SG11201504609TA - Method of resuming operation of wire saw - Google Patents

Method of resuming operation of wire saw

Info

Publication number
SG11201504609TA
SG11201504609TA SG11201504609TA SG11201504609TA SG11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA
Authority
SG
Singapore
Prior art keywords
wire saw
resuming operation
resuming
saw
wire
Prior art date
Application number
SG11201504609TA
Other languages
English (en)
Inventor
Atsuo Uchiyama
Hisakazu Takano
Hitoshi Sejimo
Yukio Hijirisawa
Daisuke Nakamata
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201504609TA publication Critical patent/SG11201504609TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG11201504609TA 2013-01-10 2013-12-06 Method of resuming operation of wire saw SG11201504609TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013002421A JP5791642B2 (ja) 2013-01-10 2013-01-10 ワイヤソーの運転再開方法
PCT/JP2013/007181 WO2014108956A1 (ja) 2013-01-10 2013-12-06 ワイヤソーの運転再開方法

Publications (1)

Publication Number Publication Date
SG11201504609TA true SG11201504609TA (en) 2015-07-30

Family

ID=51166636

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504609TA SG11201504609TA (en) 2013-01-10 2013-12-06 Method of resuming operation of wire saw

Country Status (8)

Country Link
US (1) US9662805B2 (ja)
JP (1) JP5791642B2 (ja)
KR (1) KR101954431B1 (ja)
CN (1) CN104918749B (ja)
DE (1) DE112013005965B4 (ja)
SG (1) SG11201504609TA (ja)
TW (1) TWI552844B (ja)
WO (1) WO2014108956A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012221904B4 (de) * 2012-11-29 2018-05-30 Siltronic Ag Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
WO2016095971A1 (en) * 2014-12-16 2016-06-23 APPLIED MATERIALS SWITZERLAND SàRL Method for wire refurbishment, wire and wire saw
CN104827593A (zh) * 2015-04-03 2015-08-12 无锡荣能半导体材料有限公司 多晶硅棒的断线处理方法
CN106584687A (zh) * 2015-10-16 2017-04-26 西安中晶半导体材料有限公司 一种单晶硅片切割装置及方法
CN105619628B (zh) * 2016-02-18 2017-11-17 安徽旭能电力股份有限公司 一种双面玻璃晶体硅片加工切割装置
DE102016211883B4 (de) * 2016-06-30 2018-02-08 Siltronic Ag Verfahren und Vorrichtung zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
JP6693460B2 (ja) * 2017-04-04 2020-05-13 信越半導体株式会社 ワークの切断方法
CN108162214B (zh) * 2017-12-21 2019-11-26 英利能源（中国）有限公司 一种金钢线硅片切割方法
CN108556160B (zh) * 2018-01-30 2020-04-03 英利能源（中国）有限公司 金刚线切割硅片断线入刀方法
JP7372097B2 (ja) * 2019-09-20 2023-10-31 コマツＮｔｃ株式会社 ワイヤソー及びワイヤソーのワークの搬入出方法
TWI811632B (zh) * 2021-02-08 2023-08-11 環球晶圓股份有限公司 晶棒切片方法
CN114986729B (zh) * 2022-07-18 2023-09-05 江苏美科太阳能科技股份有限公司 一种单晶切割断线处理的方法
CN116922594B (zh) * 2023-07-18 2024-04-02 江苏双晶新能源科技有限公司 一种晶硅切片降低断线后焊线造成色差的切割方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2158830A (en) * 1938-02-18 1939-05-16 John B Newsom Wire sawing
US3478732A (en) * 1967-03-15 1969-11-18 David J Clark Wire saw drum
JPH0790545B2 (ja) * 1990-12-19 1995-10-04 大阪ダイヤモンド工業株式会社 ワイヤーソーによる切断方法
JPH10249701A (ja) 1997-03-17 1998-09-22 Super Silicon Kenkyusho:Kk インゴットのワイヤソー切断方法及び装置
US6279564B1 (en) * 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JP2002256391A (ja) 2001-02-28 2002-09-11 Kawasaki Steel Corp ワイヤソー用鋼線およびその製造方法
JP2006123055A (ja) * 2004-10-28 2006-05-18 Allied Material Corp 超砥粒ワイヤソーによる加工材の切断方法および超砥粒ワイヤソーにより切断加工された加工材
JP5003294B2 (ja) * 2007-06-08 2012-08-15 信越半導体株式会社 切断方法
JP2010029955A (ja) 2008-07-25 2010-02-12 Shin Etsu Handotai Co Ltd ワイヤソーの運転再開方法及びワイヤソー
JP2010069607A (ja) * 2008-09-22 2010-04-02 Kanai Hiroaki ソーワイヤ再生方法
JP5373502B2 (ja) 2009-08-04 2013-12-18 三菱電機株式会社 マルチワイヤソーのワイヤ断線予防装置
CN103052468B (zh) 2010-09-27 2015-07-08 小松Ntc株式会社 用于检测线锯中的断线的方法和设备
JP5494558B2 (ja) * 2011-04-20 2014-05-14 信越半導体株式会社 ワイヤソーの運転再開方法及びワイヤソー
JP5733120B2 (ja) * 2011-09-09 2015-06-10 住友電気工業株式会社 ソーワイヤおよびそれを用いたｉｉｉ族窒化物結晶基板の製造方法
CN102343632B (zh) 2011-09-29 2015-09-16 中国电子科技集团公司第四十五研究所 一种硅片多线切割断线检测的方法
DE102012221904B4 (de) * 2012-11-29 2018-05-30 Siltronic Ag Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung

Also Published As

Publication number Publication date
CN104918749B (zh) 2017-04-26
TW201440985A (zh) 2014-11-01
JP2014133282A (ja) 2014-07-24
KR20150105324A (ko) 2015-09-16
CN104918749A (zh) 2015-09-16
DE112013005965B4 (de) 2021-12-09
DE112013005965T5 (de) 2015-10-01
JP5791642B2 (ja) 2015-10-07
TWI552844B (zh) 2016-10-11
US9662805B2 (en) 2017-05-30
KR101954431B1 (ko) 2019-03-05
US20150328800A1 (en) 2015-11-19
WO2014108956A1 (ja) 2014-07-17

Similar Documents

Publication Publication Date Title
SG11201504609TA (en) Method of resuming operation of wire saw
GB201314695D0 (en) Method
GB201318465D0 (en) Method
GB201309057D0 (en) Method
GB201316744D0 (en) Method
GB201309928D0 (en) Method
GB201316849D0 (en) Method
PT2837678T (pt) Processo melhorado de extração de gorduras
GB201313249D0 (en) Method
GB201309654D0 (en) Method
GB201305714D0 (en) Method
GB201301233D0 (en) Method
GB201300409D0 (en) Method
SG11201504210SA (en) Resin-bond wire saw
GB201301094D0 (en) Method
GB201314054D0 (en) Method
GB201312609D0 (en) Method
GB201311389D0 (en) Method
GB201312045D0 (en) New Method
GB201318490D0 (en) Method
GB201317970D0 (en) Method
GB201317826D0 (en) Method
GB201316878D0 (en) Method
GB201316321D0 (en) Method
GB201314332D0 (en) Method