SG11201509689YA - Method of producing polishing head and polishing apparatus - Google Patents

Method of producing polishing head and polishing apparatus

Info

Publication number
SG11201509689YA
SG11201509689YA SG11201509689YA SG11201509689YA SG11201509689YA SG 11201509689Y A SG11201509689Y A SG 11201509689YA SG 11201509689Y A SG11201509689Y A SG 11201509689YA SG 11201509689Y A SG11201509689Y A SG 11201509689YA SG 11201509689Y A SG11201509689Y A SG 11201509689YA
Authority
SG
Singapore
Prior art keywords
polishing
producing
head
polishing apparatus
polishing head
Prior art date
Application number
SG11201509689YA
Inventor
Hiromasa Hashimoto
Yasuharu Ariga
Masanao Sasaki
Takahiro Matsuda
Original Assignee
Shinetsu Handotai Kk
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk, Shinetsu Eng Co Ltd filed Critical Shinetsu Handotai Kk
Publication of SG11201509689YA publication Critical patent/SG11201509689YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201509689YA 2013-06-04 2014-05-12 Method of producing polishing head and polishing apparatus SG11201509689YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013118245A JP5955271B2 (en) 2013-06-04 2013-06-04 Manufacturing method of polishing head
PCT/JP2014/002487 WO2014196128A1 (en) 2013-06-04 2014-05-12 Method for manufacturing polishing head, and polishing device

Publications (1)

Publication Number Publication Date
SG11201509689YA true SG11201509689YA (en) 2015-12-30

Family

ID=52007789

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509689YA SG11201509689YA (en) 2013-06-04 2014-05-12 Method of producing polishing head and polishing apparatus

Country Status (8)

Country Link
US (1) US10293460B2 (en)
JP (1) JP5955271B2 (en)
KR (1) KR102211562B1 (en)
CN (1) CN105358291B (en)
DE (1) DE112014002285T5 (en)
SG (1) SG11201509689YA (en)
TW (1) TWI618603B (en)
WO (1) WO2014196128A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6508123B2 (en) 2016-05-13 2019-05-08 信越半導体株式会社 Method of sorting template assembly, method of polishing workpiece and template assembly
JP6705362B2 (en) * 2016-10-25 2020-06-03 信越半導体株式会社 Polishing head and polishing device
JP7046495B2 (en) * 2017-03-27 2022-04-04 富士紡ホールディングス株式会社 Holder and method of manufacturing the holder
JP2019058955A (en) * 2017-09-22 2019-04-18 信越半導体株式会社 Polishing head and manufacturing method of the same
JP7130323B2 (en) * 2018-05-14 2022-09-05 株式会社ディスコ Wafer processing method
JP7070502B2 (en) * 2019-05-16 2022-05-18 信越半導体株式会社 How to select measuring device and polishing head and how to polish wafer
JP7372107B2 (en) * 2019-10-15 2023-10-31 株式会社岡本工作機械製作所 Wafer polishing head
CN112428165B (en) * 2020-10-22 2021-10-22 德阳展源新材料科技有限公司 Preparation method of damping cloth polishing pad
TWI741866B (en) * 2020-11-06 2021-10-01 環球晶圓股份有限公司 Device for pasting wafer template and operation method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569310A (en) 1991-04-23 1993-03-23 Mitsubishi Materials Corp Device for grinding mirror surface of wafer
JP3846007B2 (en) * 1998-01-30 2006-11-15 株式会社Ｓｕｍｃｏ Wafer vacuum bonding equipment
JP3607143B2 (en) * 1999-11-19 2005-01-05 株式会社タカトリ Method and apparatus for attaching protective tape to semiconductor wafer
WO2002056352A1 (en) * 2001-01-15 2002-07-18 Lintec Corporation Bonding apparatus, and bonding method
TWI299353B (en) * 2001-08-03 2008-08-01 Sekisui Chemical Co Ltd Pressure sensitive adhesive double coated tape and method for producing ic chip using it
JP2004063880A (en) * 2002-07-30 2004-02-26 Komatsu Electronic Metals Co Ltd Wafer-bonding apparatus and wafer-bonding method
JP2005007521A (en) * 2003-06-19 2005-01-13 Okamoto Machine Tool Works Ltd Backing material for holding substrate, and substrate carrier in polishing device
JP4612453B2 (en) * 2005-03-30 2011-01-12 株式会社タカトリ Method and apparatus for applying tape to wafer
JP2007123670A (en) * 2005-10-31 2007-05-17 Kemet Japan Co Ltd Attachment method and attachment device
JP2007266068A (en) * 2006-03-27 2007-10-11 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Polishing method and device
JP2009233763A (en) * 2008-03-26 2009-10-15 Panasonic Corp Method of fixing crystal substrate
US8636561B2 (en) 2008-08-29 2014-01-28 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing apparatus
JP2010247254A (en) * 2009-04-13 2010-11-04 Shin Etsu Handotai Co Ltd Method of preparing polishing head and polishing apparatus
JP2010253756A (en) * 2009-04-23 2010-11-11 Toppan Printing Co Ltd Decorative member
JP5339550B2 (en) * 2011-11-10 2013-11-13 株式会社名機製作所 Vacuum lamination system and vacuum lamination molding method

Also Published As

Publication number Publication date
KR20160015238A (en) 2016-02-12
TWI618603B (en) 2018-03-21
TW201520000A (en) 2015-06-01
WO2014196128A1 (en) 2014-12-11
JP2014233815A (en) 2014-12-15
CN105358291B (en) 2017-06-16
KR102211562B1 (en) 2021-02-03
CN105358291A (en) 2016-02-24
DE112014002285T5 (en) 2016-01-21
US20160101503A1 (en) 2016-04-14
US10293460B2 (en) 2019-05-21
JP5955271B2 (en) 2016-07-20

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