SG11201505037VA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11201505037VA SG11201505037VA SG11201505037VA SG11201505037VA SG11201505037VA SG 11201505037V A SG11201505037V A SG 11201505037VA SG 11201505037V A SG11201505037V A SG 11201505037VA SG 11201505037V A SG11201505037V A SG 11201505037VA SG 11201505037V A SG11201505037V A SG 11201505037VA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012288415A JP6057706B2 (ja) | 2012-12-28 | 2012-12-28 | 研磨用組成物 |
PCT/JP2013/078968 WO2014103494A1 (ja) | 2012-12-28 | 2013-10-25 | 研磨用組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201505037VA true SG11201505037VA (en) | 2015-07-30 |
Family
ID=51020593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201505037VA SG11201505037VA (en) | 2012-12-28 | 2013-10-25 | Polishing composition |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150322294A1 (ja) |
JP (1) | JP6057706B2 (ja) |
KR (1) | KR102154512B1 (ja) |
SG (1) | SG11201505037VA (ja) |
TW (1) | TWI592471B (ja) |
WO (1) | WO2014103494A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016056254A (ja) * | 2014-09-08 | 2016-04-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
WO2016102279A1 (en) * | 2014-12-22 | 2016-06-30 | Basf Se | Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt and / or co-balt alloy comprising substrates |
US9528030B1 (en) * | 2015-10-21 | 2016-12-27 | Cabot Microelectronics Corporation | Cobalt inhibitor combination for improved dishing |
KR101833219B1 (ko) * | 2016-08-05 | 2018-04-13 | 주식회사 케이씨텍 | 텅스텐 베리어층 연마용 슬러리 조성물 |
JP6819280B2 (ja) * | 2016-12-27 | 2021-01-27 | Jsr株式会社 | 化学機械研磨用組成物および化学機械研磨方法 |
JP6841166B2 (ja) * | 2017-06-09 | 2021-03-10 | 堺化学工業株式会社 | フェニルアルコキシシラン処理シリカの製造方法 |
CN109096990A (zh) | 2017-06-21 | 2018-12-28 | 圣戈本陶瓷及塑料股份有限公司 | 表面改性的研磨颗粒、研磨制品以及其形成方法 |
US10647887B2 (en) | 2018-01-08 | 2020-05-12 | Cabot Microelectronics Corporation | Tungsten buff polishing compositions with improved topography |
SG11202008551VA (en) * | 2018-03-15 | 2020-10-29 | Nitta Dupont Incorporated | Polishing composition |
US20200172759A1 (en) * | 2018-12-04 | 2020-06-04 | Cabot Microelectronics Corporation | Composition and method for cobalt cmp |
US10968366B2 (en) * | 2018-12-04 | 2021-04-06 | Cmc Materials, Inc. | Composition and method for metal CMP |
KR102619857B1 (ko) * | 2020-05-20 | 2023-12-29 | 삼성에스디아이 주식회사 | 텅스텐 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 연마 방법 |
JP6958774B1 (ja) * | 2020-06-30 | 2021-11-02 | Jsr株式会社 | 砥粒の製造方法、化学機械研磨用組成物及び化学機械研磨方法 |
KR102577164B1 (ko) * | 2020-12-29 | 2023-09-08 | 에스케이엔펄스 주식회사 | 반도체 공정용 연마 조성물 및 연마 조성물을 적용한 기판의 연마방법 |
KR20230106938A (ko) | 2022-01-07 | 2023-07-14 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100590665B1 (ko) * | 1999-07-07 | 2006-06-19 | 캐보트 마이크로일렉트로닉스 코포레이션 | 실란으로 개질된 연마제 입자를 함유하는 cmp 조성물 |
JP4521058B2 (ja) * | 2008-03-24 | 2010-08-11 | 株式会社Adeka | 表面改質コロイダルシリカおよびこれを含有するcmp用研磨組成物 |
CN102741985B (zh) * | 2010-02-01 | 2015-12-16 | Jsr株式会社 | 化学机械研磨用水系分散体及利用其的化学机械研磨方法 |
JP5774283B2 (ja) * | 2010-04-08 | 2015-09-09 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
JP5141792B2 (ja) * | 2010-06-29 | 2013-02-13 | 日立化成工業株式会社 | Cmp研磨液及び研磨方法 |
SG10201604609WA (en) * | 2011-06-14 | 2016-07-28 | Fujimi Inc | Polishing Composition |
-
2012
- 2012-12-28 JP JP2012288415A patent/JP6057706B2/ja active Active
-
2013
- 2013-10-25 WO PCT/JP2013/078968 patent/WO2014103494A1/ja active Application Filing
- 2013-10-25 KR KR1020157016607A patent/KR102154512B1/ko active IP Right Grant
- 2013-10-25 US US14/655,597 patent/US20150322294A1/en not_active Abandoned
- 2013-10-25 SG SG11201505037VA patent/SG11201505037VA/en unknown
- 2013-11-07 TW TW102140486A patent/TWI592471B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102154512B1 (ko) | 2020-09-10 |
KR20150102990A (ko) | 2015-09-09 |
TWI592471B (zh) | 2017-07-21 |
JP2014130944A (ja) | 2014-07-10 |
TW201430115A (zh) | 2014-08-01 |
US20150322294A1 (en) | 2015-11-12 |
JP6057706B2 (ja) | 2017-01-11 |
WO2014103494A1 (ja) | 2014-07-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201502768UA (en) | Polishing composition | |
SG11201503355WA (en) | Polishing composition | |
SG11201403552SA (en) | Polishing composition | |
SG11201503751TA (en) | Polishing composition | |
SG10201604609WA (en) | Polishing Composition | |
SG11201505037VA (en) | Polishing composition | |
SG11201502766QA (en) | Polishing composition | |
SG11201501849RA (en) | Polishing composition | |
GB201217441D0 (en) | Composition | |
EP2777878A4 (en) | POLISHING COMPOSITION | |
GB201200707D0 (en) | Composition | |
EP2915859A4 (en) | POLISHING COMPOSITION | |
EP2878295A4 (en) | COMPOSITION | |
GB201218954D0 (en) | Composition | |
GB201222275D0 (en) | Composition | |
GB201219657D0 (en) | Composition | |
EP2837670A4 (en) | COMPOSITION CONTAINING FLUOROBIPHENYL | |
GB201206035D0 (en) | Composition | |
EP2910538A4 (en) | AGENT COMPOSITION GENERATING GAS | |
EP2910537A4 (en) | AGENT COMPOSITION GENERATING GAS | |
GB201209597D0 (en) | Composition | |
GB201208133D0 (en) | Composition | |
GB201219383D0 (en) | Composition | |
GB201218195D0 (en) | Composition | |
SG11201402486TA (en) | Polishing composition |