SG11201404143SA - Method for producing laminated polishing pad - Google Patents

Method for producing laminated polishing pad

Info

Publication number
SG11201404143SA
SG11201404143SA SG11201404143SA SG11201404143SA SG11201404143SA SG 11201404143S A SG11201404143S A SG 11201404143SA SG 11201404143S A SG11201404143S A SG 11201404143SA SG 11201404143S A SG11201404143S A SG 11201404143SA SG 11201404143S A SG11201404143S A SG 11201404143SA
Authority
SG
Singapore
Prior art keywords
polishing pad
producing laminated
laminated polishing
producing
pad
Prior art date
Application number
SG11201404143SA
Inventor
Yoshiyuki Nakai
Original Assignee
Toyo Tire & Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire & Rubber Co filed Critical Toyo Tire & Rubber Co
Publication of SG11201404143SA publication Critical patent/SG11201404143SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/008—Finishing manufactured abrasive sheets, e.g. cutting, deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG11201404143SA 2012-01-17 2013-01-09 Method for producing laminated polishing pad SG11201404143SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012007220A JP5893413B2 (en) 2012-01-17 2012-01-17 Manufacturing method of laminated polishing pad
PCT/JP2013/050236 WO2013108694A1 (en) 2012-01-17 2013-01-09 Method for producing laminated polishing pad

Publications (1)

Publication Number Publication Date
SG11201404143SA true SG11201404143SA (en) 2014-10-30

Family

ID=48799120

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404143SA SG11201404143SA (en) 2012-01-17 2013-01-09 Method for producing laminated polishing pad

Country Status (7)

Country Link
US (1) US9457452B2 (en)
JP (1) JP5893413B2 (en)
KR (1) KR101641152B1 (en)
CN (1) CN103987494A (en)
SG (1) SG11201404143SA (en)
TW (1) TWI510329B (en)
WO (1) WO2013108694A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202011104832U1 (en) * 2011-08-25 2011-10-31 Charlott Produkte Dr. Rauwald Gmbh Scouring pad with a composite resin as wear layer
KR102440303B1 (en) * 2014-05-07 2022-09-05 씨엠씨 머티리얼즈, 인코포레이티드 Multi-layer polishing pad for cmp
TWI626117B (en) * 2017-01-19 2018-06-11 智勝科技股份有限公司 Polishing pad and polishing method
KR102202076B1 (en) * 2018-12-26 2021-01-12 에스케이씨 주식회사 Composition for polishing pad, polishing pad and preparation method thereof
TWI743831B (en) * 2019-06-17 2021-10-21 南韓商Ｓｋｃ索密思股份有限公司 Composition for polishing pad, polishing pad and preparation method of semiconductor device
JP3225815U (en) * 2020-01-27 2020-04-02 丸石産業株式会社 Polishing pad of two-layer structure made of non-woven fabric
KR102512675B1 (en) * 2020-12-30 2023-03-21 에스케이엔펄스 주식회사 Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same
CN113334243B (en) * 2021-06-03 2023-03-31 万华化学集团电子材料有限公司 Chemical mechanical polishing pad, preparation method and application thereof
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327779A (en) * 2003-04-25 2004-11-18 Toray Ind Inc Polishing pad, polishing apparatus, and manufacturing method of semiconductor device
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7101275B2 (en) * 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US7160413B2 (en) * 2004-01-09 2007-01-09 Mipox International Corporation Layered support and method for laminating CMP pads
JP3769581B1 (en) * 2005-05-18 2006-04-26 東洋ゴム工業株式会社 Polishing pad and manufacturing method thereof
JP2006265410A (en) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd Double sided-adhesive tape for multilayer polishing pad and preparation process for multilayer polishing pad
JP4859109B2 (en) * 2006-03-27 2012-01-25 東洋ゴム工業株式会社 Polishing pad manufacturing method
JP5315678B2 (en) * 2007-03-30 2013-10-16 東レ株式会社 Polishing pad manufacturing method
US20080274674A1 (en) 2007-05-03 2008-11-06 Cabot Microelectronics Corporation Stacked polishing pad for high temperature applications
JP5087420B2 (en) * 2008-02-13 2012-12-05 東洋ゴム工業株式会社 Polishing pad manufacturing method and manufacturing apparatus, polishing pad, and semiconductor device manufacturing method using the polishing pad
US20110045753A1 (en) * 2008-05-16 2011-02-24 Toray Industries, Inc. Polishing pad
US7820005B2 (en) * 2008-07-18 2010-10-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad manufacturing process
JP2011115935A (en) * 2009-10-30 2011-06-16 Toray Ind Inc Polishing pad and method for manufacturing polishing pad
CN102639260B (en) 2009-11-24 2015-04-15 住友电气工业株式会社 Magnesium alloy coiled material
EP2517828A1 (en) 2009-12-22 2012-10-31 JSR Corporation Pad for chemical mechanical polishing and method of chemical mechanical polishing using same
JP2011151352A (en) * 2009-12-24 2011-08-04 Jsr Corp Chemical mechanical polishing pad and chemical mechanical polishing method using the same

Also Published As

Publication number Publication date
TW201343327A (en) 2013-11-01
WO2013108694A1 (en) 2013-07-25
JP2013146801A (en) 2013-08-01
JP5893413B2 (en) 2016-03-23
CN103987494A (en) 2014-08-13
KR101641152B1 (en) 2016-07-20
US9457452B2 (en) 2016-10-04
US20150004879A1 (en) 2015-01-01
TWI510329B (en) 2015-12-01
KR20140062164A (en) 2014-05-22

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