to reduce the possible offset of the boat 200 during the transportation process, further avoid the scratches or collisions between the wafers in the boat 200 and the process furnace, and improve the production yield of chips.

Fig. 8 is a schematic view illustrating another structure of a carrying unit of a boat carrier according to some embodiments of the present disclosure.

As shown in fig. 8, as a specific embodiment, a plurality of positioning units 117 are further formed on the supporting plate 111, at least one of the positioning units 117 is located on a side of the supporting plate 111 away from the limiting plate 112 along the second direction Y, and at least two of the positioning units 117 are disposed on two opposite sides of the supporting plate 111 along the first direction X.

In the production process of the chips, since the process is complicated, the related apparatuses are numerous and the structure is complex, in order to avoid the influence or even damage of the boat carrier 100 on other structures in the wafer processing system during the process of carrying the boat 200, a plurality of yielding portions 117 are formed on the carrier 111, and the other structures in the wafer processing system are yielded by the yielding portions 117.

The shape of the yielding part 117 can be various, for example, the yielding part 117 can be a square yielding groove, or the yielding part 117 can also be a triangle or other shapes, and it can be understood that the shape and size of the yielding part 117 can be reasonably arranged according to practical situations.

Specifically, at least one of the yielding portions 117 may be located on a side of the carrier plate 111 away from the limit plate 112 along the second direction Y, so as to yield a structure located on the side of the carrier plate 111 away from the limit plate 112 along the second direction Y, thereby preventing the structure at the corresponding position from being influenced or even damaged by the boat carrier 100; at least two of the plurality of relief portions 117 may also be located at two opposite sides of the supporting plate 111 along the first direction X, and it can be understood that two relief portions 117 disposed at two opposite sides of the supporting plate 111 along the first direction X may preferably be symmetrical to each other; in practical applications, the position-giving portion 117 may be disposed at other positions of the carrier plate 111.

In this embodiment, a plurality of yielding portions are formed on the carrier plate 111, at least one of the yielding portions 117 is located on a side of the carrier plate 111 away from the limiting plate 112 along the second direction Y, and at least two of the yielding portions 117 are disposed on two opposite sides of the carrier plate 111 along the first direction X, so that the yielding portions 117 yield other structures in the wafer processing system, thereby preventing the wafer boat carrier 100 from affecting or even damaging other structures in the wafer processing system.

Referring to fig. 3 again, the present invention further provides a wafer processing system, which includes a boat 200 and any one of the boat carrier 100 described above, wherein the boat 200 is used for accommodating wafers, and the boat carrier 100 is used for carrying the boat 200.

The wafer boat 200 may include two wafer boat sheets 210 disposed opposite to each other, the two wafer boat sheets 210 may be connected by a connecting member, on the connecting member, a handle may be disposed to facilitate taking and placing the wafer boat 200, each wafer boat sheet 210 may include a wafer boat body and a first protrusion disposed on the wafer boat body and extending along a first direction X, and the first protrusion has a first side surface 211 and a second side surface 212 adjacent to each other.

Correspondingly, the boat carrier 100 may include a carrying unit 110 corresponding to two boat wafers one to one, and the boat wafers 210 are carried by the carrying unit 110, specifically, the carrying unit 110 may include a carrying plate 111 and a limiting plate 112, the limiting plate 112 is disposed on the carrying plate 111, the limiting plate 112 includes a first limiting portion 113 and a second limiting portion 114 connected to each other, the first limiting portion 113 forms a first limiting surface 113a extending along the first direction X, the second limiting portion 114 forms a second limiting surface 114a extending along the second direction Y, so that the first limiting surface 113a abuts against at least a portion of the first side surface 211 of the boat wafers 210, and the second limiting surface 114a abuts against at least a portion of the second side surface 212 of the boat wafers 210, so as to limit movement of the boat wafers 210 on the carrying plate 111 along the first direction X and the second direction Y, reduce a possibility that wafers located in the boat wafers 210 rub or collide against a process furnaces in a process of the process furnaces, and improve a wafer yield, thereby reducing a wafer yield of wafer processing.

As described above, only the specific embodiments of the present application are provided, and it can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the system, the module and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.

Claims

1. The utility model provides a wafer boat loading attachment, its characterized in that, the wafer boat includes two wafer boat pieces of relative setting, the wafer boat piece includes adjacent first side and the second side that sets up, wafer boat loading attachment include with wafer boat piece one-to-one's load cell, load cell includes:

a carrier plate; and

the limiting plate, the limiting plate sets up on the loading board, the limiting plate includes the first spacing portion and the spacing portion of second of interconnect, first spacing portion is formed with the first spacing face that extends along the first direction, first spacing face be used for with the wafer boat piece at least partial butt of first side, the spacing portion of second is formed with the spacing face of second that extends along the second direction, the spacing face of second be used for with the wafer boat piece at least partial butt of second side, wherein, the first direction with the crossing setting of second direction.

2. The wafer boat carrier device according to claim 1, wherein the wafer boat further comprises a third side surface opposite to the first side surface, a third position-limiting surface is further formed on a side of the first position-limiting portion facing away from the first position-limiting surface, the third position-limiting surface extends along the first direction, and the third position-limiting surface is configured to abut against at least a portion of the third side surface of the wafer boat.

3. The wafer boat carrier of claim 1, wherein the carrier plate is detachably connected to the position-limiting plate.

4. The wafer boat carrying device according to claim 3, wherein the carrying unit further comprises a connection fitting member, the carrying plate is provided with a first connection hole engaged with the connection fitting member, the limiting plate is provided with a second connection hole engaged with the connection fitting member, the carrying plate and the limiting plate are connected through the first connection hole, the second connection hole and the connection fitting member, the first connection hole is a long bar-shaped hole, and/or the second connection hole is a long bar-shaped hole.

5. The wafer boat carrier according to claim 4, wherein the first connection holes and the second connection holes extend in the first direction, or one of the first connection holes and the second connection holes extends in the first direction and the other extends in the second direction.

6. The wafer boat carrier according to claim 5, wherein the second connecting holes are plural, and the plural second connecting holes are spaced along the first direction, and/or the plural second connecting holes are spaced along the second direction.

7. The wafer boat carrier of claim 1, further comprising a connecting platform connected between the two carrier plates of the two carrier units.

8. The wafer boat carrier of claim 7, further comprising a driving mechanism coupled to a side of the connection platform facing away from the wafer boat in a third direction, the third direction being perpendicular to both the first direction and the second direction.

9. The wafer boat carrying apparatus according to claim 1, wherein a plurality of yielding portions are further formed on the carrier plate, at least one of the yielding portions is located on a side of the carrier plate away from the limiting plate along the second direction, and at least two of the yielding portions are disposed on two opposite sides of the carrier plate along the first direction.

10. A wafer processing system, comprising:

a wafer boat for accommodating wafers;

the substrate boat carrier of any one of claims 1 to 9, wherein said substrate boat carrier is adapted to carry said substrate boat.