SG11201504609TA - Method of resuming operation of wire saw - Google Patents

Method of resuming operation of wire saw

Info

Publication number
SG11201504609TA
SG11201504609TA SG11201504609TA SG11201504609TA SG11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA SG 11201504609T A SG11201504609T A SG 11201504609TA
Authority
SG
Singapore
Prior art keywords
wire saw
resuming operation
resuming
saw
wire
Prior art date
Application number
SG11201504609TA
Inventor
Atsuo Uchiyama
Hisakazu Takano
Hitoshi Sejimo
Yukio Hijirisawa
Daisuke Nakamata
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201504609TA publication Critical patent/SG11201504609TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG11201504609TA 2013-01-10 2013-12-06 Method of resuming operation of wire saw SG11201504609TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013002421A JP5791642B2 (en) 2013-01-10 2013-01-10 How to resume wire saw operation
PCT/JP2013/007181 WO2014108956A1 (en) 2013-01-10 2013-12-06 Method for resuming wire saw operation

Publications (1)

Publication Number Publication Date
SG11201504609TA true SG11201504609TA (en) 2015-07-30

Family

ID=51166636

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504609TA SG11201504609TA (en) 2013-01-10 2013-12-06 Method of resuming operation of wire saw

Country Status (8)

Country Link
US (1) US9662805B2 (en)
JP (1) JP5791642B2 (en)
KR (1) KR101954431B1 (en)
CN (1) CN104918749B (en)
DE (1) DE112013005965B4 (en)
SG (1) SG11201504609TA (en)
TW (1) TWI552844B (en)
WO (1) WO2014108956A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012221904B4 (en) * 2012-11-29 2018-05-30 Siltronic Ag A method of resuming the wire sawing process of a workpiece after an unscheduled interruption
WO2016095971A1 (en) * 2014-12-16 2016-06-23 APPLIED MATERIALS SWITZERLAND SàRL Method for wire refurbishment, wire and wire saw
CN104827593A (en) * 2015-04-03 2015-08-12 无锡荣能半导体材料有限公司 Break line treatment method of polycrystalline silicon rod
CN106584687A (en) * 2015-10-16 2017-04-26 西安中晶半导体材料有限公司 Monocrystalline silicon wafer cutting device and method
CN105619628B (en) * 2016-02-18 2017-11-17 安徽旭能电力股份有限公司 A kind of double-side silicon-glass piece processes cutter device
DE102016211883B4 (en) * 2016-06-30 2018-02-08 Siltronic Ag Method and apparatus for resuming the wire sawing process of a workpiece after an unscheduled interruption
JP6693460B2 (en) * 2017-04-04 2020-05-13 信越半導体株式会社 Work cutting method
CN108162214B (en) * 2017-12-21 2019-11-26 英利能源（中国）有限公司 A kind of gold steel wire method for cutting silicon chips
CN108556160B (en) * 2018-01-30 2020-04-03 英利能源（中国）有限公司 Wire breaking and knife entering method for silicon wafer cut by diamond wire
JP7372097B2 (en) * 2019-09-20 2023-10-31 コマツＮｔｃ株式会社 How to load and unload wire saws and wire saw workpieces
TWI811632B (en) * 2021-02-08 2023-08-11 環球晶圓股份有限公司 Method of slicing ingot
CN114986729B (en) * 2022-07-18 2023-09-05 江苏美科太阳能科技股份有限公司 Method for single crystal cutting and wire breaking treatment
CN116922594B (en) * 2023-07-18 2024-04-02 江苏双晶新能源科技有限公司 Cutting method for reducing chromatic aberration caused by bonding wires after breakage of crystalline silicon slice

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2158830A (en) * 1938-02-18 1939-05-16 John B Newsom Wire sawing
US3478732A (en) * 1967-03-15 1969-11-18 David J Clark Wire saw drum
JPH0790545B2 (en) * 1990-12-19 1995-10-04 大阪ダイヤモンド工業株式会社 Cutting method with wire saw
JPH10249701A (en) 1997-03-17 1998-09-22 Super Silicon Kenkyusho:Kk Wire saw cutting method and device for ingot
US6279564B1 (en) * 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JP2002256391A (en) 2001-02-28 2002-09-11 Kawasaki Steel Corp Steel wire for wire saw and production method therefor
JP2006123055A (en) * 2004-10-28 2006-05-18 Allied Material Corp Method of cutting work material with super-abrasive grain wire saw, and work material cut with super-abrasive grain wire saw
JP5003294B2 (en) * 2007-06-08 2012-08-15 信越半導体株式会社 Cutting method
JP2010029955A (en) 2008-07-25 2010-02-12 Shin Etsu Handotai Co Ltd Method for resuming operation of wire saw and wire saw
JP2010069607A (en) * 2008-09-22 2010-04-02 Kanai Hiroaki Saw wire reproducing method
JP5373502B2 (en) 2009-08-04 2013-12-18 三菱電機株式会社 Multi-wire saw wire breakage prevention device
CN103052468B (en) 2010-09-27 2015-07-08 小松Ntc株式会社 Method and apparatus for detecting wire break of wire saw
JP5494558B2 (en) * 2011-04-20 2014-05-14 信越半導体株式会社 Method for resuming operation of wire saw and wire saw
JP5733120B2 (en) * 2011-09-09 2015-06-10 住友電気工業株式会社 Saw wire and method for producing group III nitride crystal substrate using the same
CN102343632B (en) 2011-09-29 2015-09-16 中国电子科技集团公司第四十五研究所 A kind of method of Multi-wire wafer cutting burn out detection
DE102012221904B4 (en) * 2012-11-29 2018-05-30 Siltronic Ag A method of resuming the wire sawing process of a workpiece after an unscheduled interruption

Also Published As

Publication number Publication date
CN104918749B (en) 2017-04-26
TW201440985A (en) 2014-11-01
JP2014133282A (en) 2014-07-24
KR20150105324A (en) 2015-09-16
CN104918749A (en) 2015-09-16
DE112013005965B4 (en) 2021-12-09
DE112013005965T5 (en) 2015-10-01
JP5791642B2 (en) 2015-10-07
TWI552844B (en) 2016-10-11
US9662805B2 (en) 2017-05-30
KR101954431B1 (en) 2019-03-05
US20150328800A1 (en) 2015-11-19
WO2014108956A1 (en) 2014-07-17

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