SG11201503597PA - Multilayer polishing pad - Google Patents

Multilayer polishing pad

Info

Publication number
SG11201503597PA
SG11201503597PA SG11201503597PA SG11201503597PA SG11201503597PA SG 11201503597P A SG11201503597P A SG 11201503597PA SG 11201503597P A SG11201503597P A SG 11201503597PA SG 11201503597P A SG11201503597P A SG 11201503597PA SG 11201503597P A SG11201503597P A SG 11201503597PA
Authority
SG
Singapore
Prior art keywords
polishing pad
multilayer polishing
multilayer
pad
polishing
Prior art date
Application number
SG11201503597PA
Other languages
English (en)
Inventor
Atsushi Kazuno
Original Assignee
Toyo Tire & Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire & Rubber Co filed Critical Toyo Tire & Rubber Co
Publication of SG11201503597PA publication Critical patent/SG11201503597PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201503597PA 2012-11-08 2013-10-16 Multilayer polishing pad SG11201503597PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012246403A JP2014094424A (ja) 2012-11-08 2012-11-08 積層研磨パッド
PCT/JP2013/078092 WO2014073344A1 (ja) 2012-11-08 2013-10-16 積層研磨パッド

Publications (1)

Publication Number Publication Date
SG11201503597PA true SG11201503597PA (en) 2015-06-29

Family

ID=50684456

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503597PA SG11201503597PA (en) 2012-11-08 2013-10-16 Multilayer polishing pad

Country Status (7)

Country Link
US (1) US20150298285A1 (zh)
JP (1) JP2014094424A (zh)
KR (1) KR20150055047A (zh)
CN (1) CN104755227A (zh)
SG (1) SG11201503597PA (zh)
TW (1) TW201429618A (zh)
WO (1) WO2014073344A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016047451A1 (ja) * 2014-09-24 2016-03-31 東洋ゴム工業株式会社 研磨パッド
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
KR102577033B1 (ko) * 2016-02-16 2023-09-12 신에쯔 한도타이 가부시키가이샤 양면연마방법 및 양면연마장치
CN106903596B (zh) * 2017-01-23 2018-06-19 安徽禾臣新材料有限公司 Tft减薄抛光用吸附垫
KR101945869B1 (ko) 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
CN112757153B (zh) * 2021-03-09 2022-07-12 万华化学集团电子材料有限公司 一种多结构体化学机械抛光垫、制造方法及其应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004028744A1 (en) * 2002-09-25 2004-04-08 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US7549914B2 (en) * 2005-09-28 2009-06-23 Diamex International Corporation Polishing system
JP5255286B2 (ja) * 2008-01-25 2013-08-07 東洋ゴム工業株式会社 研磨パッド
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド

Also Published As

Publication number Publication date
US20150298285A1 (en) 2015-10-22
TW201429618A (zh) 2014-08-01
JP2014094424A (ja) 2014-05-22
KR20150055047A (ko) 2015-05-20
CN104755227A (zh) 2015-07-01
WO2014073344A1 (ja) 2014-05-15

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